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Technical Paper

Direct Immersion Gold as a Final Finish

Study confirms feasibility of directly depositing gold on copper surface without defects using autocatalytic, rather than displacement, reaction. Heavy gold layers also achievable; solder mounting and gold wire bonding discussed.
Uyemura International

More Technical Papers

Cutting Without Contact: How Laser Depanelling Redefines PCB Manufacturing

The "Fried Egg" Effect in Soldering

Flux Technology Development for Solder Paste Compatible with Formic Acid Reflow Ovens for Power Devices

Innovative Power Module Assembly Solutions

Unlocking the Potential of Nanoscale Conformal Coatings

Recycling vs Circularity: Minimising E-Waste in Manufacturing

Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components

Probe Card Manufacturer 'Sees the Unseen' With X-ray

Electronic Assembly Cleaning Basics: Manual Concentration Monitoring Methods

An Eight-Step Methodology for Bringing a Process Under Statistical Control

Bismuth in Solder Alloys: From Bulk Constituent in Low Temp to Performance Enhancer in High Rel

Plasma as a Key Technology: Increasing Efficiency and Quality Assurance in the Electronics Industry

Use of Numerical Simulation Methods for the Development of Thermal Systems & Coating Equipment

Recent Advances in Final Finishes Push Past the Limits of Conventional Electrolytes

Smart pH Employment in Electronic Cleaning

Mastering the EV Revolution with Expertise in High-Voltage & E-Mobility

Reflow Oven and Wave Soldering Machine Maintenance Cleaning

2D SPI and a 2D AOI now integrated in your SMT Production Machine

Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Printable Pastes

An Essential Guide to Optimize Selective Soldering Processing

Full Technical Paper Index

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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS