Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

Sponsor

Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Ask the Experts Member

Sven Bock

Director of Quality / CLSSMBB

FCT Companies

Mr. Bock has worked in the Electronics Manufacturing Industry since 1996. He has extensive experience in the PCB manufacturing industry along with PCB Assembly. He has spent 6 years working in Southeast Asia.

Sven Bock has submitted responses to the following questions.

Solder Paste Print Test Boards
There is no good way to eliminate the use of a test board. If cost is an issue, you can ...

Depaneling circuit board that contain BGA components
The best method is UV Laser depanelization.

Pad Missing ENIG Plating
Firstly, the specification clearly states ENIG, unless there is a written deviation, using OSP to cover the pads that were ...

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Sponsor

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Essential Guide for High-Reliability BGA Component Re-balling