| Industry Paper |
Bismuth in Solder Alloys: From Bulk Constituent in Low Temp to Performance Enhancer in High Rel
Bismuth is a primary constituent in many low-temperature solders, but it also serves as an additive element in SAC solders that reinforces joint durability, optimizes wetting characteristics, and minimizes voiding.
AIM Solder
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High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability and reduces energy use up to 15%.
Indium Corporation
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