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AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives
240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity.
AI Technology, Inc.

Sponsor

Optically Clear Nanosilica Filled Epoxy
Master Bond EP4NS-80 is a low viscosity epoxy for bonding and sealing that possesses excellent dimensional stability, low CTE and minimal shrinkage upon curing.
Master Bond

Ask the Experts Member

Zhongwei Chen

Process Supervisor
NexPCB Co; Ltd

25 years experience in SMT/COB industry, 10 years in Optical film by Sputtering and Evaporation.

Zhongwei Chen has submitted responses to the following questions.

Controlling Creep Corrosion
Understanding the design failures or process amended method of exposed copper surfaces at the PCBA used in the High Saulty ...

T4 vs T5 Solder Paste Particle Size
Particle Size T5's "5 ball rule and AR of 066 (050) " is same as T4 particle. 5 ball is ...

Process Controls When Running Multiple Lines
What process controls are essential for ensuring consistency when multiple lines run the same assembly with slightly different equipment? PCBA: ...

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Sponsor

Is My PCB Wash Concentration in Check
Evaluating wash concentration levels through varying testing methods can potentially save process time, reduce overall process costs, and increase cleaning efficacy on PBCs. Read more.
KYZEN