Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles. Ormet TLPS
Technical Paper
Plasma as a Key Technology: Increasing Efficiency and Quality Assurance in the Electronics Industry
Plasma technology improves electronics manufacturing, reduces oxide layers without the use of flux, prevents delamination, improves adhesion and enables environmentally friendly, high performance products by using Openair-Plasma® and PlasmaPlus®.
Plasmatreat GmbH
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UL 94 V-0 Electronic Potting Protection
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