Sponsor

High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability, and reduces energy use up to 15%.
Indium Corporation

Sponsor

Low Outgassing, Silver Filled Silicone
Master Bond MasterSil 323S-LO is an electrically and thermally conductive, addition cured adhesive designed for bonding applications where low stress is critical.
Master Bond

Ask the Experts Member

Steve Hall

President
EKRA America

Mr. Hall has spent the last 20 years in the electronics manufacturing industry. He started at Motorola specializing in the development of screen printing and reflow soldering processes. He has became known as an expert in printing technology.

Steve Hall has submitted responses to the following questions.

Issues with BGA Components Near PCB Edges
In regards to the stencil printer, you will have to make sure that depending on how close to the edge ...

Solder paste inspection methodology
For post print sampling there are very reliable systems available on board the printer. The capability of these systems is ...

Stencil printing process problems
Assuming that your solder paste cannot be changed there are a few things that you can look at the help ...

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Sponsor

Corrosion, UV Protection for Power Transmission
Moisture, corrosive gas, oxidation & UV blocking prop-erties. FLUOROSEAL® confor-mal coating for electrical contacts & ceramic insulator protection.
AI Technology, Inc.