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Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
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Ask the Experts Member

Walter Pierowski

Process Engineer
Esterline Interface Technologies

Mr. Pierowski is currently a Process Engineer for SMT and Electrical Assembly with 20+ years of experience. A majority of the experience was based in screen/stencil printing for electronics manufacturing including application support for SMT, LTCC, HTCC and thick film.

Walter Pierowski has submitted responses to the following questions.

LED Component Shift During Reflow
One of the most common reasons for a component to shift during reflow is that it is"floating." The reason a ...

BGA Ball Sheer Testing
That is exactly the results I would expect from a mechanical removal of a BGA. Remember solder is designed to ...

ENIG Solderability Issues
My first check would be for any contamination on the circuit board. I have in the past had issues when ...

Cleanliness Testing
One new technique is a localized cleanliness tester. There is one called C3 from Foresite. With this type of cleanliness ...

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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
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