April 21, 2026

Chipmakers on track to meet only 60% of AI memory demand by 2027 Big Tech and hyperscalers aggressively buy memory chips for AI, intensifying a structural shortage. Analysts expect supply will lag demand until at least 2027–2030 as manufacturers expand capacity, prioritise high-bandwidth memory, and leave consumer chip performance increasingly constrained. TechSpot

Sponsor Future-Ready Bonding Technology ZTACH® ACE Anisotropic Conductive Epoxy – Cures under reflow or UV and can be a replacement for solder, ACF, ACA, and wire bonding. No underfilling required. Find out more. Action Integrated Resources

Apple announces historic leadership transition: John Ternus to become CEO, Tim Cook to assume executive chairman role Apple announced a major leadership transition effective September 1, 2026, naming John Ternus as CEO after Tim Cook’s 15-year tenure. Cook will move to executive chairman as Apple reshapes its executive structure and succession planning. Digitimes

Optimizing BGA Rework: Challenges, Techniques and Quality Control The complexity of BGA packages introduces challenges during rework requiring innovative methods and inspection practices to ensure performance and reliability. This paper outlines best practices for removing and replacing BGAs. Technical Paper

Computing power behind driverless cars could cancel out the advantages Autonomous vehicles may cut tailpipe emissions through efficient driving and reduced traffic, but CR Legal Team research warns their heavy AI computing could offset gains. Rising data centre energy demand suggests net environmental benefits depend on rapid infrastructure decarbonisation and efficiency improvements. Digital Journal

Sponsor Vapor Phase Profiling Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more. ECD

Apple CEO Tim Cook Is Stepping Down - Here's Who Is Taking His Place Apple CEO Tim Cook will step down after nearly 15 years and become executive chairman on September 1, 2026. Hardware chief John Ternus will succeed him, while Apple promotes Johny Srouji to chief hardware officer amid broader leadership reshuffle. BGR

Cu Conductive Paste as Via Filling Materials for Various Substrates In this study, we developed a Cu paste that can be used as a filling material for through silicon via (TSV), through glass via (TGV), and organic substrates. Technical Paper

Technical Papers ■ Scaling SMT Traceability ■ The Drawbacks of Internal Recycling Systems for Solder Dross ■ Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics ■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible ■ PCB Rework Evolves, With X-ray a Constant Support ■ How pH Cleaning Agents Affect Production Performance ■ A Universal AI-Powered Segmentation Model for PCBA & Semiconductor ■ RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG ■ High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin ■ Understanding Solder Dross: Causes and Control Strategies MORE TECHNICAL PAPERS

Sponsor Depaneling machine for separating circuit boards SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling. SCHUNK

Apple taps John Ternus as CEO to replace Tim Cook, who will become chairman Apple appoints hardware chief John Ternus as CEO, replacing Tim Cook on Sept. 1. Cook shifts to executive chairman while overseeing a smooth transition. Ternus joins the board and inherits leadership amid AI competition and operational challenges. CNBC

Why I Take a ‘Roll up Your Sleeves’ Approach to Leadership – And How it’s Paying Off A CEO traveled to work closely with teammates to streamline priorities and projects. He emphasized that such collaboration reflects his leadership style, focused on coaching and guidance rather than control, empowering employees to manage workloads effectively. Entrepreneur

The Effect of Sb and Ag Addition on the Behavior of Sn-Bi LTS This study focuses on the changes in melting and solidification behavior of near-eutectic Sn-Bi alloys with Sb (0.5-2wt%) and Ag (0-1wt%) additions. Technical Paper

Sponsor Scoring Big With Glenbrook's Real-Time X-Ray Inspection Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more Glenbrook Technologies

Resilience must be multilateral Washington and Tokyo expand Indo-Pacific cooperation through a US$50 billion initiative as rising China pressure and alliance volatility expose limits of bilateralism. They push multilateral frameworks to improve coordination, strengthen deterrence, and reduce miscalculation risks, especially for Taiwan. Taipei Times

Man and machine Hannover Messe 2026 in Hanover, Germany, showcases humanoid robots from Agile Robots as Brazil leads as partner country promoting sustainable industrial transformation and renewable energy, attracting around 4,000 exhibitors and over 123,000 visitors from 150 countries. Taipei Times

Opens With Assembled QFN Components We are experiencing opens on assembled QFN components at a rate of 9%. The failure only appears in rows near the component center. What is happening? Board Talk

Sponsor Latest 3D AOI System from Viscom iS6059 PCB Inspection Plus. Its new and faster sensor technology, data processing and analysis functions all stand for the best 3D AOI performance that meets the highest requirements. Viscom

Japan companies hit by aluminum shortage Disrupted Middle East shipping routes amid the Iran conflict are squeezing Japan’s aluminum supply, forcing automakers to cut output and seek alternatives. Prices have surged, inventories are shrinking, and prolonged shortages threaten production halts and wider global supply chain instability. Taipei Times

EDA AI Agents: Intelligent Automation in Semiconductor & PCB Design Semiconductor design is advancing on two fronts: faster engines and smarter engineers. AI-powered EDA tools boost simulation speed, while Siemens introduces Fuse EDA AI to unify workflows, automate decisions, and enhance productivity across the entire chip and PCB design lifecycle. EE Times

Sponsor AIT ORMET® TLPS for Proven Reliability AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C Ormet® TLPS

Why AI Is Redefining the Future of Commercial Power Infrastructure Artificial intelligence is reshaping commercial power infrastructure, pushing systems beyond their original limits. Companies now redesign distribution with modularity, real-time monitoring, and energy storage to handle fluctuating demand, improve efficiency, manage heat, and ensure reliability in high-intensity AI environments. EE Times

Miniaturization of Hearing Aid Electronics Using Embedded Die Packaging This paper examines the use of second generation embedded die packaging to drive further size reduction in custom hearing instruments. Technical Paper

NASA shuts off another Voyager science instrument to save power. The spacecraft is now 15 billion miles from Earth NASA has powered down Voyager 1’s Low-energy Charged Particles instrument to conserve dwindling energy, extending the spacecraft’s deep-space mission. Engineers aim to keep the 1977 probe transmitting rare interstellar data as it continues exploring beyond the Solar System. Sky At Night Magazine

Inside the strategy of Anthropic's CFO as AI spending surges Anthropic accelerates growth as CFO Krishna Rao drives massive fundraising and infrastructure expansion. Backed by Google and Nvidia, the firm invests heavily in compute capacity to meet soaring demand for its Claude AI models. Digitimes

Sponsor Outsourcing Costs More Than You Think Delays, tariffs, and uncertainty come with overseas PCB assembly. In-house production with Manncorp delivers faster builds, tighter control, and long-term stability. Manncorp Inc.

China’s Hesai adds colour to lidar as EV makers race to level up in self-driving tech Hesai Group unveiled a 6D full-colour lidar platform that detects colour to boost object recognition in autonomous driving. Its upcoming ETX sensors promise improved accuracy and spatial intelligence, as the company scales production amid rising demand for self-driving vehicle technology. South China Morning Post