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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
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SEHO makes production lines smarter
Improve your work flow and reduce manufacturing costs with creative ideas and innovative solutions for automation, board handling and material management.
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Ask the Experts Member

Walter Pierowski

Process Engineer
Esterline Interface Technologies

Mr. Pierowski is currently a Process Engineer for SMT and Electrical Assembly with 20+ years of experience. A majority of the experience was based in screen/stencil printing for electronics manufacturing including application support for SMT, LTCC, HTCC and thick film.

Walter Pierowski has submitted responses to the following questions.

LED Component Shift During Reflow
One of the most common reasons for a component to shift during reflow is that it is"floating." The reason a ...

BGA Ball Sheer Testing
That is exactly the results I would expect from a mechanical removal of a BGA. Remember solder is designed to ...

ENIG Solderability Issues
My first check would be for any contamination on the circuit board. I have in the past had issues when ...

Cleanliness Testing
One new technique is a localized cleanliness tester. There is one called C3 from Foresite. With this type of cleanliness ...

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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura