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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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Ask the Experts
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Stencil Pattern for Thermal Pads on QFNs
We need more information regarding the stencil pattern for thermal pads on QFNs. We know why it is important to "mesh" but need more info regarding what is best ...
Responses by:
Kishan Sarjoo Process Engineering Manager - Electronics, Altech UEC, South Africa Georgian Simion Engineering and Operations Management, Independent Consultant Tony Lentz Field Applications, FCT Assembly Stephanie Nash Director, Integrated Ideas & Technologies, Inc. Brien Bush Manufacturing Applications Specialist, Cirtronics Corp. Bill Coleman Vice President Technology, Photo Stencil Edithel Marietti Senior Manufacturing Engineer, Northrop Grumman Gary Freedman President, Colab Engineering Kay Parker Technical Support Engineer, Indium Corporation
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MORE ASK THE EXPERTS
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Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect
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Reclaim Your Factory's Future
Space is a precious resource. With SELECT Synchro, reclaim it, and reimagine your factory's workflow for greater efficiency and scalability.
Nordson Electronic Solutions
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What Year Was It?
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Nixon Announces Visit to Communist China
During a live television and radio broadcast, President Richard Nixon stuns the nation by announcing that he will visit communist China the following year.
See the answer below.
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"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC
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What Year Was It Answer
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Nixon Announces Visit to Communist China Answer: July 15, 1971
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Nokia's 14 Years of Mobile-Phone Supremacy Ended in an Afternoon
Nokia dominated the mobile phone market with iconic, affordable devices and recognized the iPhone's threat immediately in 2007. However, delayed innovation, reliance on outdated software, and slow adoption of multitouch allowed Apple to overtake the former industry leader.
IEEE Spectrum
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Assembly Optimization for Thin Flip-Chip Chip-Scale Packages
In this study, PC board design and solder stencil designs are evaluated for board attach defectivity for core-less FCCSP packages. It is observed that with properly engineered package materials and mechanical configuration, as well as optimization of PC board pad design, a robust board assembly solution exists for thin FCCSP packages.
Technical Paper
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Building a Foundation Stack for General-Purpose Robots
X Square Robot unveiled an open embodied AI framework combining world and action models with low-cost training data. The system improves robot generalization, cuts data costs 20x, and enables pretrained robots to perform tasks without fine-tuning.
IEEE Spectrum
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Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
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Causes of Blowholes
Are old components such as resistors and circuit breakers more likely to cause blowholes during wave soldering compared to newer components?
Board Talk
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Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly.
BEST Inc.
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MSI Leverages R&D and Manufacturing Strengths for AI Growth
MSI expands beyond PCs into AI infrastructure, on-device AI and hybrid cloud computing, leveraging NVIDIA and Arrow Electronics partnerships. The company boosts manufacturing, supply chains and localized production to capture enterprise AI demand.
EE Times
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Why Did Smartphone Makers Stop Putting Headphones In The Box?
Wired headphones are making a comeback as Bluetooth receivers connect traditional 3.5mm headsets to jackless smartphones. After Samsung and Apple dropped bundled accessories to cut e-waste, users gain broader compatibility without sacrificing audio quality.
BGR
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Affordable Excellence - iS6052 AOI
The latest addition to Viscom's esteemed lineup of AOI systems. This new system offers a compelling option for manufacturers looking to enhance their PCB inspection processes.
Viscom
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Pegatron June revenue rose 15.9% on server shipments and AI expansion
Pegatron reported NT$91.3 billion in June revenue, up 15.9% year over year despite a monthly decline, as expanding server shipments supported growth. The company expects its new server business to gain momentum, strengthening its product mix and future revenue prospects.
Digitimes
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pH Employment in Electronic Cleaning
The pH of a cleaning agent affects the entire cleaning process and must be considered when determining the appropriate chemistry and process parameters for success. Download now.
KYZEN
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AI's new gatekeepers: US and China tighten grip on frontier models
Governments are emerging as a key influence on advanced AI development, seeking greater control over when frontier models launch, who can access them and which capabilities remain restricted, adding a new layer of oversight beyond chips, data and engineering talent.
Digitimes
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| Today's Sponsor |
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| Sponsor |
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Need Improved Solder Joint Visibility?
Solder Peel-A-Way Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
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Test Your Knowledge
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At what temperature are both Fahrenheit and Celsius the same?
See answer below.
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Industry Press
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AIM to Present on Modern Lead Free Solder Alloys at SMTA Ontario Webinar
AIM Solder is pleased to announce its participation in the upcoming SMTA Ontario Chapter Webinar. This event takes place July 29 from 12:00pm-1:00pm EDT. AIM's ...
AIM Solder
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technosert Relies on DIVISIO 5100 Depaneling System from ASYS
Process reliability is a key competitive advantage in electronics manufacturing. Austrian EMS provider technosert, drawing on nearly 40 years of experience ...
ASYS
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Enabling High-Speed Machine Vision with High-Radiance LED Illuminatiom
High-performance machine vision and inspection systems increasingly require illumination sources with higher radiance, greater spectral control, and improved ...
Innovations in Optics, Inc.
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GÖPEL electronic unveils SYSTEM CASCON in new Release 4.11
With the new version 4.11 of its embedded JTAG system software SYSTEM CASCON, GÖPEL electronic is introducing a powerful toolbox for the automatic ...
GÖPEL electronic
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Sciperio Awarded U.S. Patent for Advanced Additive Manufacturing Pump Tech
Sciperio, Inc., the research and development arm of nScrypt, announced the issuance of U.S. Patent No. 12,654,396 B2, titled "Pump for Additive Manufacturing." ...
Sciperio, Inc.,
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Amtech Electrocircuits Launches Article to Deliver Practical AI Insights
Amtech Electrocircuits has launched First Article, a new online resource dedicated to helping engineers, product developers, and manufacturers understand how AI ...
Amtech Electrocircuits
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Kaman Measuring Highlights Family of Precision Measuring Systems
The Measuring Division of Kaman Precision Products, Inc. highlights its family of precision differential non-contact eddy current measuring systems for free space ...
Kaman Measuring
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MORE INDUSTRY PRESS
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Quote of the Day
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"Even if you are on the right track, you will get run over if you just sit there." Will Rogers
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| Sponsor |
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Buy SMT Dispensing Needles Online
EZ-FLO needles are machined from stainless steel with smoother internal profile for improved material flow. Chamfered needle tip is finely ground for better release. Buy online.
DL Technology
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| Cartoon of the Day
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"When you're trying to stay a step ahead of the competition, any advantage helps."
Copyright © Randy Glasbergen
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PAE Certification – Oct 2-5, 2026
Advance your expertise with the ESDA Process Assessment Engineer (PAE) Certification at the 2026 EOS/ESD Symposium. Learn ANSI/ESD SP17.1 principles to assess and improve EOS/ESD processes.
EOS/ESD Association
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Test Your Knowledge Answer
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At what temperature are both Fahrenheit and Celsius the same? Answer: -40°F = -40°C
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