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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
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Expert

Zhongwei Chen

Process Supervisor
NexPCB Co; Ltd
25 years experience in SMT/COB industry, 10 years in Optical film by Sputtering and Evaporation.

Zhongwei Chen has submitted responses to the following questions.
Controlling Creep Corrosion
Understanding the design failures or process amended method of exposed copper surfaces at the PCBA used in the High Saulty ...
Process Controls When Running Multiple Lines
What process controls are essential for ensuring consistency when multiple lines run the same assembly with slightly different equipment? PCBA: ...
T4 vs T5 Solder Paste Particle Size
Particle Size T5's "5 ball rule and AR of 066 (050) " is same as T4 particle. 5 ball is ...
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling