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Contaminant Removal with Plasma
Plasma provides organics removal and other benefits to increase bond strength! Many chamber sizes available, all with a low environmental impact. Learn more.
Plasma Etch

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Tech Paper - The Economics of Electronic Component Salvage and Reuse
This paper examines the economic and environmental benefits of salvaging and reusing high-value electronic components.
Circuit Technology Center

Ask the Experts Member

Steve Hall

President
EKRA America

Mr. Hall has spent the last 20 years in the electronics manufacturing industry. He started at Motorola specializing in the development of screen printing and reflow soldering processes. He has became known as an expert in printing technology.

Steve Hall has submitted responses to the following questions.

Issues with BGA Components Near PCB Edges
In regards to the stencil printer, you will have to make sure that depending on how close to the edge ...

Solder paste inspection methodology
For post print sampling there are very reliable systems available on board the printer. The capability of these systems is ...

Stencil printing process problems
Assuming that your solder paste cannot be changed there are a few things that you can look at the help ...

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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp