Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Recent Advances in Final Finishes Push Past the Limits of Conventional Electrolytes

In a wide-ranging discussion, Uyemura Business Development Manager Rich DePoto explores DIG, RAIG, EPIG, and the competition-fueled evolution from mSAP to full semi-additive SAP.

Uyemura International Corporation

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura