AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C Ormet® TLPS
Technical Paper
Dealing with the Results of the Pandemic
As electronics manufacturers try to return to full production after Covid-19, many factors are making the return difficult. Challenges facing manufacturers are; labor shortages, rising wages, and the availability of experienced and trained workers.
Essegi Automation S.r.l.
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering. AI Technology