Stacy Kalisz Johnson

Americas Marketing Development Manager

Agilent Technologies

Ms. Johnson's entry into the electronic packaging arena was as a Package Development Engineer. Stacy recently joined the Americas Field Marketing Organization as a Marketing Development Manager for the Americas where she continues to work on AOI, AXI and also In-Circuit Test. NOTE: Ms. Johnson is no longer working at Agilent Technologies.

Stacy Kalisz Johnson has submitted responses to the following questions.

Inspecting DFN (Dual flat no lead) Packages
Thinking of test from a structural perspective, this is a hidden joint and that makes it a viable candidate for ...

Why switch from 2D to 3D vision inspection
The main difference from a technological standpoint in 2D versus 3D system is the imaging chain utilized to capture the ...

Advantages of in-line-test
There are many advantages to in-line test processes. Speed and coverage would probably, in my opinion, be the largest advantages. ...

AOI inspection using algorithm vs. image based systems
Algorithm based systems utilize contrast location mechanisms that look for variations in light and dark grays scales to identify the ...

AOI or X-Ray inspection?
As an AOI and AXI equipment supplier, Agilent is often asked this question. The answer is that it depends upon ...

Double sided SMT
The number of variables associated with SMT processing of a single-sided board is staggering. Adding a 2nd side makes the ...

Books or Publications of today's electronics assembly
The Printed Circuits Handbook Fifth Edition, Coombs is a great resource that might be of use. I have used it ...

Solder Paste Inspection
As you observed, there are paste inspection solutions to meet every need. Focusing on the "need" should guide you to ...

ICT testing after assembly
For In-Circuit Test (ICT), an OSP finish on conventional test pads is a source of connectivity problems where test probes ...