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Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
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Ask the Experts Member |
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Christopher B Cain
R&D Manager
Agilent Technologies
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25 years of experience in research and development of board and IC ATE systems for Hewlett-Packard and Agilent Technologies. Currently leading R&D teams within Agilent that provide in-circuit board test (i3070 and i1000 platforms) and board functional test (TS8900 PXI and TS5400 VXI/LXI platforms).
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Epoxy Changes Color Under UV Light
Watch this video to see how Master Bond's UV15RCL goes from red to clear with exposure to UV light, ensuring a thorough and effective curing process.
Master Bond
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