circuitnet
Sponsor
AI Technology, Inc.
Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
Ask the Experts
Delamination After V-cut
We have a problem with delamination after breaking our board from a multi-up panel. The material is cem3-V0. The ...
Responses by:
Georgian Simion
Engineering and Operations Management, Independent Consultant
Leo Lambert
Vice President, Technical Director, EPTAC Corporation
Allowable Bow and Twist on Round PC Fab
Is There a Spec for LDI Mask thickness?
Production Floor Temperature and Humidity Loggers
How To Reduce Solder Joint Voids in QFN Components
Reduce Glare During Assembly
MORE ASK THE EXPERTS
Essential Practices for Gold Mitigation of Electronic Components
Sponsor
Smart Sonic
440-R + Ultrasonics = Safe & Efficient Cleaning
Clean any type of solder paste in the same machine using 440-R-SMT Detergent. It is the one detergent that will do it all: stencils, pallets, misprints & SMD adhesives.
Smart Sonic
Industry Calendar
Oct 1, 2026: Long Island Expo & Tech Forum
Oct 7, 2026: Guadalajara Expo & Tech Forum
Oct 25, 2026: SMTA International Conference & Exposition
Oct 27, 2026: NEPCON ASIA 2026
Apr 5, 2027: APEX EXPO 2027
FULL INDUSTRY CALENDAR
Process Assessment Engineer
Sponsor
Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
What Year Was It?
The day was Sep 22. What year was it?
Lincoln Issues Emancipation Proclamation
What Year
President Abraham Lincoln issues a preliminary Emancipation Proclamation, which sets a date for the freedom of more than 3 million black slaves in the United States and recasts the Civil War as a fight against slavery.
See the answer below.
Sponsor
Uyemura
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Test Your Boards on a Full SMT Line
What Year Was It Answer
Lincoln Issues Emancipation Proclamation
Answer: September 22, 1862
Sep 22, 2026
image
iPhone 18 Pro Teardown Highlights Mechanical Camera Aperture and a Major Thermal Redesign
iFixit's teardown of Apple’s iPhone 18 Pro models reveals a variable-aperture camera, improved cooling, and easier battery replacement access. However, fragile display components and complex camera repairs limit serviceability, earning the phones a provisional 7/10 repairability score.
TechSpot
Sponsor
SCHUNK
Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK
Singapore: Turning Quantum Research into Business Opportunity
Singapore is accelerating quantum commercialization with government funding, research infrastructure, semiconductor capabilities and talent programs. Its National Quantum Strategy advances computing, fabrication, sensing and communications.
EE Times
Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education
KYZEN Corporation and the Rochester Institute of Technology (RIT) have established an academic-industry collaboration to integrate real-world electronics manufacturing challenges directly into engineering education.
Technical Paper
OpenAI proposes development of global AI standards to guide alignment, RSI
OpenAI proposed international frontier AI safety standards, calling for alignment research, cautious recursive self-improvement and independent evaluations. It warned autonomous RSI could erode human control and urged developer cooperation.
CNBC
Sponsor
KYZEN
Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN
AI Power Demands Push GaN into Data Center Design
AI's rapid power demands are pushing data centers beyond silicon's limits. GaN offers higher switching frequencies, greater power density and improved efficiency, supporting 800-V architectures and thousands of amperes as AI GPUs approach 5-kW power consumption.
EE Times
Recommended Board Spacing During Reflow
When running boards through a re-flow oven, should there be a gap between boards, or can they run end-to-end? The Assembly Brothers, Jim Hall and Phil Zarrow, discuss this question.
Board Talk
Technical Papers

Oxide Reduction for Reliable Electronics Manufacturing
UHDI Fabrication for IC Substrates: SAP and mSAP Processes
Flux-Free, Reliable, Efficient: Soldering with Formic Acid
Redesigning Material Logistics for High-Mix EMS Production
Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education
Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse
Digital Warehouse Automation in High-Mix PCB Assembly
MORE TECHNICAL PAPERS
Sponsor
AI Technology, Inc.
