| Sponsor |
|
AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
|
|
| Sponsor |
|
Outsourcing: A Risk You Can't Afford
Stop risking delays, tariffs, and rising costs with overseas PCB assembly. Bring production in-house with Manncorp for speed, precision, and total control—future-secured.
Manncorp Inc.
|
|
Ask the Experts Member |
|
|
Parasuraman Krishnan
Engineer, Process Development
Sanmina India Pvt ltd
|
Engineering and Management oriented manufacturing background with a dedicated career experience of 19+ years involved in New Product Introduction, Product Engineering & study, Process development, SMT Engineering, Process Engineering, Industrial Engineering, Project milestone planning, Mass production planning and migration, Program management, Product quality Assurance and Document control analysis.
Parasuraman Krishnan has submitted responses to the following questions.
Pad Missing ENIG Plating
Either replating with ENIG completely or which will give in assembly reflow profile.
Same time those pads. Must be exposed ...
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
ASYMTEK Select Coat SL-1040
The SL-1040 Conformal Coating System upgrades the SL-940 and added significant system-level advancements to elevate automation, control, precision & preventative maintenance for better yield.
Nordson Electronics Solutions
|
|
|
