Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Printable Pastes

Solder paste jetting is a popular and innovative method for applying solder paste in electronic assembly, especially for modern, 15 miniaturized, and complex electronic assemblies. This technique provides several advantages over traditional solder paste 16 printing methods.

ZESTRON Corporation

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura