|Ask the Experts Member|
Global Segment Manager
Air Products & Chemicals, Inc.
Mr. Arslanian has been involved in electronics packaging processing and equipment since 1981 including flipchip, TAB, wirebonding and die attach. Current responsiblities include R&D, applications, marketing and customer interaction.
Challenge Wetting Solder to Brass Pins
There are several areas that you should investigate: Is the flux your are using active enough to remove the oxides ...
Moisture Sensitive Components in Flooded Storage Facility
A possible solution is to bake the components in an nitrogen atmosphere at 100 deg. C for about 2 hours. ...
Conformal Coating in Nitrogen Environment
Nitrogenuse for conformal coating system: Pros:Nitrogen (N2) is used inthis process for the following reasons: A. N2 is low in ...
Improve DPPM for Wave Soldering Using Nitrogen
By using an inert atmosphere in the wave soldering process will reduce several defects including bridging, icicles and will improve ...
Options to Cut Inspection Time
Thekey issue is not to decrease inspection time, but to reduce your defects thatyou are experiencing in your wave solder ...
Components Jumping Out During Wave Soldering
One possible problem could cause this: Leads are longer than past. Could be a set up problem with their insertion ...
Contract Assembly in a Prison
The best way to solder these components is using a hot air reflow station. Very difficult to use a hand ...
Best Way to Eliminate Dross?
There are several ways to reduce dross formation in the wave soldering process. The use of a dross reduction chemicals ...
Organic Flux Residue Concerns
The greatest concern to leaving the flux residue on the board is corrosion and the board failing during operation. Another ...
Problems with Insufficient Barrel Fill
There are several reasons for insufficient fill of the PTH during wave soldering. The major reason is poor wetting that ...
Tacky Flux Residue Problem
Suggestion: use nitrogen in the reflow and rework process. This will reduce the flux residue. ...
Reflow oven testing and calibrating concern
IPC has several test board configurations for reflow furnace studies. If you on the IPC website, you can review the ...
Micro-balling with lead-free HASL and SAC alloy
You indicated that you are experiencing micro-balls on a printed circuit board that has NO solder paste on it. My ...
Soldering Grid Array Packages
Past experience with one of our customers with a similar situation was resolved with an inert atmosphere (nitrogen) in the ...
Bake for Repair
Depending on the material of the PCB and the thickness, I would recommend a bake time on no more than ...
Concerns with HDI
Depending on the type of solder paste and flux chemistry that you will be using and footprint, material of construction ...
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