| Technical Paper |
Turning Printed Circuit Boards Into Printed Circuit Structures Using 3D Printing
Tightly packaged circuits are utilizing such approaches as multi-chip modules or multi-layer printed circuit boards to obtain more function per volume. This paper will go over nScrypt's approach from PCB to PCS.
nScrypt, Inc.
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TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology, Inc.
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