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Brien Bush
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Manufacturing Applications Specialist
Cirtronics Corp.
Mr. Bush has 20 years experience in electronics contract manufacturing. Major areas of expertise include through hole, SMT, wave and selective soldering.


Brien Bush has submitted responses to the following questions.
Channels To Reduce Voids in Large Pads
The expanding gas typically causes voids during the reflow process. These voids can be reduced or in some cases illuminated ...
Solder Balling Prediction Formula
Many variables will contribute to solder balling. The solder paste should be the right type for aperture size. Make sure ...
What Is This Contamination?
Without further investigation, I can only guess this board suffered a short. Most likely from an insufficient cleaning process and ...
BGA Placement Paste or Only Flux
With a flux only process for placing BGA's you have the potential for unsoldered connections and insufficient solder which will ...
Selective Solder System Purchased At Auction
The solder pots for these systems are manufactured to the alloy they are going to use. The reason being is ...
Reusing recovered solder paste
Mixing old solder paste with new is not a good practice. Solder paste waste has always been a valid concern ...
Stencil Pattern for Thermal Pads on QFNs
There is no one size fits all for thermal pads on QFN's. This is going to depend on the package, ...
0201 Pick & Place Nozzle Plugging
If you have paste getting squished out the sides high enough to get on the nozzle, you should have plenty ...
QFN Open Solder Joints
If you are experiencing opens with a QFN or in this case DR QFN, reflow is not occurring evenly or ...
Stencil Cleaning Frequency
The time between stencil cleaning is going to depend on your type of solder paste and printing process. If you ...
Customer Approval for Repairs
Depending on the type of damage, as long as you meet class 3 requirements, you can make repairs. Regarding customer ...
Gold Plating and Embrittlement
Gold embrittlement can be a significant reliability issue. Most PCB designers are aware of this and careful consideration is made ...
BGA Ball Sheer Testing
When a BGA is sheered from its terminations, the separation is going to take place at the weakest points. Some ...
Solder Paste Prep Before Use
Solder pastes are all manufactured for their specific purpose and use. I recommend you follow your solder paste manufacturer's instructions ...
Tiny Solder Balls After Reflow
There are a number of factors that can cause solder balls or solder splatter. Moisture being one which you have ...