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AI Void Detection - X-Ray Inspection
X-ray Inspection for hidden and buried solder joints. BGA, QFN, THT, and more. High Speed and High Resolution configurations available.
Test Research, Inc.
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Adhesives for Tomorrow's Electronics
Dymax UV/LED curable adhesives, dispensers & curing equipment provide bonding and protection solutions for PCBs and board-level components. Learn how!
Dymax
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Ask the Experts Member |
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David Bergman
VP International Relations
IPC
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David W. Bergman is Vice President of International Relations for IPC. He has worked at IPC for more than 30 years responsible for IPC standardization efforts, education and certification programs. Currently, David is responsible for globalization activities, including IPC's China and India offices and reps in Europe and Russia.
David Bergman has submitted responses to the following questions.
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Unlock the Potential of Salvaged Devices
Component harvesting is a reliable method of electronic component reclamation, reducing e-waste and ensuring economic reuse for automated assembly.
BEST Inc.
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