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Contaminant Removal with Plasma
Plasma provides organics removal and other benefits to increase bond strength! Many chamber sizes available, all with a low environmental impact. Learn more.
Plasma Etch

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Tech Paper - The Economics of Electronic Component Salvage and Reuse
This paper examines the economic and environmental benefits of salvaging and reusing high-value electronic components.
Circuit Technology Center

Ask the Experts Member

Parasuraman Krishnan

Engineer, Process Development
Sanmina India Pvt ltd

Engineering and Management oriented manufacturing background with a dedicated career experience of 19+ years involved in New Product Introduction, Product Engineering & study, Process development, SMT Engineering, Process Engineering, Industrial Engineering, Project milestone planning, Mass production planning and migration, Program management, Product quality Assurance and Document control analysis.

Parasuraman Krishnan has submitted responses to the following questions.

Pad Missing ENIG Plating
Either replating with ENIG completely or which will give in assembly reflow profile. Same time those pads. Must be exposed ...

Tarnished OSP Circuit Boards
OSP point of view is easy to get tarnished. In this case need to check manufacturing date and when it's ...

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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp