Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more. ECD
A detailed 3D SPI implementation study at an OEM who realized their print process was not as robust as believed and how their misconception led to higher rework and escapes.
Koh Young America, Inc.
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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC Ormet® TLPS
