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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ÂșC
Ormet® TLPS
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Ask the Experts Member |
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Zhongwei Chen
Process Supervisor
NexPCB Co; Ltd
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25 years experience in SMT/COB industry, 10 years in Optical film by Sputtering and Evaporation.
Zhongwei Chen has submitted responses to the following questions.
Controlling Creep Corrosion
Understanding the design failures or process amended method of exposed copper surfaces at the PCBA used in the High Saulty ...
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