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Master Bond
Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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UNDI Fabrication for IC Substrates
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KYZEN
Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
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Expert

Steve Arneson

National Business Manager
ASC International
Mr. Arneson has been working in the electronics industry since 1992. His primary focus revolves around educating manufacturers as to the true value-add SPI and AOI have to offer within the manufacturing process. Armed with just enough industry knowledge to make him dangerous, Mr. Arneson can provide useful, real-world application study related advise to assist with all your SPI and AOI questions.

Steve Arneson has submitted responses to the following questions.
Solder Paste Print in Volcano Shape
There are a few possible issues you may be dealing with when you are seeing this type of profile. 1.) ...
Solder Paste Thickness Measurements
The most accurate way to answer this question is to first look at the overall complexity of the board to ...
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling