Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Through-Hole Soldering Reliability Without Sacrificing Throughput

For low-volume applications some end-users opt for manual soldering. This paper outlines how compact selective soldering improves quality and reproducibility.

Hentec Industries, Inc. / RPS Automation, LLC.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura