Sponsor

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

Sponsor

Safely Remove Underfilled BGAs Without Damaging the Circuit Board
Learn how cold precision milling techniques enable the removal of underfilled BGAs while minimizing risk to components, circuit traces, and board integrity.
Circuit Technology Center

Ask the Experts Member

David Bergman

VP International Relations
IPC

David W. Bergman is Vice President of International Relations for IPC. He has worked at IPC for more than 30 years responsible for IPC standardization efforts, education and certification programs. Currently, David is responsible for globalization activities, including IPC's China and India offices and reps in Europe and Russia.

David Bergman has submitted responses to the following questions.

What is the IPC Definition for Uncommonly Harsh?
Thank you for your question about classification call outs in IPC standards. The three level classification has been used for ...

Dendritic Growth and Contamination at BGA Sites
It might be possible. Foresite in Kokomo Indiana is an IPC member and has had success with many cleaning failure ...

Gold Edge Contact Flux Contamination Failures
I cannot agree with the EMS supplier. The gold edge contact is a critical interface surface formatting with the connector. ...

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS