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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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| Ask the Experts |
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May 29, 2007 - Updated
July 4, 2007 - Originally Posted
ICT testing after assembly
Is there any efficient testing method for ICT testing after assembly?
The surface finishing is OSP. Will this induce poor contact for the probes on the test point?
What kind of test probes can we select to improve first pass yield?
MingWang Lee
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| Expert Panel Responses |
For In-Circuit Test (ICT), an OSP finish on conventional test pads is a source of connectivity problems where test probes sometimes have trouble getting good contact. To avoid this, one consideration would be utilizing Bead Probe Technology as an alternative.
More details on how bead probes can be of benefit can be found on our website.
Stacy Kalisz Johnson
Americas Marketing Development Manager
Agilent Technologies
Ms. Johnson's entry into the electronic packaging arena was as a Package Development Engineer. Stacy recently joined the Americas Field Marketing Organization as a Marketing Development Manager for the Americas where she continues to work on AOI, AXI and also In-Circuit Test.
NOTE: Ms. Johnson is no longer working at Agilent Technologies.
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