Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

Sponsor

Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Ask the Experts Member

Parasuraman Krishnan

Engineer, Process Development

Sanmina India Pvt ltd

Engineering and Management oriented manufacturing background with a dedicated career experience of 19+ years involved in New Product Introduction, Product Engineering & study, Process development, SMT Engineering, Process Engineering, Industrial Engineering, Project milestone planning, Mass production planning and migration, Program management, Product quality Assurance and Document control analysis.

Parasuraman Krishnan has submitted responses to the following questions.

Pad Missing ENIG Plating
Either replating with ENIG completely or which will give in assembly reflow profile. Same time those pads. Must be exposed ...

Tarnished OSP Circuit Boards
OSP point of view is easy to get tarnished. In this case need to check manufacturing date and when it's ...

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Essential Guide for High-Reliability BGA Component Re-balling