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Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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Manuel Schöllig

Manuel Schöllig

Product Manager Soldering
Inventec Dehon
Product manager for soldering products, including solder pastes, liquid and tacky fluxes.

Manuel Schöllig has submitted responses to the following questions.
T4 vs T5 Solder Paste Particle Size
While 0201 will still work with T4 paste, 01005 and µBGA typically requires T5 solder paste and stencil thickness 3 ...
Full Aqueous Clean or Local Spot Clean
As flux vehicles of water-soluble solder pastes for most water soluble paste are highly activated (ORH0, ORH1), they have high ...
Question About ESD Ionizer Guns
Compressed air can create static charge thus to be on the ESD-safe side the use of an air ionizer gun ...
Storage To Prevent Corrosion
Concerning the prevention of corrosion, there is several reasons to consider depending on the factors causing corrosion: Material surface – ...
Solder Paste Stencil Inactivity
The time solder paste can be left on a stencil without printing or wetting it depends on many different factors ...
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling