circuitnet
Sponsor
Glenbrook-Technologies

PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
Ask the Experts
Rise of Bismuth Levels in our Solder Pots
We have an issue of concentrating bismuth in our selective solder machines. We have two machine and both have very similar rise in bismuth levels to 0.724% in our ...
Responses by:
Fritz Byle
Process Engineer, Astronautics
Richard D. Stadem
Advanced Engineer/Scientist, General Dynamics
Lee Wilmot
Director, EHS, TTM Technologies
Inspection for Hidden Solder Joints
Solution for Warped PCBAs
BGA Component Cleaning Spec
Tin Whiskers and Vapor Phase Reflow
Soldering Station Calibration
Solder Paste Stencil Inactivity
Solder Mask Thickness Tolerance
MORE ASK THE EXPERTS
kyzen
Sponsor
Summit-Interconnect

Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect
Industry Calendar
Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA
Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMTA
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
Oct 1, 2026
Long Island Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Plasmatreat-GmbH
Sponsor
Advanced-Interconnections

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
What Year Was It?
Levi Strauss Receives Patent for Blue Jeans
What Year
San Francisco businessman Levi Strauss and Reno, Nevada, tailor Jacob Davis are given a patent to create work pants reinforced with metal rivets, marking the birth of one of the world's most famous garments: blue jeans.
See the answer below.
Sponsor
DL-Technology

Micro Dispensing Technology White Paper
The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size.
DL Technology
Nordson-ASYMTEK
What Year Was It Answer
Levi Strauss Receives Patent for Blue Jeans
Answer: May 20, 1873
May 20, 2026
image
The iPhone Fold Is Coming: What We Know, What's Rumored, And When It Could Launch
Apple appears ready to enter the foldable phone market with the rumored iPhone Fold, featuring a Galaxy Z Fold-style design, reduced screen crease, A20 chip, and massive battery. However, its expected $2,000-plus price and lack of Face ID could spark debate among buyers.
BGR
Sponsor
Master-Bond

Low Outgassing, Glob Top Epoxy
Master Bond EP17HTND-CCM is a glob top epoxy that meets NASA low outgassing specifications and forms high strength bonds to a wide variety of similar/dissimilar substrates.
Master Bond
Gartner Forecasts Worldwide AI Spending to Grow 47% in 2026
Gartner forecasts global AI spending will reach $2.59 trillion in 2026, rising 47% year over year as demand for AI infrastructure surges. Enterprises are expected to boost investments in GenAI and AI agents, driving rapid growth in servers, cloud capacity, and automation tools.
Gartner
The Drawbacks of Internal Recycling Systems for Solder Dross
This paper examines the risks and hidden costs of in-house solder dross recycling, highlighting contamination, compliance, quality, safety, and economic challenges that often outweigh perceived savings.
Technical Paper
Robots Could Turn E-Waste Into a Source of Legacy Chips
Rising global e-waste rules are boosting smarter recycling as startups like Tuurny deploy AI-powered robots to recover reusable chips and metals before shredding. The company aims to scale RAM extraction amid supply chain and mineral concerns.
IEEE Spectrum
Sponsor
BEST-Inc.

Optimizing BGA Rework: Challenges, Techniques and Quality Control
The complexity of BGA packages introduces challenges during rework requiring innovative methods and inspection practices to ensure performance and reliability. Read more.
BEST Inc.
Google gives first glimpse of new AI glasses ahead of fall launch
Google unveiled audio-only smart glasses developed with Samsung, Gentle Monster and Warby Parker, embedding its Gemini assistant to deliver private spoken information, navigation and messaging features as it competes with Meta in the growing AI wearables market.
CNBC
The Impact of the Gold Layer Thickness on Layer Properties
The purpose of this study was to evaluate the impact of the gold layer thickness on the ENIG layer performance in different perspectives.
Technical Paper
Technical Papers
Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses
Scaling SMT Traceability
The Drawbacks of Internal Recycling Systems for Solder Dross
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible
PCB Rework Evolves, With X-ray a Constant Support
How pH Cleaning Agents Affect Production Performance
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin
MORE TECHNICAL PAPERS
Sponsor
Manncorp

Build Your Solution with Manncorp
Get a custom SMT equipment plan in minutes and source your entire line from one trusted supplier—backed by lifetime expert support you won't find anywhere else.
Manncorp Inc.
Google is making AI images easier to create, and deepfakes easier to spot
Google expands tools to fight AI image manipulation as deepfakes grow harder to detect. It unveils Google Pics for AI photo editing and broadens SynthID and C2PA watermarking across Search, Chrome, and Pixel devices to improve image authenticity.
TechSpot
How to use Google's new AI agents to go beyond your standard searches
Google unveiled agentic Search at I/O 2026, letting users create and manage AI agents that continuously monitor topics, synthesize information, and send alerts. The agents run 24/7, reduce repeated searching, and will launch this summer in the US.
TechCrunch
The Best Method for Reworking Ultra-Micro Chips
We are soldering and reworking 0201s and 01005s using hot air solder rework station with adjustable air flow. The minimum air flow will blow parts.
Board Talk
Sponsor
Intraratio-Corporation

What Would You Ask Proven Global Manufacturing Leaders?
In this 4-part series we asked about: Key Drivers of Success, Scaling Operations Effectively, AI in Manufacturing, and Tools to Empower Operations. No registration Required.
Intraratio
RAM makers are taking on massive debt to keep up with AI's chip appetite
AI infrastructure demand is reshaping the global memory market, driving HBM and server DRAM shortages that push up SSD and RAM prices. Taiwanese module makers are raising about $880 million in debt to secure inventory amid surging costs.
TechSpot
Scaling Down Is the New Scaling Up
At Embedded Vision Summit, Meta Reality Labs' Vikas Chandra showcased on-device agentic AI for phones and wearables, pushing perception under tight hardware limits through quantization, architecture, and vision breakthroughs powering sub-1B models.
EE Times
Drop/Shock Behavior of Low Temperature Solder BGA
This study examines challenges posed by aging, a critical factor influencing the long-term performance of solder joints.
Technical Paper
Sponsor
Circuit-Technology-Center

