| Industry Paper |
Electroless Copper Coverage in Small BVH for Fine Pattern SAP
Paper investigates additives suppressing surface electroless copper, improving permeability of plating solution into BVH. Two additives tested significantly improved plating uniformity in small BVHs.
Uyemura International Corporation
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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