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Master Bond
Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond
Industry Paper

Bismuth in Solder Alloys: From Bulk Constituent in Low Temp to Performance Enhancer in High Rel

Bismuth is a primary constituent in many low-temperature solders, but it also serves as an additive element in SAC solders that reinforces joint durability, optimizes wetting characteristics, and minimizes voiding.
AIM Solder
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Sponsor
Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH