| Sponsor |
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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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| Technical Paper |
Oven vs Product Profiling
A simple alternative to conventional "golden board" profiling offers quality assurance and repeatability for high-mix, low-volume manufacturing operations.
ECD
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