July 10, 2026

The Mall That’s All Things Electronic Shenzhen's Huaqiangbei, widely regarded as the world's largest electronics market, showcases the entire electronics supply chain, from components to finished products. The vast marketplace offers unique gadgets, negotiable prices, and hard-to-find devices that attract hobbyists, manufacturers, and tech enthusiasts alike. Design News

Sponsor Built to Scale. Proven in Production. Microsystems World CNC boosted throughput and automation by trading up to a complete inline SMT solution—powered by Manncorp and designed for long-term growth. Manncorp Inc.

What AI companies want for the millions they’re spending on elections AI political action committees have spent at least $44 million backing 2026 midterm candidates, aiming to shape future federal AI regulation. With more than $200 million raised, the industry is emerging as a powerful force influencing Congress's approach to AI policy. CNBC

Digital Warehouse Automation in High-Mix PCB Assembly High mix SMT production demands full material visibility. This white paper shows how ASTER improved traceability, inventory accuracy and FIFO control through integrated automation and reel-level tracking across warehouse operations. Technical Paper

India removes import duty on some electronics, smartphone parts India has eliminated 5% and 7.5% import duties on select components used in mobile phones and electronic devices, lowering manufacturing costs and supporting domestic production. The move is expected to benefit global manufacturers, including Apple and Xiaomi, while strengthening India's electronics industry. Reuters

Sponsor AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives 240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity. AI Technology, Inc.

As AI Moves from Training to Inference, Optics Moves Closer to the Chip As AI inference scales, networking—not compute—has emerged as a critical bottleneck. Imec says future AI systems will require advanced optical interconnects, including 2.5D optical I/O, to reduce latency, improve bandwidth, lower power consumption, and support massive GPU communication. EE Times

Complex Board Design Induced Solder Separation Failure The study elaborates the parameters with the solder separation failure per board design configuration, and also provides the potential solution to mitigate the failure. An in-depth analysis on the solder joint microstructure utilizing Electron-backscattered diffraction (EBSD) supports the test results leading to the mechanism associated with the solder separation failure. Technical Paper

Technical Papers ■ Flux-Free, Reliable, Efficient: Soldering with Formic Acid ■ Redesigning Material Logistics for High-Mix EMS Production ■ Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education ■ Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You ■ Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse ■ Digital Warehouse Automation in High-Mix PCB Assembly ■ Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses ■ Scaling SMT Traceability ■ The Drawbacks of Internal Recycling Systems for Solder Dross ■ Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics MORE TECHNICAL PAPERS

Sponsor Is My PCB Wash Concentration in Check Evaluating wash concentration levels through varying testing methods can potentially save process time, reduce overall process costs, and increase cleaning efficacy on PBCs. Read more. KYZEN

Power electronics at a turning point, says Yole Yole Group says the global power electronics industry is shifting from rapid expansion to competitiveness, cost optimisation, and consolidation amid overcapacity and pricing pressure. Despite challenges, the power device market is projected to grow 7.1% annually to reach $41.3 billion by 2031, with Chinese firms gaining market share. Compound Semiconductor

India's PCB exports to China a rare success story India's printed circuit board exports surged more than 20-fold to $1.9 billion in FY26, driven by a 40-fold jump in shipments to China. The increase reflects India's expanding PCB manufacturing capacity as China increasingly sources lower-value electronic assemblies from Indian suppliers. Rediff

Vapor Phase and Backward Compatibility We use lead-free solder paste with a melting point of 217 degrees C, along with 230 degree C Galden. We have a new project that uses tin-lead solder. The Assembly Brothers, Phil Zarrow and Jim Hall, offer their suggestions. Board Talk

Sponsor Optically Clear Nanosilica Filled Epoxy Master Bond EP4NS-80 is a low viscosity epoxy for bonding and sealing that possesses excellent dimensional stability, low CTE and minimal shrinkage upon curing. Master Bond

White House Executive Order Brings New Urgency to Post-Quantum Cryptography A new White House executive order accelerates the shift to post-quantum cryptography, pushing government agencies and contractors to modernize encryption sooner. The move increases pressure on organizations to inventory cryptographic assets and prepare for quantum-resistant security. EE Times

A China shock is shaking Silicon Valley Chinese open-weight AI models are rapidly challenging U.S. leaders by offering lower costs, greater flexibility, and strong performance. The commentary urges Silicon Valley to strengthen open AI ecosystems, invest in research, and compete through innovation rather than restrictions. Taipei Times

The Next Generation of Si-Interposers This paper explores the next generation of silicon interposers, focusing on the technical advantages of using thicker interposers[1] with larger TSVs, specifically 50μm in diameter and 300μm in length. These larger TSVs offer several benefits, including enhanced electrical interconnectivity. Technical Paper

Sponsor Achieve Reliable BGA Rework with Expert Reballing Methods BGA reballing requires precision, process control, and proven techniques. Manufacturers improve rework quality and maximize BGA reliability with proven reballing practices. Circuit Technology Center

This former Apple executive is betting on Shenzhen, not Silicon Valley, to create the ‘next Apple’ Even Realities CEO Will Wang argues Shenzhen—not Silicon Valley—offers the best environment to build the next Apple. He cites China's unmatched hardware talent, manufacturing ecosystem, and faster investment climate as key advantages for consumer electronics startups. CNBC

The Ultimate Guide to PCI Express: Specs, Features, Use Cases and PCIe 7.0 PCI Express continues to power high-speed computing by delivering scalable, backward-compatible connectivity for processors, GPUs, storage, and networking. The guide explains PCIe 7.0’s doubled bandwidth, key technologies, and growing role in AI, cloud, HPC, and data-intensive applications. Semiconductor Engineering

Sponsor Your Domestic PCB Solution Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on. Summit Interconnect

What was the first consumer device powered by a Li-ion battery? Sony's CCD-TR1 Handycam became the first consumer device powered by a lithium-ion battery, marking a breakthrough in portable electronics. Sony's innovation delivered lighter, longer-lasting batteries, paving the way for lithium-ion technology to transform smartphones, laptops, electric vehicles, and other mobile devices. TechSpot

Solid-State Diffusion between Rolled Cu and Electroplated Matte-Sn System This study focusses on the IMC phase growth in rolled Cu- electroplated Sn system during the temperature range from 398K to 473K. Technical Paper

Worker shortage endangers US chip production plans A severe US shortage of skilled semiconductor workers could delay billions of dollars in chip plant investments and limit future production. A new report urges continued government funding, industry collaboration and stronger engineering education to close a projected 157,000-worker gap by 2030. Taipei Times

Rise of the AI Data Center – Why Infrastructure Strategy Is Now a Board-Level Issue The white paper explains how AI-driven data centers can overcome power, scalability and infrastructure challenges through resilient power architectures, modular deployment and microgrid strategies. It helps organizations improve compute reliability, reduce total ownership costs and accelerate AI infrastructure expansion. EE Times

Sponsor 3 Ways to Increase Plasma Uniformity Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more. Plasma Etch

Automotive, healthcare, consumer electronics to drive CEM market The electronics manufacturing services market is expected to grow from $648.5 billion in 2025 to $853.1 billion by 2030 at a 5.6% CAGR, driven by rising demand for advanced electronics, automotive electrification, smart manufacturing, and Asia Pacific's expanding role as a global production hub. EP&T