Sponsor

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS

Sponsor

Reduce Electronics Costs with Strategic Component Recovery
Recovering valuable electronic components can help manufacturers lower expenses, minimize waste, and extend the life of critical inventory. Learn practical methods.
Circuit Technology Center

Ask the Experts Member

Parasuraman Krishnan

Engineer, Process Development
Sanmina India Pvt ltd

Engineering and Management oriented manufacturing background with a dedicated career experience of 19+ years involved in New Product Introduction, Product Engineering & study, Process development, SMT Engineering, Process Engineering, Industrial Engineering, Project milestone planning, Mass production planning and migration, Program management, Product quality Assurance and Document control analysis.

Parasuraman Krishnan has submitted responses to the following questions.

Pad Missing ENIG Plating
Either replating with ENIG completely or which will give in assembly reflow profile. Same time those pads. Must be exposed ...

Tarnished OSP Circuit Boards
OSP point of view is easy to get tarnished. In this case need to check manufacturing date and when it's ...

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

What Would You Ask Proven Global Manufacturing Leaders?
In this 4-part series we asked about: Key Drivers of Success, Scaling Operations Effectively, AI in Manufacturing, and Tools to Empower Operations. No registration Required.
Intraratio