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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.

Ask the Experts Member

Christopher B Cain

R&D Manager
Agilent Technologies

25 years of experience in research and development of board and IC ATE systems for Hewlett-Packard and Agilent Technologies. Currently leading R&D teams within Agilent that provide in-circuit board test (i3070 and i1000 platforms) and board functional test (TS8900 PXI and TS5400 VXI/LXI platforms).

Christopher B Cain has submitted responses to the following questions.

Can Solder Joint Geometry Change Resistance?
From Agilent Technologies focus on premier measurement solutions, we frequently require a stringent PCA cleaning and handling process to ensure ...

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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS