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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
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Christopher B Cain

Christopher B Cain

R&D Manager
Agilent Technologies
25 years of experience in research and development of board and IC ATE systems for Hewlett-Packard and Agilent Technologies. Currently leading R&D teams within Agilent that provide in-circuit board test (i3070 and i1000 platforms) and board functional test (TS8900 PXI and TS5400 VXI/LXI platforms).

Christopher B Cain has submitted responses to the following questions.
Can Solder Joint Geometry Change Resistance?
From Agilent Technologies focus on premier measurement solutions, we frequently require a stringent PCA cleaning and handling process to ensure ...
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Advanced Interconnections Corp
Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
Die Module Attach (static)