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Brien Bush

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Manufacturing Applications Specialist
Cirtronics Corp.

Mr. Bush has 20 years experience in electronics contract manufacturing. Major areas of expertise include through hole, SMT, wave and selective soldering.


Brien Bush has submitted responses to the following questions.
Pad Missing ENIG Plating
My advice is to reject the boards. They were not manufactured to specification. They should be re-plated or scrapped at ...
Reflow Profile for Mixed Lead-Free and Leaded
The changes you will need to make depend on the type of board finish such as Enig, IAg, OSP, ISn, ...
SMT Target Component Placement
First you should make sure your pick and place machine is placing the part accurately. Depending on the size of ...
Insufficient Barrel Fill on Through-hole Components
There are many variable to achieving barrel fill in through hole technology. Flux activation, preheat time, board thickness ground plane ...
Channels To Reduce Voids in Large Pads
The expanding gas typically causes voids during the reflow process. These voids can be reduced or in some cases illuminated ...
Solder Balling Prediction Formula
Many variables will contribute to solder balling. The solder paste should be the right type for aperture size. Make sure ...
What Is This Contamination?
Without further investigation, I can only guess this board suffered a short. Most likely from an insufficient cleaning process and ...
BGA Placement Paste or Only Flux
With a flux only process for placing BGA's you have the potential for unsoldered connections and insufficient solder which will ...
Selective Solder System Purchased At Auction
The solder pots for these systems are manufactured to the alloy they are going to use. The reason being is ...
Reusing recovered solder paste
Mixing old solder paste with new is not a good practice. Solder paste waste has always been a valid concern ...
Stencil Pattern for Thermal Pads on QFNs
There is no one size fits all for thermal pads on QFN's. This is going to depend on the package, ...
0201 Pick & Place Nozzle Plugging
If you have paste getting squished out the sides high enough to get on the nozzle, you should have plenty ...
QFN Open Solder Joints
Ifyou are experiencing opens with a QFN or in this case DR QFN, reflow is notoccurring evenly or something is ...
Stencil Cleaning Frequency
Thetime between stencil cleaning is going to depend on your type of solder pasteand printing process. If you use an ...
Customer Approval for Repairs
Depending on the type of damage, as long as you meet class 3 requirements, you can make repairs. Regarding customer ...
Gold Plating and Embrittlement
Goldembrittlement can be a significant reliability issue. Most PCB designers areaware of this and careful consideration is made in the ...
BGA Ball Sheer Testing
Whena BGA is sheered from its terminations, the separation is going to take placeat the weakest points. Some maysSeparateat the ...
Solder Paste Prep Before Use
Solderpastes are all manufactured for their specific purpose and use. I recommend youfollow yoursolderpaste manufacturer's instructions for the storage, use ...
Tiny Solder Balls After Reflow
There are a number of factors that can cause solder balls or solder splatter. Moisture being one which you have ...