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Understanding Solder Dross: Causes and Control Strategies
This article outlines the main contributors to dross formation, examines how alloy refining methods play a role, and explores practical ways to reduce dross through process control and equipment optimization.
AIM Solder

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ISM Storage and Software Integration Solutions
We are specialized in storage solutions and our warehouses ensure efficient production. Patented cases maximize space, facilitating material handling.
Essegi Automation

Ask the Experts Member

Christopher B Cain

R&D Manager
Agilent Technologies

25 years of experience in research and development of board and IC ATE systems for Hewlett-Packard and Agilent Technologies. Currently leading R&D teams within Agilent that provide in-circuit board test (i3070 and i1000 platforms) and board functional test (TS8900 PXI and TS5400 VXI/LXI platforms).

Christopher B Cain has submitted responses to the following questions.

Can Solder Joint Geometry Change Resistance?
From Agilent Technologies focus on premier measurement solutions, we frequently require a stringent PCA cleaning and handling process to ensure ...

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Reinforce Critical Components on PCBs
Low modulus wire tacking & ruggedizing adhesives hold vital BGAs & VGAs in place, enhancing shock & vibration resistance of electronic assemblies.
Dymax