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Parasuraman Krishnan


Engineer, Process Development
Sanmina India Pvt ltd

Engineering and Management oriented manufacturing background with a dedicated career experience of 19+ years involved in New Product Introduction, Product Engineering & study, Process development, SMT Engineering, Process Engineering, Industrial Engineering, Project milestone planning, Mass production planning and migration, Program management, Product quality Assurance and Document control analysis.

Parasuraman Krishnan has submitted responses to the following questions.
Pad Missing ENIG Plating
Either replating with ENIG completely or which will give in assembly reflow profile. Same time those pads. Must be exposed ...
Tarnished OSP Circuit Boards
OSP point of view is easy to get tarnished. In this case need to check manufacturing date and when it's ...
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Electrically Conductive Die Attach Epoxy
Master Bond EP17HTS-DA is a silver filled, die attach adhesive that withstands high temperatures and passes MIL-STD-883J thermal stability requirements.
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