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Contaminant Removal with Plasma
Plasma provides organics removal and other benefits to increase bond strength! Many chamber sizes available, all with a low environmental impact. Learn more.
Plasma Etch

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Tech Paper - The Economics of Electronic Component Salvage and Reuse
This paper examines the economic and environmental benefits of salvaging and reusing high-value electronic components.
Circuit Technology Center

Ask the Experts Member

Zhongwei Chen

Process Supervisor
NexPCB Co; Ltd

25 years experience in SMT/COB industry, 10 years in Optical film by Sputtering and Evaporation.

Zhongwei Chen has submitted responses to the following questions.

Controlling Creep Corrosion
Understanding the design failures or process amended method of exposed copper surfaces at the PCBA used in the High Saulty ...

T4 vs T5 Solder Paste Particle Size
Particle Size T5's "5 ball rule and AR of 066 (050) " is same as T4 particle. 5 ball is ...

Process Controls When Running Multiple Lines
What process controls are essential for ensuring consistency when multiple lines run the same assembly with slightly different equipment? PCBA: ...

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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp