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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

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Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
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Ask the Experts Member

Parasuraman Krishnan

Engineer, Process Development
Sanmina India Pvt ltd

Engineering and Management oriented manufacturing background with a dedicated career experience of 19+ years involved in New Product Introduction, Product Engineering & study, Process development, SMT Engineering, Process Engineering, Industrial Engineering, Project milestone planning, Mass production planning and migration, Program management, Product quality Assurance and Document control analysis.

Parasuraman Krishnan has submitted responses to the following questions.

Pad Missing ENIG Plating
Either replating with ENIG completely or which will give in assembly reflow profile. Same time those pads. Must be exposed ...

Tarnished OSP Circuit Boards
OSP point of view is easy to get tarnished. In this case need to check manufacturing date and when it's ...

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Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK