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3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch

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pH Employment in Electronic Cleaning
The pH of a cleaning agent affects the entire cleaning process and must be considered when determining the appropriate chemistry and process parameters for success. Download now.
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Ask the Experts Member

Manuel Schöllig

Product Manager Soldering
Inventec Dehon

Product manager for soldering products, including solder pastes, liquid and tacky fluxes.

Manuel Schöllig has submitted responses to the following questions.

T4 vs T5 Solder Paste Particle Size
While 0201 will still work with T4 paste, 01005 and µBGA typically requires T5 solder paste and stencil thickness 3 ...

Full Aqueous Clean or Local Spot Clean
As flux vehicles of water-soluble solder pastes for most water soluble paste are highly activated (ORH0, ORH1), they have high ...

Question About ESD Ionizer Guns
Compressed air can create static charge thus to be on the ESD-safe side the use of an air ionizer gun ...

Solder Paste Stencil Inactivity
The time solder paste can be left on a stencil without printing or wetting it depends on many different factors ...

Storage To Prevent Corrosion
Concerning the prevention of corrosion, there is several reasons to consider depending on the factors causing corrosion: Material surface – ...

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You need clear soldering results?
The SEHO PowerVision AOI system is for fast, automated optical inspection. Designed for THT processes & focusses on 2 points: Continuous quality assurance & cost-efficient production processes.
SEHO Systems GmbH