| Industry Paper |
Direct Immersion Gold as a Final Finish
Study confirms feasibility of directly depositing gold on copper surface without defects using autocatalytic, rather than displacement, reaction. Heavy gold layers also achievable; solder mounting and gold wire bonding discussed.
Uyemura International Corporation
|
Complete the form below to download this technical paper.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
Sponsor
|
|
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
|
|
|
