Sep 4, 2026 India's Quantum Journey Goes Beyond the Qubit India will host IBM's Quantum System Two in Amaravati, giving researchers and startups access to advanced quantum computing. The National Quantum Mission will fund indigenous processors, software and infrastructure, accelerating quantum innovation. EE Times

Sponsor Reflow Solderable TIM1 Thermal Grease AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering. AI Technology, Inc.

Intelligent Engineering: From Optimization To AI Modern electronics are driving engineers toward intelligent workflows that combine optimization, automation and AI. Together, these tools systematically explore designs, streamline validation, uncover insights and accelerate decisions while managing rising complexity. Semiconductor Engineeering

UHDI Fabrication for IC Substrates: SAP and mSAP Processes Approach described includes adhesion promotion, direct plating, electroless copper, blind-via filling, trench filling, and solder-resist metallization technologies. Precise control of surface preparation, activation, and copper thickness uniformity improves via coverage and interconnection without excessive roughening. Technical Paper

Magnetic tape storage is booming again, thanks to AI's unquenchable hunger for data LTO magnetic tape is gaining renewed momentum as AI drives explosive data growth. LTO Consortium shipments rose 57% in Q1 2026, while newer LTO-10 technology and demand for affordable, resilient archival storage promise further market expansion. TechSpot

Sponsor Large Component SMT Rework & Repair A Rework System developed to address the increasing size, complexity, and thermal demands of Advanced Electronic Assemblies. Air-Vac Engineering

Is China really a champion of the global south? China seeks greater influence across the Global South as it challenges US dominance, but its trade practices, reluctance to share technology and aggressive diplomacy undermine its leadership claims, revealing a superpower focused primarily on protecting its own interests. Taipei Times

Is No-Clean the Trend for QFN Components? Is there a move to no-clean for QFN components, or will certain technologies have to continue using a traditional cleaning process? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question and share their own experiences and expertise. Board Talk

Technical Papers ■ UHDI Fabrication for IC Substrates: SAP and mSAP Processes ■ Flux-Free, Reliable, Efficient: Soldering with Formic Acid ■ Redesigning Material Logistics for High-Mix EMS Production ■ Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education ■ Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You ■ Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse ■ Digital Warehouse Automation in High-Mix PCB Assembly ■ Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses MORE TECHNICAL PAPERS

Sponsor Image Sensor Packaging: 5 Key Challenges Solved Filter glass sealing, CTE mismatch, fine-pitch processing, warpage control, and outgassing – learn about AEC-Q100-compliant adhesives for automotive image sensor packaging. DELO Industrial Adhesives

Data center spending to reach US$31.6tn by 2050 PwC forecasts global data center spending will reach $31.6 trillion by 2050 as AI demand surges. The US will lead investment, while power availability, semiconductor supply chains and data sovereignty will determine regional winners and constrain infrastructure expansion. Taipei Times

Display Developments Challenge Controllers AMOLED and micro-OLED technologies are transforming displays for smartphones, wearables and AR/VR devices. UMC's advanced eHV DDIC processes enable smaller, brighter, lower-power displays, while its 14-nm platform reduces power by 40% and area by 35%. EE Times

A Novel Conformal Back-Up Material Paper presents a new technology and process in mechanical drill backing material designed to be used in rigid multilayer, rigid-flex and flex circuits. Technical Paper

Sponsor SMTA Mexico – vAI ProVision vAI ProVision: Smarter Inspection Programming Discover vAI ProVision by Viscom at SMTA Mexico, Booth: 343. Using proven inspection strategy and AI, it creates optimized inspection programs faster, reducing workload and enhancing reliability. Viscom SE

Protecting Dynamic Industrial Robot Cable Carriers Tsubaki KabelSchlepp's Robotrax System protects cables and hoses in high-speed robotics by absorbing tensile loads, reducing torsional stress, and preventing collisions. Its flexible three-axis design and adjustable tension extend service life and simplify maintenance. IEEE Spectrum

The Best Way to Explore Lunar Craters Is a Giant Robot Ball Texas A&M researchers are developing RoboBall, an inflatable spherical robot designed to explore hazardous lunar craters. Its unique rolling mechanism, rugged design and improved torque could enable sample collection from inaccessible regions containing ancient geology and frozen water. IEEE Spectrum

Performance and Reliability Requirements of Soldering Fluxes Paper outlines the evolution of flux chemistry and details the challenges in developing flux chemistries for current and future application. Technical Paper

Sponsor Plasma as a Key Technology Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma® & PlasmaPlus®. Plasmatreat GmbH

How Meta will pull off massive changes to its social media apps Meta will pay up to $17 billion over 10 years in a landmark child-safety settlement while introducing stricter teen protections. Changes include two-hour usage limits, overnight app blocking, muted notifications, hidden likes, and stronger age verification. CNBC

The More You Automate, the More Your Business Needs Human Leadership. Here's Why. Automation has moved from experimentation to execution, with 95% of U.S. companies using generative AI. While AI boosts workplace productivity, pay and job security, employee concerns about its future impact highlight a growing gap between efficiency and confidence. Entrepreneur

Sponsor AIT ORMET® TLPS for Proven Reliability AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C. Ormet® TLPS

Retro Tech Thrives in the Digital Age Tech collectors are reviving turntables, cassette players, game consoles, and flip phones, driven by nostalgia and a "cool" factor. Companies now blend retro designs with modern technology, fueling demand for limited-edition vintage-inspired devices. Design News

Voiding Control On Bottom Terminated Components Using Preforms This paper looks at a new approach using readily available solder fortification preforms. Technical Paper

'No steering wheel, no pedals': Tesla teases fans ahead of long-awaited Cybercab update Tesla is advancing its driverless Robotaxi push with Cybercab testing in Austin, featuring vehicles without steering wheels or pedals. Investors expect rapid expansion to challenge Waymo, but safety investigations and limited fleet size remain key concerns. CNBC

Hidden China risks are emerging in America's multibillion-dollar AI data center boom U.S. dependence on China for data-center power gear is raising strategic concerns as AI tensions grow. Chinese suppliers provide transformers, switchgear, batteries and optical technology, risking higher costs and shortages during AI growth. CNBC

Sponsor High power atmospheric plasma system Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength! Plasma Etch

Rad-Hard Electronics Market Set to Reach Almost $3B by 2032 The global radiation-hardened electronics market is expected to grow from $2.04 billion in 2026 to $2.91 billion by 2032 at a 6.1% CAGR, driven by satellite deployments, space exploration, defense modernization and nuclear infrastructure investments. EE Times Asia