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Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Paper

Essential Practices for Gold Mitigation of Electronic Components

This paper addresses the critical issue of gold mitigation in electric components. With a focus on the challenges gold poses in electronic assemblies, the paper explores various essential practices to effectively mitigate the use of gold. It discusses the importance of understanding the potential risks associated with gold, such as price fluctuations and environmental concerns, and provides strategies to minimize gold usage while maintaining high-quality performance.
Circuit Technology Center Inc.
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Sponsor
Plasmatreat GmbH
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH