circuitnet
Sponsor
Viscom
Your Partner for All Inspection Tasks
AOI from Viscom for the Best Cycle times and Maximum Inspection Depth. See 3D AXI, 3D AOI and 3D MXI at IPC APEX EXPO. Visit booth 2820. March 18-20.
Viscom
Plasma Etch
Sponsor
Circuit Technology Center
Safely Remove Underfilled BGAs Without Damaging the Circuit Board
Learn how cold precision milling techniques enable the removal of underfilled BGAs while minimizing risk to components, circuit traces, and board integrity.
Circuit Technology Center

Ask the Experts Member

QUESTIONS
  
SUBMIT
  
MEMBERS
  
JOIN
Eric Camden

Eric Camden


Lead Investigator
Foresite, Inc
Eric has been in the electronics industry for over 14 years and manages the C3 technical user group, Failure Analysis project management, Rescue Cleaning Division and is one of three Lead Investigators at Foresite.

Eric Camden has submitted responses to the following questions.
QFN Test Failures Caused by Flux
This is most certainly a valid claim. The issue with processing QFNs, and other bottom terminated components, is the amount ...
Contamination Using Solvent Dispensers
Brush cleaning caused me to use the term "Contamination Relocation" because that is what happens more times than not. I ...
Rechecking Thermal Profiles
Periodic thermal profiling for each and every product built is very important. If any of the heating zones is not ...
Cleanliness After Coating Removal
The best way to determine cleanliness after a specific area rework process as you have described is with a localized ...
Dendritic Growth and Contamination at BGA Sites
If these boards are not considered to be "beyond repair" then yes they can be recovered. It would be of ...
Steam Cleaning PCB Assemblies
In fairness to the process, and in clear disagreement to other members of this panel, steam cleaning of assemblies is ...
Need for Reflow Profiles
Strongly disagree. While you may be able to lump some builds together by mass what you need to focus on ...
Cleaning No-clean Flux with Tap Water
It is rarely a good idea to do any cleaning of flux/process residues with tap only. As previously mentioned there ...
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
AIM Solder
Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Viscosity is a useful solder paste quality control measurement, but rheology provides a more complete understanding of how paste will roll, fill, release, recover, and remain stable during stencil printing.
AIM Solder
TLPS is proven for outstanding reliabiility #2