Sponsor

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS

Sponsor

Automated Storage for High-Mix EMS Production
High mix electronics manufacturing requires reliable material management. This white paper explains how BMK enhanced traceability, inventory accuracy and picking efficiency using integrated automated storage, digital workflows and reel-level visibility.
Essegi Automation

Ask the Experts Member

Walter Pierowski

Process Engineer

Esterline Interface Technologies

Mr. Pierowski is currently a Process Engineer for SMT and Electrical Assembly with 20+ years of experience. A majority of the experience was based in screen/stencil printing for electronics manufacturing including application support for SMT, LTCC, HTCC and thick film.

Walter Pierowski has submitted responses to the following questions.

LED Component Shift During Reflow
One of the most common reasons for a component to shift during reflow is that it is"floating." The reason a ...

BGA BAll Sheer Testing
That is exactly the results I would expect from a mechanical removal of a BGA. Remember solder is designed to ...

Cleanliness Testing
One new technique is a localized cleanliness tester. There is one called C3 from Foresite. With this type of cleanliness ...

ENIG Solderability Issues
My first check would be for any contamination on the circuit board. I have in the past had issues when ...

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Reflow Soldering Oven Survey
We invite you to participate in this important survey about Reflow Soldering Ovens. This survey is anonymous, and your personal data is not collected. Click to begin survey.
Circuitnet Media LLC

Trusted Partner for Mission-Critical PCBs