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Optically Clear, Nanosilica Filled Epoxy
Master Bond EP114 is a NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity sealing applications.
Master Bond

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Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
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Ask the Experts Member

Steve Arneson

National Business Manager
ASC International

Mr. Arneson has been working in the electronics industry since 1992. His primary focus revolves around educating manufacturers as to the true value-add SPI and AOI have to offer within the manufacturing process. Armed with just enough industry knowledge to make him dangerous, Mr. Arneson can provide useful, real-world application study related advise to assist with all your SPI and AOI questions.

Steve Arneson has submitted responses to the following questions.

Solder Paste Print in Volcano Shape
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Solder Paste Thickness Measurements
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Reliable drying of UV materials
Rehm Thermal Systems launches the RDS UV dryer to meet faster hardening demands, enabling efficient, eco-friendly UV coating for electronics and various industries.
Rehm Thermal Systems