circuitnet
Sponsor
ECD
Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
Full-Rotation X-Ray Imaging
Sponsor
Plasma Etch
3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch
Ask the Experts Member
QUESTIONS
  
SUBMIT
  
MEMBERS
  
JOIN
Raju Wagh

Raju Wagh

Senior Engineer SMT
Advance Power Display system Ltd Mumbai
Mr. Raju Wagh has worked in the electronics industries for the past 20 years focused in TV manufacturing, mother boards, mobile, LED lighting, power supply manufacturing and more. His specialty is in SMT production and processes

Raju Wagh has submitted responses to the following questions.
Conformal Coating Bubbles
Air bubbles generated After Conformal coating on circuit card, that main reason has, make the circuit board pre heat up ...
Oxidation of Solder Balls During Secondary Reflow
Please find the Below causes of generate of solder ball during reflow soldering. Solder ball generate due to moisture affected ...
Pin-in-Paste Hole Stencil Printing
In solder paste printing we need set correctly set printing process parameters solder paste thawing process min 3-4 Hours ,keep ...
Challenge Wetting Solder to Brass Pins
Brass pins of the connector solder not happen because of brass pins has contamination with moisture that Soldering wetting not ...
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Air-Vac Engineering
Removal/Milling of Underfilled Parts: AVX1000M
High precision milling with zero adjacent clearance. Auto laser height measurement of board and component. Learn more.
Air-Vac Engineering
TLPS is proven for outstanding reliabiility #1