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Sponsor
Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Paper

Mastering the EV Revolution with Expertise in High-Voltage & E-Mobility

With consumers placing a premium on affordability and reliability, companies face a dual challenge and opportunity. We recognize the importance of reliability in consumer acceptance and have honed our knowledge and capabilities in high voltage (HV) electronic assemblies, particularly in the context of E-Mobility.
ZESTRON Corporation
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Sponsor
Plasmatreat GmbH
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH