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How to Simplify Solder Paste Printing
StikNPeel removable rework stencils simplifies selective printing of solder paste leaving no residue providing cleaner alternative to metal stencils.
BEST Inc.
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| Sponsor |
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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
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Ask the Experts Member |
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Parasuraman Krishnan
Engineer, Process Development
Sanmina India Pvt ltd
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Engineering and Management oriented manufacturing background with a dedicated career experience of 19+ years involved in New Product Introduction, Product Engineering & study, Process development, SMT Engineering, Process Engineering, Industrial Engineering, Project milestone planning, Mass production planning and migration, Program management, Product quality Assurance and Document control analysis.
Parasuraman Krishnan has submitted responses to the following questions.
Pad Missing ENIG Plating
Either replating with ENIG completely or which will give in assembly reflow profile.
Same time those pads. Must be exposed ...
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