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Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies.
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Industry Paper

The Critical Role of RHSD in High-Reliability Applications

Robotic hot solder dip processing is essential for gold finish removal, tin whisker mitigation, BGA deballing, plus tin-lead and lead-free component refurbishing.
Hentec Industries, Inc. / RPS Automation, LLC.
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