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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

Sponsor

Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering

Ask the Experts Member

Steve Hall

President
EKRA America

Mr. Hall has spent the last 20 years in the electronics manufacturing industry. He started at Motorola specializing in the development of screen printing and reflow soldering processes. He has became known as an expert in printing technology.

Steve Hall has submitted responses to the following questions.

Issues with BGA Components Near PCB Edges
In regards to the stencil printer, you will have to make sure that depending on how close to the edge ...

Solder paste inspection methodology
For post print sampling there are very reliable systems available on board the printer. The capability of these systems is ...

Stencil printing process problems
Assuming that your solder paste cannot be changed there are a few things that you can look at the help ...

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High Accuracy SMT / SEMI Inspection
Discover TRI's High Accuracy Inspection Solutions for the SMT and SEMI Back-End Electronics Manufacturing.
Test Research, Inc.