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Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Plasma-Etch
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Circuit-Technology-Center

Safely Remove Underfilled BGAs Without Damaging the Circuit Board
Learn how cold precision milling techniques enable the removal of underfilled BGAs while minimizing risk to components, circuit traces, and board integrity.
Circuit Technology Center

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Fern Abrams


Director, Government Relations and Environmental Policy
IPC

Fern Abrams is the Director of Government Relations and Environmental Policy for IPC. She is responsible for advocating member positions in the areas of environment, health and safety, tax, trade, intellectual property and other regulatory issues. Current activities focus on conflict minerals regulations; implementation of best practices for protecting intellectual property, research and development tax credits, international materials restrictions, hazardous waste, and environmental reporting and record keeping.

Fern Abrams has submitted responses to the following questions.
Bromine Free PWBs
Bromine and lead free are both pseudo environmental specifications for electronics. Lead was required to be eliminated in electronics by ...
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Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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