Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Smaller Components and Increasing Placement Density

Big Data is the foundation for Industry 4.0, so advanced inspection systems must evolve from simply judging "Pass/Fail" tools into highly intuitive, dynamic decision-making systems, which emphasizes the need for reliable, traceable data.

Koh Young Technology Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura