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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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SEHO makes production lines smarter
Improve your work flow and reduce manufacturing costs with creative ideas and innovative solutions for automation, board handling and material management.
SEHO Systems GmbH
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Ask the Experts Member |
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Sven Bock
Director of Quality / CLSSMBB
FCT Companies
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Mr. Bock has worked in the Electronics Manufacturing Industry since 1996. He has extensive experience in the PCB manufacturing industry along with PCB Assembly. He has spent 6 years working in Southeast Asia.
Sven Bock has submitted responses to the following questions.
Pad Missing ENIG Plating
Firstly, the specification clearly states ENIG, unless there is a written deviation, using OSP to cover the pads that were ...
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Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
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