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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process especially those with vacuum is challenging. ECD's M-VP sealed barrier can take it. Learn more.
ECD
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Ask the Experts Member |
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Sven Bock
Director of Quality / CLSSMBB
FCT Companies
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Mr. Bock has worked in the Electronics Manufacturing Industry since 1996. He has extensive experience in the PCB manufacturing industry along with PCB Assembly. He has spent 6 years working in Southeast Asia.
Sven Bock has submitted responses to the following questions.
Pad Missing ENIG Plating
Firstly, the specification clearly states ENIG, unless there is a written deviation, using OSP to cover the pads that were ...
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