circuitnet
Sponsor
Master-Bond

Optically Clear, Nanosilica Filled Epoxy
Master Bond EP114 is a NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity sealing applications.
Master Bond
Ask the Experts
BGA Component Grounding Problem
We have an ongoing concern regarding reliability BGA components. Over the last year, we had boards returned due to a BGA issue. The boards use leaded balls ...
Responses by:
Richard D. Stadem
Advanced Engineer/Scientist, General Dynamics
Fritz Byle
Process Engineer, Astronautics
Swaroop Pawar
PCBA Industrialization, Schneider Electric
Rick Kompelien
Principal Product Engineer, Benchmark Electronics, Inc.
Greg York
Technical Sales Manager, BLT Circuit Services Ltd
Terry Munson
President/Senior Technical Consultant, Foresite
Aluminum Trays and Rapid Static Discharge
Use of Nitrogen for Hand Soldering
Environment Impact on Assembly, Printing and Reflow
IPC-A-610 Class 3 - IPC-A-600 Class 2
Glued SMT Components Falling Off
Delamination Causing Scrap
Hot Air Soldering for 0201s and 01005s
MORE ASK THE EXPERTS
Viscom
Sponsor
Epic-Resins

UL 94 V-0 Electronic Potting Protection
Epic S7634 is a halogen-free UL 94 V-0 polyurethane potting compound. It has outstanding low-temperature performance and excellent electrical stability. Get a quote today!
Epic Resins
Industry Calendar
Dec 4, 2025
Silicon Valley Expo & Tech Forum
SMTA
Nov 13, 2025
Tijuana Expo & Tech Forum 2025
SMTA
Nov 13, 2025
Space Coast Expo & Tech Forum
SMTA
Nov 11, 2025
Tampa Bay Expo & Tech Forum
SMTA
Nov 4, 2025
Utah Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Uyemura
Sponsor
Test-Research-Inc.

High Accuracy SMT / SEMI Inspection
Discover TRI's High Accuracy Inspection Solutions for the SMT and SEMI Back-End Electronics Manufacturing.
Test Research, Inc.
What Year Was It?
Mata Hari Executed
What Year
Mata Hari, the archetype of the seductive female spy, is executed for espionage by a French firing squad at Vincennes outside of Paris.
See the answer below.
Sponsor
SEHO

SEHO@productronica: Innovations up close
Designed for demanding applications and focused on efficiency. Experience what is already possible today to make your production future-proof. Meet SEHO at productronica: A4-578!
SEHO
Plasma-Etch
What Year Was It Answer
Mata Hari Executed
Answer: October 15, 1917
October 15, 2025
image
Smartphone Market Grows 2.6% in Q3 as Upgrades Accelerate, Driven by New Innovative Products
Global smartphone shipments rose 2.6% year-over-year to 322.7 million units in Q3 2025, IDC reported, as consumers embraced premium and AI-enabled devices. Apple and Samsung led growth with record results, while Xiaomi, Transsion, and vivo also gained momentum.
IDC
Sponsor
Creative-Electron

Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
Hon Hai teams up with Nvidia on AI factory infrastructure development
Hon Hai Precision (Foxconn) announced a partnership with Nvidia to deploy its 800 VDC data center power architecture in Kaohsiung's K-1 AI center. The move advances high-density AI servers, efficient power distribution, and next-generation GPU integration.
Taipei Times
Flux Technology Development for Solder Paste Compatible with Formic Acid Reflow Ovens for Power Devices
This paper introduces a newly developed flux technology compatible with formic acid reduction reflow ovens which offers solutions to the issues associated with conventional power device soldering.
Technical Paper
ChatGPT Will Soon Roll Back Some Of Its Most Controversial Changes
After implementing stricter safeguards following a teen's death, OpenAI plans to ease ChatGPT's restrictions. CEO Sam Altman says new age-gating and safety tools will allow a more versatile, user-friendly version while still protecting vulnerable users.
BGR
Sponsor
Essegi-Automation