Keep Engineering Changes Moving Without Production Delays
Design updates shouldn’t slow your build process. With precise, fast-turn rework capabilities, engineering changes can be implemented accurately and efficiently.
Circuit Technology Center
Intel may be forcing PC makers to buy its newer 18A chips by cutting off the old ones
Intel pushes PC makers in the US, China and Taiwan to adopt its pricier 18A processors, cutting supply of older Intel 7 chips for consumers. The company redirects limited capacity to data centers amid surging AI-driven demand.
TechSpot
Apple to host final WWDC of the Tim Cook era on June 8
Apple will open its final Worldwide Developers Conference under CEO Tim Cook on June 8, spotlighting AI-powered Siri upgrades, accessibility tools, and platform updates before Cook hands leadership to John Ternus in September.
TechSpot
Sponsor
Schunk

Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK
Meta is reassigning 7,000 workers to AI jobs while laying off thousands more
Meta is restructuring around artificial intelligence by reassigning 7,000 employees into AI-focused teams while cutting 8,000 jobs. The company is also expanding AI investments, reshaping workflows & using employee activity data to train AI agents despite growing internal backlash.
TechSpot
Glass Panel Packaging: Technologies and Applications
This paper describes the critical glass packaging technologies, their R&D and commercialization status as well as all the current and future applications.
Technical Paper
The AI economy is rewriting the American Dream — and blue-collar workers are poised to win
AT&T is ramping up trade training and technician hiring as AI reshapes the labor market and erodes the edge of college degrees. The telecom giant faces a shortage of skilled blue-collar workers while automation pressures entry-level office jobs.
CNBC
The Iran war is exposing weak spots in the AI supply chain
AI-driven chipmakers posted strong earnings, but companies including TSMC, Foxconn and Infineon warned that the Iran conflict is disrupting semiconductor supply chains, driving up energy, freight and material costs, and threatening AI infrastructure profitability.
CNBC
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
Reversible glue technology goes electric
Researchers at Newcastle University created a reversible conductive glue that could reshape e-waste recycling. The water-based adhesive replaces solder, lets components separate with green solvents, and helps recover silver and electronic materials.
Chem Europe.com
Today's Sponsor
AI-Technology-Inc
Sponsor
AI-Technology-Inc

Corrosion, UV Protection for Power Transmission
Moisture, corrosive gas, oxidation & UV blocking prop-erties. FLUOROSEAL® confor-mal coating for electrical contacts & ceramic insulator protection.
AI Technology, Inc.
Test Your Knowledge
What is room temperature?
See answer below.
Industry Press
35 Years of Innovation from Jena: GÖPEL electronic Celebrates Anniversary
In May 2026, GÖPEL electronic will celebrate its 35th anniversary. Founded in 1991 as a spin-off of Carl Zeiss Jena Measurement and Testing Technology, the company has ...
GÖPEL electronic
KOKI Solder America Appoints Horizon Sales as Manufacturers' Representative
KOKI Solder America is pleased to announce a new partnership with Horizon Sales, who will now serve as the company’s manufacturers' representative across Wisconsin, Illinois ...
KOKI Solder America
Polaris® Adds Milwaukee Tool to Compression Connector UL Listed Expansion
Polaris® is proud to announce that it has added Milwaukee® Tool to its expanded UL Listed tool compatibility. "The addition of Milwaukee Tool gives electricians even ...
Polaris®
Smarter Reflow, Stronger Output: ubersmt Installs Heller MK7 Oven
ubersmt has added a new reflow system from Heller Industries, expanding its SMT capability and supporting growing customer demand across prototype, low-volume, ...
ubersmt
JAVAD EMS Expands Inspection Power with Four New Nordson SQ3000 AOI Systems
JAVAD EMS has expanded its quality and inspection capabilities with the installation of four new AOI systems from Nordson Test & Inspection, including three SQ3000 ...
JAVAD EMS
Closed-loop nozzle management in SMT manufacturing
ASMPT SMT Solutions presents a new system for the demand-oriented and continuously monitored management of SMT placement nozzles. With this factory-encompassing ...
ASMPT
ASYS Group Redefines AOI – Autonomous Inspection as a Key Enabler
With the presentation of AISPECTURE AOI – the "World's first true unsupervised inspection", the ASYS Group sets a new technological benchmark in power ...
ASYS Group
MORE INDUSTRY PRESS
ECD
Sponsor
Indium-Corporation

High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability and reduces energy use up to 15%.
Indium Corporation
Quote of the Day
"The greatest discovery of my generation is that a human being can alter his life by altering his attitudes of mind."
William James
Sponsor
SEHO

Simply Double the Production Volume
SEHO SelectLine features the award-winning Synchro and SmartSplit production modes that allow to halve cycle times in batch production and mixed operation. Find out more.
SEHO Systems GmbH
Plasma-Etch
Cartoon of the Day
Cartoon
"Our books are balanced. 50% of our numbers are real and 50% are made up."
Copyright © Randy Glasbergen
Sponsor
Circuitnet

"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC
Viscom-SE
Test Your Knowledge Answer
What is room temperature?
Answer: Sixty-eight degrees Fahrenheit