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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

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The Industry Standard Solder Paste
Looking to Avoid the Void® and enhance SIR performance? Indium8.9HF is your proven, versatile and stable, no-clean, halogen-free, Pb-free solder paste solution.
Indium Corporation

Ask the Experts Member

Zhongwei Chen

Process Supervisor
NexPCB Co; Ltd

25 years experience in SMT/COB industry, 10 years in Optical film by Sputtering and Evaporation.

Zhongwei Chen has submitted responses to the following questions.

Controlling Creep Corrosion
Understanding the design failures or process amended method of exposed copper surfaces at the PCBA used in the High Saulty ...

T4 vs T5 Solder Paste Particle Size
Particle Size T5's "5 ball rule and AR of 066 (050) " is same as T4 particle. 5 ball is ...

Process Controls When Running Multiple Lines
What process controls are essential for ensuring consistency when multiple lines run the same assembly with slightly different equipment? PCBA: ...

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Reclaim Your Factory's Future
Space is a precious resource. With SELECT Synchro, reclaim it, and reimagine your factory's workflow for greater efficiency and scalability.
Nordson Electronic Solutions