The new Smart Rack Mobile
Optimize your workflow with Smart Rack Mobile: intelligent storage, mobility, and real-time component management. Discover more!
Essegi Automation
Nokia Bell Labs Breaks Ground for Its New N.J. Headquarters
Nokia Bell Labs celebrated its 100th anniversary and broke ground for its new HELIX 2 headquarters in New Brunswick, N.J., aiming to expand research in AI, quantum physics, and communications while fostering startups and innovation in a vibrant academic hub.
IEEE Spectrum
Technical Papers
How pH Cleaning Agents Affect Production Performance
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin
Understanding Solder Dross: Causes and Control Strategies
Optimizing BGA Rework: Challenges, Techniques and Quality Control
Maintenance: The Basics of Cleaning Series Part 4
The Economics of Electronic Component Salvage and Reuse
Cutting Without Contact: How Laser Depanelling Redefines PCB Manufacturing
The "Fried Egg" Effect in Soldering
MORE TECHNICAL PAPERS
Sponsor
kyzen

Is My PCB Wash Concentration in Check
Evaluating wash concentration levels through varying testing methods can potentially save process time, reduce overall process costs, and increase cleaning efficacy on PBCs. Read more.
KYZEN
Generative AI Is Revolutionizing SEO. Here's How Marketers Can Keep Up.
Generative AI is reshaping SEO by changing how people search, how platforms rank content, and how brands gain visibility. Experts warn that unlike fixed algorithms, AI models produce variable, probabilistic outputs—a feature that offers strategic advantage.
Entrepreneur
Why RISC-V + Blockchain Is the Conversation I've Been Waiting to Have
RISC-V and blockchain are converging to enable scalable, privacy-focused applications. Using RISC-V as a virtual execution layer for zero-knowledge VMs streamlines verifiable, secure smart contract development, advancing enterprise and government blockchain adoption.
EE Times
Sponsor
SEIKA-America

McDry Ultra-Low Humidity Storage Cabinets
McDry dry cabinet for MSL components and desiccators provide optimal ultra-low humidity and moisture-proof storage for IC packages.
Seika
Bringing the 'Taiwan model' to the US
Taiwan's pro-business policies and Hsinchu Science Park have powered TSMC's rise, inspiring U.S. efforts to replicate its "Taiwan model." Strong government backing, streamlined operations, and efficient clusters drive fast, cost-competitive chip production and global impact.
Taipei Times
Checking the quality of materials just got easier with a new AI tool
MIT engineers created SpectroGen, a generative AI tool that serves as a virtual spectrometer, converting material measurements between scanning modalities with 99% accuracy—accelerating quality control and cutting costs in manufacturing and materials research.
MIT News
Sponsor
Summit-Interconnect

Fast PCBs, Fully Assembled
Need it fast? Summit delivers quick-turn PCB fabrication and assembly on compressed timelines—no shortcuts, just speed and precision from one source.
Summit Interconnect
Design priorities for autonomous transport for people with disabilities
A QUT study of 343 Australians with disabilities identified key autonomous vehicle features to boost accessibility, including spacious interiors, side-entry boarding, adaptable seating, and multi-sensory communication—advancing mobility, safety, and social inclusion.
TechXplore
California just passed new AI and social media laws. Here's what they mean for Big Tech
California Gov. Gavin Newsom signed new laws boosting child online safety, requiring AI chatbot disclosures, mental health warnings on social media, and age verification tools. The measures aim to shield minors from harmful content and hold Big Tech accountable.
CNBC
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
Thermal Cycle Fatigue Life of Low-Temperature Solders
Researchers evaluated thermal cycling fatigue in low-temperature solders with reflow peaks below 200℃, a key reliability factor in electronics. The study reports time-to-failure data for solder interconnects in BGAs, QFNs, and SMR components, advancing material qualification.
Circuit Insight - Materials Tech
OCP Summit: Inside Google's plan to make data centers as adaptive as AI itself
Google launched an industry-wide initiative to modernize data center design for the AI era, introducing an "agile, fungible data center" workstream under the Open Compute Project (OCP) to promote greater flexibility, scalability, and efficiency in infrastructure development.
Digitimes
Environment Impact on Assembly, Printing and Reflow
At our SMT facility we currently control ambient temperature (20-30 C), relative humidity (40-60%) and particle count (0.5 um not to exceed 100,000 particles, ISO Class 8). Is particle count a good parameter to control?
Circuit Insight - Ask the Experts
Sponsor
Nordson-ASYMTEK

