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Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK

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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

Ask the Experts Member

Steve Hall

President
EKRA America

Mr. Hall has spent the last 20 years in the electronics manufacturing industry. He started at Motorola specializing in the development of screen printing and reflow soldering processes. He has became known as an expert in printing technology.

Steve Hall has submitted responses to the following questions.

Issues with BGA Components Near PCB Edges
In regards to the stencil printer, you will have to make sure that depending on how close to the edge ...

Solder paste inspection methodology
For post print sampling there are very reliable systems available on board the printer. The capability of these systems is ...

Stencil printing process problems
Assuming that your solder paste cannot be changed there are a few things that you can look at the help ...

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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.