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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
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Ask the Experts Member |
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Kathy Nargi-Toth
Director Quality and Technology
NCAB Group USA
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Kathy has 30 years PCB expertise including R&D, engineering and technical marketing. Knowledge of PCB fabrication processes, laminates, plating finishes, and solder masks. Lean, Six-Sigma Black Belt Certified. IPC standards committee member, past chairmen Suppliers Council Leadership Subcommittee. Certified IPC Trainer.
Kathy Nargi-Toth has submitted responses to the following questions.
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