Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

The Critical Role of RHSD in High-Reliability Applications

Robotic hot solder dip processing is essential for gold finish removal, tin whisker mitigation, BGA deballing, plus tin-lead and lead-free component refurbishing.

Hentec Industries, Inc. / RPS Automation, LLC.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura