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Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK

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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

Ask the Experts Member

Jonathan Wol

President
Pillarhouse USA, Inc.

Jonathan is president of Pillarhouse USA, a director of the Selective Soldering Academy and has 20+ years of selective soldering experience.

Jonathan Wol has submitted responses to the following questions.

Dust contamination after selective soldering
A rapid change in process performance could indicate a change in the equipment settings or process settings. Some selective systems ...

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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.