Discover consistency for your operations
Explore the reliable solutions for jet dispensing, conformal coating, plasma treatment, and selective soldering from Nordson.
Nordson Electronics Solutions
LG Electronics India makes debut on Indian stock market
LG Electronics India made a stellar stock market debut Tuesday, raising 1.8 trillion won ($1.26 billion) as shares surged 45%. CEO Cho Joo-wan unveiled the "Make for India" vision, pledging stronger localization, new factories, and deeper R&D investment to drive regional growth.
The Korea Times
Google to invest $15 billion to build data center hub in India; largest outside of the U.S.
Google announced a $15 billion investment to build its largest AI hub outside the U.S. in southern India over five years. The project, led by Google Cloud, will expand data center capacity in Visakhapatnam to meet rising global AI demand.
CNBC
Memory Safety Will Be Key to Tackle Fundamental Cyber Security
The U.K.'s Digital Security by Design initiative showcased CHERI, a memory-safe hardware technology, in London. Experts praised its cybersecurity potential but noted adoption challenges. With 160+ companies involved, standardizing memory safety remains a key priority.
EE Times
Today's Sponsor
AI-Technology-Inc
Sponsor
AI-Technology-Inc

Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
Test Your Knowledge
Who coined the term "nanotechnology" and in what year? (a) Richard Feynman, Physicist (1959) (b) Norio Taniguchi, Materials Scientist (1974) (c) Arthur C. Clarke, Sci-fi Author (1962) (d) K. Eric Drexler, Engineer (1986)
See answer below.
Industry Press
Dymax's New 9773 Ruggedized Adhesive Meets NASA ASTM E595 Low Outgassing
Dymax
Seika Machinery Introduces Nippon Nozzle Division in North America
Seika Machinery
SolderKing Earns Bronze EcoVadis Medal for Second Consecutive Year
SolderKing Assembly Materials Ltd
Solderstar Launches Vapour Phase Verification Suite at Productronica 2025
Solderstar
Kurtz Ersa Discusses Smart Soldering Technology at SMTA Tijuana Expo
Kurtz Ersa Inc.
MORE INDUSTRY PRESS
Dymax
Sponsor
ECD

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
Quote of the Day
"We make a living by what we get, we make a life by what we give."
Sir Winston Churchill
Sponsor
Plasmatreat-GmbH

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
Manncorp
Cartoon of the Day
Cartoon
"If you must know, I work for minimum wage! For a CEO, minimum wage is $750 an hour."
Copyright © Randy Glasbergen
Sponsor
Glenbrook-Technologies

X-ray Rentals & Rent-to-Own
Rent any of our machine models, with up to 3 months of rental costs applied toward purchasing X-ray equipment. Our flexible plan lets you test the system before committing to purchase.
Glenbrook Technologies
Circuit-Technology-Center
Test Your Knowledge Answer
Who coined the term "nanotechnology" and in what year? (a) Richard Feynman, Physicist (1959) (b) Norio Taniguchi, Materials Scientist (1974) (c) Arthur C. Clarke, Sci-fi Author (1962) (d) K. Eric Drexler, Engineer (1986)
Answer: (b) Norio Taniguchi, Materials Scientist (1974)