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May 29, 2007 - Updated July 4, 2007 - Originally Posted ICT testing after assemblyIs there any efficient testing method for ICT testing after assembly? The surface finishing is OSP. Will this induce poor contact for the probes on the test point? What kind of test probes can we select to improve first pass yield? MingWang Lee |
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| Expert Panel Responses | |||||||
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For In-Circuit Test (ICT), an OSP finish on conventional test pads is a source of connectivity problems where test probes sometimes have trouble getting good contact. To avoid this, one consideration would be utilizing Bead Probe Technology as an alternative. More details on how bead probes can be of benefit can be found on our website.
Americas Marketing Development Manager Agilent Technologies Ms. Johnson's entry into the electronic packaging arena was as a Package Development Engineer. Stacy recently joined the Americas Field Marketing Organization as a Marketing Development Manager for the Americas where she continues to work on AOI, AXI and also In-Circuit Test.
NOTE: Ms. Johnson is no longer working at Agilent Technologies. |
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