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Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK

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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

Ask the Experts Member

Steve Arneson

National Business Manager
ASC International

Mr. Arneson has been working in the electronics industry since 1992. His primary focus revolves around educating manufacturers as to the true value-add SPI and AOI have to offer within the manufacturing process. Armed with just enough industry knowledge to make him dangerous, Mr. Arneson can provide useful, real-world application study related advise to assist with all your SPI and AOI questions.

Steve Arneson has submitted responses to the following questions.

Solder Paste Print in Volcano Shape
There are a few possible issues you may be dealing with when you are seeing this type of profile. 1.) ...

Solder Paste Thickness Measurements
The most accurate way to answer this question is to first look at the overall complexity of the board to ...

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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.