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Ask the Experts Member

Harry Jin

Product Manager
CheckSum LLC

Harr Jin has over 35 years experience in board test as a user, designer, manager and vendor. He has worked for Teradyne and Agilent Technologies as the 3070 business development manager. He has presented papers as ITC, Nepcon and SMTA meetings.

Harry Jin has submitted responses to the following questions.

Flux Residue Causing Test Issues
No clean flux has been a bane of the in-circuit test world ever since its introduction. There are several approaches ...

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Electrically Conductive Die Attach Epoxy
Master Bond EP17HTS-DA is a silver filled, die attach adhesive that withstands high temperatures and passes MIL-STD-883J thermal stability requirements.
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