Aug 28, 2026 Taiwan's Foxconn Buys California Property for AI Expansion Foxconn's Q-Edge bought a Santa Clara factory and land for US$55.25 million, strengthening its AI business. The site near Nvidia, AMD and Intel could support joint research, while Foxconn expands operations across the US and other markets. Taiwan News

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Here's how many foldable iPhones IDC expects Apple to ship in one year Apple's expected foldable iPhone could exceed 10 million shipments in its first year, according to IDC. Despite its estimated $2,500 price, Apple's entry could accelerate foldable market growth and eventually capture 40% of global shipments by 2027. 9 To 5 Mac

Redesigning Material Logistics for High-Mix EMS Production High mix electronics manufacturing requires reliable material management. This white paper explains how BMK enhanced traceability, inventory accuracy and picking efficiency using integrated automated storage, digital workflows and reel-level visibility. Technical Paper

The Hidden Supply Chain Risk in Smart Electronics As electronics shrink and run hotter, manufacturers must specify materials earlier. Adhesives, thermal materials and encapsulants shape scalability, reliability and compliance, while late choices can drive costly problems across the lifecycle. Industrial Equipment News

Sponsor Training for Certified IPC Specialists BEST's 7711 Training Rework Kit is designed for certification/re-certification of Certified IPC Specialists (CIS) so employees can be tested for speed, accuracy and quality. BEST Inc

Nvidia bullish over sales outlook Nvidia projects roughly 70% revenue growth in fiscal 2028, surpassing analysts' 45% forecast and easing AI bubble concerns. Strong data-center demand and Vera Rubin chip production fuel optimism, although rising memory costs could pressure margins. Taipei Times

Solder Paste and the 5 Ball Rule For either Type III or Type IV solder paste, should there be a minimum number of solder spheres deposited on each surface mount pad? The Assembly Brothers, Jim Hall and Phil Zarrow, answer this question. Board Talk

Technical Papers ■ UHDI Fabrication for IC Substrates: SAP and mSAP Processes ■ Flux-Free, Reliable, Efficient: Soldering with Formic Acid ■ Redesigning Material Logistics for High-Mix EMS Production ■ Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education ■ Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You ■ Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse ■ Digital Warehouse Automation in High-Mix PCB Assembly ■ Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses MORE TECHNICAL PAPERS

Sponsor "Ask the Experts" Program by Circuitnet Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now. Circuitnet Media LLC

Apple confirms September 9 event, where its first foldable iPhone and iPhone 18 Pro are expected Apple will host its September 9 event to unveil new Pro iPhones and potentially its first foldable iPhone. The company may also stagger future iPhone launches, signaling a significant shift in its hardware strategy under incoming CEO John Ternus. TechSpot

Martha Stewart Reveals Her Must-Haves for Driverless Car Rides: 'This Is the Future' Martha Stewart, 85, praises Waymo's new Ojai self-driving vehicle for its spacious, private and comfortable design. She highlights its ability to work, make calls and enjoy entertainment safely while traveling, calling autonomous travel a convenient, home-like experience. Yahoo!

Electrochemical Reliability as a Function of Component Standoff The purpose of this paper is to research the activity of flux residues as a function of the standoff height using insulation resistance. Technical Paper

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Bill Gates says tech executives are privately terrified of AI, but won't say it publicly Bill Gates is urging governments to impose enforceable AI rules, including worker-replacement taxes, protected jobs and mandatory safety testing. He warns rapid advances could worsen job losses and biological threats, arguing voluntary safeguards can no longer manage the risks. TechSpot

After Meta's landmark settlement with state AGs, legal headaches remain Meta agreed to a $16.7 billion settlement with 51 state attorneys general over social media addiction claims involving minors. The deal requires stricter age verification, teen usage limits and nighttime blocks, but ongoing lawsuits and potential regulations remain. CNBC

Innovative BGA Defect Detection Method for Transient Discontinuity This paper summarized the development of this innovative in-situ, real time methodology, which is capable of detecting BGA transient discontinuity. Technical Paper

Sponsor Eliminate Worry of Cross Contamination While Models 529 and 1550 are similar semi-automatic cleaners with single wash and rinse tanks, the Model 2003 includes 2 wash tanks for cleaning multiple applications in one machine. Smart Sonic

NDAs are hiding data center deals, drawing ire from locals — and attention from lawmakers Louisiana residents are challenging secretive data center negotiations after NDAs concealed details of a $3.6 billion project. Residents fear higher utility costs and environmental impacts. Officials and developers defend confidentiality as essential for attracting major AI investments. NPR

Apple Unveils M6, Its First 2nm Chip Built by TSMC Apple debuts M6 and M5 Ultra chips, pairing stronger CPU/GPU performance with major on-device AI gains. Built on TSMC's 2nm process, M6 validates N2 production, while M5 Ultra's quad-die design boosts bandwidth for demanding AI workloads. TrendForce

Sponsor Gripping Systems from micro assembly to heavy lifting The first industrial-suited grippers from SCHUNK were a milestone. Since then we have brought countless newly and further developments to market. SCHUNK

Why Connectivity Has Become an Edge AI Design Decision Edge AI is converging compute, sensing, security and connectivity to power smarter devices. Wi-Fi 7 delivers low-latency, resilient links, while hybrid edge-cloud architectures improve responsiveness, efficiency, reliability and data privacy. EE Times

Status and Outlooks of Flip Chip Technology Status of flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill is presented in this study. Technical Paper

Kodak Invented the Future — But Couldn't Let Go of Its Past. Here's How to Avoid the Same Trap. In 1975, Kodak engineer Steven Sasson created the world's first digital camera, a bulky 4-kilogram prototype that captured 0.01-megapixel black-and-white images and needed more than 20 seconds to save each photo. Entrepreneur

Thailand shifts focus to high-value electronics and supply chain resilience Thailand's electronics sector has attracted over $30.5 billion in investments since 2023, increasingly targeting PCBs, AI hardware and advanced semiconductor packaging. The country is strengthening supply chains, skilled talent and infrastructure to become an electronics hub. Global Sources

Sponsor Optimize Your Process on Full SMT Demo Line Validate your process in our demo lab. Our full line—printing, P&P, reflow, and AOI—is ready to optimize your profile and prove performance. Send us your boards to start. Heller Industries

Meta's $18B child-safety deal hinges on age-verification tech that doesn't work well Meta agreed to an $18 billion settlement with 52 attorneys general over child-safety allegations. Instagram and Facebook will add screen-time limits and overnight restrictions, while age verification raises ongoing privacy and effectiveness concerns. TechCrunch