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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
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Harry Jin

Harry Jin

Product Manager
CheckSum LLC
Harr Jin has over 35 years experience in board test as a user, designer, manager and vendor. He has worked for Teradyne and Agilent Technologies as the 3070 business development manager. He has presented papers as ITC, Nepcon and SMTA meetings.

Harry Jin has submitted responses to the following questions.
Flux Residue Causing Test Issues
No clean flux has been a bane of the in-circuit test world ever since its introduction. There are several approaches ...
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Advanced Interconnections Corp
Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
Die Module Attach (static)