Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Meeting Today's Challenge for Low VOC Defluxing Agents for Electronics Manufacturing

Given the world in which we live today, corporate environmental sensitivity is critical to the Stakeholders and for many, grounded in ISO 14001. Corporate accountability has thus set the stage for an industrial shift towards more environmentally friendly and worker-safe processes, both in-house for companies and in their supply chain.

ZESTRON Corporation

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura