Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Keys to Component Lead Tinning Success

This paper addresses the critical issue of component tinning, specifically focusing on its implementation and challenges. Authored by experts in the field, the paper provides valuable insights into the best practices and techniques required for successful lead tinning. As electronic components play a vital role in various industries, ensuring reliable and efficient tinning is essential for maintaining the integrity and functionality of these components.

Circuit Technology Center Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura