May 15, 2026

When Encryption Meets Quantum Quantum computing threatens modern cryptography by breaking RSA & ECC, forcing engineers to redesign security in silicon & key management. With 'harvest now, decrypt later' attacks rising, NIST post-quantum standards and 2027–2030 compliance deadlines drive urgent migration. EE Times

Sponsor Use of Numerical Simulation Methods The use of numerical methods has now become widespread. The implementation of these methods helps to minimize development costs by reducing the number of required prototypes. Download now. Rehm Thermal Systems GmbH

Hon Hai profits hit NT$49.92bn Hon Hai Precision Industry Co posted stronger-than-expected Q1 results as AI hardware demand surged. Net profit rose 19% to NT$49.92 billion, revenue climbed 29% to NT$2.12 trillion, and the company expects continued growth in AI server and related shipments. Taipei Times

PCB Rework Evolves, With X-ray a Constant Support Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years. Technical Paper

Quanta predicts growing AI server quarterly revenue Quanta Computer expects double-digit sequential AI server revenue growth this quarter after server sales climbed 30% last quarter. Cloud orders through 2028 and expanded US and Thailand capacity reinforce its triple-digit annual AI server outlook. Taipei Times

Sponsor Micro Dispensing Technology Leader DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries. DL Technology

Forced to vibe code at work, programmers say their skills are deteriorating Tech firms tout AI coding gains, but programmers report rising debugging burdens, skill decay, and technical debt from 'vibe coding'. Some return to manual coding while debates intensify over mandates, performance pressure, and whether a balanced approach is possible. TechSpot

Intrusive Soldering vs. Wave Solder We are wave soldering with top and bottom side preheat. Would a pin in paste, or intrusive soldering, be a better option than wave soldering? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question. Board Talk

Technical Papers ■ Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses ■ Scaling SMT Traceability ■ The Drawbacks of Internal Recycling Systems for Solder Dross ■ Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics ■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible ■ PCB Rework Evolves, With X-ray a Constant Support ■ How pH Cleaning Agents Affect Production Performance ■ A Universal AI-Powered Segmentation Model for PCBA & Semiconductor ■ RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG ■ High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin MORE TECHNICAL PAPERS

Sponsor Plasma as a Key Technology Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma ® & PlasmaPlus®. Plasmatreat GmbH

70% of Americans don't want AI data centers near their home, that's more opposition than nuclear plants get Gallup survey finds 70% of Americans oppose building AI data centers in their communities, citing heavy water and energy use and quality-of-life concerns. Opposition exceeds that for nuclear plants, despite supporters highlighting local jobs and economic benefits. TechSpot

Nvidia looks for breakthrough in China on chip deal after US buying clearance US authorities approved about 10 Chinese firms to buy Nvidia’s H200 AI chips, but no shipments have occurred as deals stall amid Beijing pushback and US-China tech tensions, while CEO Jensen Huang seeks progress during high-level talks in Beijing. Taipei Times

Improved Process Yield with Dynamic "real-time" Dual Head Dispensing This paper examines proven methods to determine the dot/line positional accuracy along with mass flow rate for both heads during synchronous dispensing. Technical Paper

Sponsor Built to Scale. Proven in Production. Microsystems World CNC boosted throughput and automation by trading up to a complete inline SMT solution—powered by Manncorp and designed for long-term growth. Manncorp Inc.

TSMC expects global chip revenue to hit US$1.5tn TSMC projects global semiconductor revenue will reach $1.5 trillion by 2030 as AI drives demand, with inference becoming the main growth engine. The company expands advanced 2nm production and CoWoS packaging to meet surging AI chip needs. Taipei Times

US, Chinese presidents discuss business ties US President Donald Trump and Chinese President Xi Jinping met in Beijing for closed-door talks on trade, Iran conflict, and broader cooperation, pledging improved relations and continued economic dialogue while seeking stability amid global tensions. Taipei Times

Thermal Cycling Dwell Time on Reliability of Pb-free Solder Alloys This paper presents the initial results from an experimental program designed to compare thermal cycling results for high-performance solder alloys. Technical Paper

Sponsor Enhance Your Hands-On Soldering Skills Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly. BEST Inc.

Tech Sector Layoffs Are Rampant — But These Senior-Level Jobs Are Still Safe From AI Tech firms including Meta, Coinbase and Block are cutting thousands of jobs especially entry-level roles as AI handles basic coding while companies now hire mid- and senior engineers with AI skills to build, manage and integrate AI systems. Entrepreneur

Xi tells Musk, Tim Cook and other CEOs on Trump's trip: China will 'open wider' Xi Jinping told visiting American CEOs accompanying Donald Trump that China will open its market wider and welcomes deeper cooperation, as US and Chinese firms discuss trade and AI collaboration amid ongoing chip restrictions and technology competition. CNBC

Sponsor Get the Revisiting Underfill Handbook Today's underfill applications are constantly evolving. As chip populations increase, dispensing applications must deliver smaller amounts of fluid with precision. Read this handbook. Nordson Electronics Solutions

Anthropic says more than 90% of its code is now written by AI Anthropic says Claude now writes more than 90% of its code, outpacing rivals like Google and Microsoft in the race for AI-generated software. Executives across tech increasingly tout AI coding gains despite mounting concerns over layoffs and workforce reductions tied to automation. TechSpot

75% IPA/25% DI Extraction Solution on No-Clean Flux Residues This study is broken into two parts, first a review of the solubility of some critical ions in different ratios of IPA/DI and at different temperatures. Technical Paper

Amazon employees are inflating AI usage to top leaderboards and impress managers Amazon reportedly encourages staff to inflate AI usage metrics through its MeshClaw platform, as employees "tokenmaxx" to impress managers. Internal sources say this competitive behavior distorts performance signals and raises security and reliability concerns about automated work. TechSpot

We Tested 33 New Phones to See Which Charge Fastest and Crown 2 Winners CNET’s testing of 33 smartphones found major gains in wired and wireless charging speeds, driven by technologies like Qi2 and silicon-carbon batteries. Despite varying battery designs and capacities, the Samsung Galaxy S26 Ultra & iPhone 17 Pro emerged as fastest-charging phones. CNET

Sponsor iX7059 Series by Viscom: Inline X-ray Inspection Power High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application. Viscom SE

Accelerating Chipmaking Innovation for the Energy-Efficient AI Era Applied Materials launched the $5 billion EPIC Center to unite semiconductor R&D talent, tools, and partners in one platform. The initiative cuts siloed workflows, speeds lab-to-fab transitions, and advances angstrom-era AI chip development. IEEE Spectrum