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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
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Outsourcing: A Risk You Can't Afford
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Sven Bock


Director of Quality / CLSSMBB
FCT Companies

Mr. Bock has worked in the Electronics Manufacturing Industry since 1996. He has extensive experience in the PCB manufacturing industry along with PCB Assembly. He has spent 6 years working in Southeast Asia.

Sven Bock has submitted responses to the following questions.
Solder Paste Print Test Boards
There is no good way to eliminate the use of a test board. If cost is an issue, you can ...
Depaneling circuit board that contain BGA components
The best method is UV Laser depanelization. ...
Pad Missing ENIG Plating
Firstly, the specification clearly states ENIG, unless there is a written deviation, using OSP to cover the pads that were ...
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Nordson-ASYMTEK

ASYMTEK Select Coat SL-1040
The SL-1040 Conformal Coating System upgrades the SL-940 and added significant system-level advancements to elevate automation, control, precision & preventative maintenance for better yield.
Nordson Electronics Solutions
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