Corrosion, UV Protection for Power Transmission
Moisture, corrosive gas, oxidation & UV blocking prop-erties. FLUOROSEAL® conformal coating for electrical contacts & ceramic insulator protection.
AI Technology, Inc.
Taiwan can help set standards in AI race
AI's rapid progress forces the US to balance safety against competition with China. As leading executives urge caution, Taiwan faces growing geopolitical pressure and should help shape international rules for AI safety, computing governance, and semiconductor traceability.
Taipei Times
US and China consider making AI channel
US and Chinese officials explored an AI dialogue and notification mechanism for national-security incidents, seeking limited cooperation despite rising tech tensions. Talks also covered trade, critical minerals, farm purchases and a Trump-Xi summit.
Taipei Times
Soft Intelligence Epidermal Communication Platform A Path to A Wearable Future
Wearable electronics will need to be stretchable to a considerable degree which in turn will require an adjusted production strategy for the commercial manufacturing of the products.
Technical Paper
Sponsor
Ormet® TLPS
AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C.
Ormet® TLPS
Microsoft to double data centers in Taiwan
Microsoft plans to double its Taiwan data centers from two to four, mainly in the north, to address persistent capacity shortages. The company also expands Azure services and develops custom ASICs to support growing AI inference workloads and reduce computing costs.
Taipei Times
The Invention of Facial Recognition Technology Traces Back to the 1960s
Woodrow Wilson Bledsoe pioneered computer-based facial recognition in the 1960s by measuring facial features and matching them with databases. Later researchers, including Takeo Kanade, advanced the technology, laying foundations for today's systems.
BGR
Corrosion and Contaminant Diffusion Multi-Physics Model
Models for copper interconnect degradation are needed for life prediction modeling to ensure 10-year, 100,000 mile reliability for automotive applications.
Technical Paper
Sponsor
Nordson Electronic Solutions
actnano Materials with Nordson Equipment
actnano's PFAS-free, cure-free coatings save energy and boost safety. And they are compatible with Nordson conformal coating systems. Upgrade your system today. Learn more!
Nordson Electronic Solutions
This Digital Radio Gets Messages to the World's Remotest Locations
Rhizomatica's HERMES boosts shortwave communications with faster digital data rates and encryption over HF frequencies. The open-source system helps remote communities in Bangladesh, Brazil and Ecuador connect globally with minimal infrastructure.
IEEE Spectrum
Scaling Physical AI Deployment Beyond the Demo
Vision-Language-Action models enable robots to understand environments, follow natural-language commands and adapt dynamically. Deployment still requires optimized inference, real-time control, heterogeneous computing and scalable software across diverse robotic platforms.
EE Times
Sponsor
Viscom SE
SMTA Mexico – vAI ProVision
vAI ProVision: Smarter Inspection Programming Discover vAI ProVision by Viscom at SMTA Mexico, Booth: 343. Using proven inspection strategy and AI, it creates optimized inspection programs faster, reducing workload and enhancing reliability.
Viscom SE
Design Once, Reuse Forever: The Reconfigurable Analog Front End
AnalogPAK combines programmable analog and digital functions to let engineers reuse and scale sensor designs without hardware changes. Gain, filtering, compensation and thresholds support multiple sensors while reducing components, cost and development time.
EE Times
Challenges on ENEPIG Finished PCBs
Through extensive investigation, using 8D and Kepner-Tregoe problem solving methods, solutions were discovered in the majority of cases.
Technical Paper
US and China could start warning each other about dangerous AI incidents under new proposal
The US and China plan an AI risk notification system to flag incidents with national security implications. The proposal follows an AI-generated intelligence error that nearly triggered a US military confrontation with a Chinese vessel.
TechSpot
Gartner Predicts 60% of Organizations That Ignore Data Governance Culture Challenges Will Fail to Govern AI Successfully by 2027
Gartner warns that by 2027, 60% of organizations neglecting data governance culture may fail to govern AI successfully. Cultural resistance, weak stakeholder engagement and low data maturity increasingly undermine governance, making people and accountability as crucial as technology.
