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Ask the Experts Member

Don Naugler

General Manager
VJ Technologies, Inc.

Don is the General Manager of VJ Technologies, Inc., a leading manufacturer of X-ray Inspection and Rework equipment for the electronics manufacturing industry. He has more than 20 years experience in development, manufacturing, and support of a wide range of capital equipment.

Don Naugler has submitted responses to the following questions.

Inspection for Hidden Solder Joints
X-ray is one of the better ways to inspect thru-hole solder joints. Using an off-axis view, one can identify hidden ...

Package-on-Package Rework
It is possible to rework the top component of a PoP stack. Care must be taken to prevent damage to ...

Is Rework Unacceptable?
Rework technology (equipment, processes, and materials) have come a long way in the last two decades. There are significant data ...

Intermittent BGA Test Problems
I expect the most likely cause to be open solder joints below the BGA device. Pressing down on top of ...

Long Term Concerns with Disturbed Solder Joints
The answer depends on the type of component, the severity of the disturbed joint, and the potential impact to adjacent ...

Reworked BGA component bridging at the ...
The bridged corners are likely caused by the CTE mismatch within the BGA body. Your rework profile must be too ...

Socket Rework Challenge
My recommendation comes in two parts. First is bottom heat. Localized heating from the top heater, and from the local ...

BGA Voids - Process Indicator or Reject
You are correct that the IPC standard and other literature do not present a definitive answer on when BGA voids ...

Pre-Bake Standard for Rework
Pre-bake prior to rework is highly recommended. This is especially the case for BGA and PTH, less so for SMT ...

BGA Rework - with or without solder paste
In most cases BGA rework can be achieved, and is often more reliable, without addition of solder paste (i.e., using ...

BGA re-balling process
VJ Electronix has not typically recommended re-balling BGA packages due to the stress induced to the package through multiple thermal ...

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