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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS

Technical Paper

Eliminate Voids with Vacuum Reflow

Void elimination is essential for high power / high heat dissipating products. This paper details the fine points of void reduction with Heller Vacuum Reflow ovens, the only systems that can deliver <1% void rate at Production Volumes.
Heller Industries, Inc.

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Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD