Sponsor

Is My PCB Wash Concentration in Check
Evaluating wash concentration levels through varying testing methods can potentially save process time, reduce overall process costs, and increase cleaning efficacy on PBCs. Read more.
KYZEN

Sponsor

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

Ask the Experts

November 20, 2024 - Updated
November 12, 2024 - Originally Posted

Tin Whiskers and Vapor Phase Reflow

Can we solder components with tin-plated leads using Sn63Pb37 solder paste in vapor phase reflow (215C) without a tin whisker reliability issue?

M.B

Expert Panel Responses

There is not a lot known about tin whiskers other than they tend to occur under stress of an SNPB solder joint. How the solder joint is formed if by reflow oven, vapor phase, or hand soldering, I would not feel confident enough to say tin whiskers are less likely for any particular soldering technique. As long as you are using tin in the process, there is a risk for tin whiskers.

Brien Bush
Manufacturing Applications Specialist
Cirtronics Corp.

Mr. Bush has over 30 years of experience in electronics contract manufacturing. Major areas of expertise include through-hole, SMT, wave, and selective soldering.

The risk of tin whiskers is typically greatest with electroplated pure tin deposits, which could be used on component leads. Soldering those leads with Sn/Pb is one way of reducing the risk, as Pb acts as a natural suppressant to tin whisker formation. There are cases of tin whiskers forming from Sn/Pb solder deposits, but the growth rate, length and number of whiskers may meet your customer's requirement.

I suggest mitigation of tin whiskers followed by running tin whisker tests based on available standards like GEIA-STD-0005-2, JESD201, JP201, and JESD22A121. There may be other, more current standard for tin whiskers.

Tony Lentz
Field Applications
FCT Assembly

Tony has worked in the electronics industry since 1994. He worked as a process engineer at a circuit board manufacturer for 5 years. Since 1999, Tony has worked for FCT Companies as a laboratory manager, facility manager, and most recently a field application engineer. He has extensive experience doing research and development, quality control, and technical service with products used to manufacture and assemble printed circuit boards. He holds B.S. and M.B.S. degrees in Chemistry.

Submit A Comment

Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Thermally Conductive Epoxy
Master Bond Supreme 11AOHTLP is a two component adhesive featuring thermal conductivity and electrical insulation for high performance bonding, sealing and coating.
Master Bond

Circuitnet Advertising Delivers Results!

Circuitnet provides excellent e-media visibility with advertising designed to meet every budget. We reach 200,000 industry professionals who are eager to learn more about your products and services.

LEARN MORE