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August 10, 2017 - Updated
July 4, 2007 - Originally Posted

Books or Publications of today's electronics assembly



I am an old electronics technician and I have a question. Are there books or other publications that I can read to update my electronics fabrication knowledge? Can you offer advice?

R.T.

Expert Panel Responses

Here are a few reads, in order of difficulty. SMT Principles and Practice - By Ray Prasad Electronics Packaging and Interconnection Handbook - By Harper Electronics Packaging Handbook - By Blackwell Fundamentals of Microsystems Packaging - By Tumulla

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Bjorn Dahle
President
inspīre solutions LLC
Bjorn Dahle is the President of inspīre solutions LLC. He has 20 years experience in the electronic manufacturing industry with various manufacturing equipment companies covering pick & place, screen printers and thermal process management.

Join the Surface Mount Technology Association and then you can use their website.

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Edward Zamborsky
Regional Sales Manager
OK International Inc.
Ed Zamborsky is a Regional Sales & Technical Support Manager for Thermaltronics, located in New York. His position requires frequent customer visits throughout North America and the Caribbean and his position encompasses not only sales but the role of trainer and master applications engineer for all of Thermaltronics products. His expertise includes such specialties as hand soldering, convection and conduction reflow techniques, array rework, fluid dispensing equipment, and fume extraction. Ed has authored many articles and has presented many papers on topics such as; Low Volume SMT Assembly, Solder Fume Extraction, SMT Rework, BGA Rework, Lead-Free Hand Soldering, High Thermal Demand Hand Soldering, Lead Free Visual Inspection and Lead Free Array Rework.

There are many books and publications which can supply the information you are looking for relative to electronic fabrication,I would also highly recommend doing a search on attached Amazon site. Solders and Soldering, and you will get more references to as much material as you can absorb.

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Leo Lambert
Vice President, Technical Director
EPTAC Corporation
At EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee.

The Printed Circuits Handbook Fifth Edition, Coombs is a great resource that might be of use. I have used it throughout my career as reference textbook.

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Stacy Kalisz Johnson
Americas Marketing Development Manager
Agilent Technologies
Ms. Johnson's entry into the electronic packaging arena was as a Package Development Engineer. Stacy recently joined the Americas Field Marketing Organization as a Marketing Development Manager for the Americas where she continues to work on AOI, AXI and also In-Circuit Test.
NOTE: Ms. Johnson is no longer working at Agilent Technologies.

Here are two links that might be helpful. SMTA Bookstore IPC If there are any questions or if additional information is needed, please feel free to ask.

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Marc Peo
President
Heller Industries Inc.
Mr. Peo has been with Heller Industries for over 20 years and has been President for the past 8 years. Marc has authored several industry articles on Soldering, Flux collection, nitrogen use and Lead Free conversion.

You may wish to consider taking the SMTA's class for certification in SMT Assembly. It would quickly provide you a good beginning understanding of at least the SMT assembly processes. www.smta.org/certification

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Richard D. Stadem
Advanced Engineer/Scientist
General Dynamics
Richard D. Stadem is an advanced engineer/scientist for General Dynamics and is also a consulting engineer for other companies. He has 38 years of engineering experience having worked for Honeywell, ADC, Pemstar (now Benchmark), Analog Technologies, and General Dynamics.
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