Gartner
Sponsor
Viscom
Discover the power of vAI ProVision from Viscom
Create and optimize 3D AOI and AXI programs in minutes. vAI ProVision boosts inspection depth, quality, and speed. Viscom develops & produces premium inspection systems.
Viscom
Having the Latest AI Model Can Actually Be a Bad Business Decision. Here’s How to Know When an Upgrade Is Worth It.
Companies should weigh AI model gains against testing, deployment, monitoring and engineering costs. Slightly higher accuracy may not improve business outcomes, making production readiness dependent on real-world performance, not offline benchmarks alone.
Entrepreneur
Today's Sponsor
Sponsor
Sponsor
Indium Corporation
Stop paying for silver you don't need!
Stop paying for silver you don't need! Visit indium.com to learn how Indium Corporation's low-silver alloys paired with award-winning flux deliver the performance you need.
Indium Corporation
Test Your Knowledge
What is quicksilver?
See answer below.
Industry Press
LPMS USA to Highlight Local Supply and Simplified Electronics Protection at SMTA Guadalajara
LPMS USA will exhibit at the SMTA Guadalajara Expo & Tech Forum, October 7–8, 2026, at Expo Guadalajara. At Booth #347, LPMS will highlight low ...
LPMS USA
ViTrox to Showcase AI-Driven Smart Manufacturing & Vision Inspection Innovations at SMTA Penang 2026
ViTrox is pleased to announce its participation in SMTA Penang 2026. The exhibition will be held from 23 to 24 September 2026 at the Iconic Marjorie Hotel ...
ViTrox Technologies Sdn Bhd
VJ Electronix to Highlight Summit LT150 Rework System at SMTA Long Island Expo
VJ Electronix will feature its Summit LT150 semi-automated rework system at the SMTA Long Island Table-Top Expo, scheduled for Thursday, Oct. 1, 2026, ...
VJ Technologies
YINCAE Brings New Advanced Materials to IMAPS 2026
IMAPS 2026 is less than two weeks away, and we invites you to visit Booth #408 to discover our latest material innovations and discuss your most challenging applications ...
YINCAE Advanced Materials, LLC
ICTC Philippines Expands Manufacturing Capabilities with New Facility in Laguna
Interconnect Cable Technologies Corporation (ICTC) is proud to announce that ICTC Philippines has reached a significant milestone with the opening ...
Interconnect Cable Technologies Corporation (ICTC)
CE3S Expands Product Portfolio to Deliver More Comprehensive Sourcing Solutions for Electronics Manufacturers
CE3S will showcase its expanded portfolio of electronics manufacturing products and solutions at the SMTA Long Island Expo on Oct. 1, giving electronics ...
Cumberland Electronics Strategic Supply Solutions (CE3S)
Experience Laser Technology Live: IPG Photonics at EuroBLECH 2026
IPG Photonics will present new solutions and demonstrate live how modern laser technologies can improve precision, speed, and cost-effectiveness in sheet metal ...
IPG Photonics Corporation
MORE INDUSTRY PRESS
Thermal Cycle
Sponsor
Heller Industries
Precision Thermal Control for High-Reliability SMT
Achieve ultra-uniform temperature control with low mass heater technology. Perfect your soldering profiles and save floor space with our compact, high-efficiency systems.
Heller Industries
Quote of the Day
"All exact science is dominated by the idea of approximation."
Bertrand Russell
Sponsor
Glenbrook Technologies
Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
Glenbrook Technologies
M804
Cartoon of the Day
Cartoon
"As soon as we solve one problem, another one appears. So let's keep this problem going for as long as we can!"
Copyright © Randy Glasbergen
Sponsor
AIM Solder
Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Viscosity is a useful solder paste quality control measurement, but rheology provides a more complete understanding of how paste will roll, fill, release, recover, and remain stable during stencil printing.
AIM Solder
Low-Silver Solder Alternatives
Test Your Knowledge Answer
What is quicksilver?
Answer: Mercury