Sponsor

Your Partner for All Inspection Tasks
AOI from Viscom for the Best Cycle times and Maximum Inspection Depth. See 3D AXI, 3D AOI and 3D MXI at IPC APEX EXPO. Visit booth 2820. March 18-20.
Viscom

Sponsor

Safely Remove Underfilled BGAs Without Damaging the Circuit Board
Learn how cold precision milling techniques enable the removal of underfilled BGAs while minimizing risk to components, circuit traces, and board integrity.
Circuit Technology Center

Ask the Experts Member

Kathy Nargi-Toth

Director Quality and Technology
NCAB Group USA

Kathy has 30 years PCB expertise including R&D, engineering and technical marketing. Knowledge of PCB fabrication processes, laminates, plating finishes, and solder masks. Lean, Six-Sigma Black Belt Certified. IPC standards committee member, past chairmen Suppliers Council Leadership Subcommittee. Certified IPC Trainer.

Kathy Nargi-Toth has submitted responses to the following questions.

Bottom Terminated Components and Vias
The best solution is to fill the vias. Filled vias provide a planar surface that is easy to clean reducing ...

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Sponsor

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Viscosity is a useful solder paste quality control measurement, but rheology provides a more complete understanding of how paste will roll, fill, release, recover, and remain stable during stencil printing.
AIM Solder

TLPS is proven for outstanding reliabiility #2