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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
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Raju Wagh


Senior Engineer SMT
Advance Power Display system Ltd Mumbai

Mr. Raju Wagh has worked in the electronics industries for the past 20 years focused in TV manufacturing, mother boards, mobile, LED lighting, power supply manufacturing and more. His specialty is in SMT production and processes

Raju Wagh has submitted responses to the following questions.
Conformal Coating Bubbles
Air bubbles generated After Conformal coating on circuit card, that main reason has, make the circuit board pre heat up ...
Oxidation of Solder Balls During Secondary Reflow
Please find the Below causes of generate of solder ball during reflow soldering. Solder ball generate due to moisture affected ...
Pin-in-Paste Hole Stencil Printing
In solder paste printing we need set correctly set printing process parameters solder paste thawing process min 3-4 Hours ,keep ...
Challenge Wetting Solder to Brass Pins
Brass pins of the connector solder not happen because of brass pins has contamination with moisture that Soldering wetting not ...
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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ÂșC
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