Sponsor

Contaminant Removal with Plasma
Plasma provides organics removal and other benefits to increase bond strength! Many chamber sizes available, all with a low environmental impact. Learn more.
Plasma Etch

Sponsor

Tech Paper - The Economics of Electronic Component Salvage and Reuse
This paper examines the economic and environmental benefits of salvaging and reusing high-value electronic components.
Circuit Technology Center

Ask the Experts Member

Christopher B Cain

R&D Manager
Agilent Technologies

25 years of experience in research and development of board and IC ATE systems for Hewlett-Packard and Agilent Technologies. Currently leading R&D teams within Agilent that provide in-circuit board test (i3070 and i1000 platforms) and board functional test (TS8900 PXI and TS5400 VXI/LXI platforms).

Christopher B Cain has submitted responses to the following questions.

Can Solder Joint Geometry Change Resistance?
From Agilent Technologies focus on premier measurement solutions, we frequently require a stringent PCA cleaning and handling process to ensure ...

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp