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Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
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David Bergman

David Bergman

VP International Relations
IPC
David W. Bergman is Vice President of International Relations for IPC. He has worked at IPC for more than 30 years responsible for IPC standardization efforts, education and certification programs. Currently, David is responsible for globalization activities, including IPC's China and India offices and reps in Europe and Russia.

David Bergman has submitted responses to the following questions.
What is the IPC Definition of Uncommonly Harsh?
Thank you for your question about classification call outs in IPC standards. The three level classification has been used for ...
Gold Edge Contact Flux Contamination Failures
I cannot agree with the EMS supplier. The gold edge contact is a critical interface surface formatting with the connector. ...
Dendritic Growth and Contamination at BGA Sites
It might be possible. Foresite in Kokomo Indiana is an IPC member and has had success with many cleaning failure ...
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling