circuitnet
Sponsor
Schunk

Gripping Systems from micro assembly to heavy lifting
The first industrial-suited grippers from SCHUNK were a milestone. Since then we have brought countless newly and further developments to market.
SCHUNK
Ask the Experts
Class 3 Cleaning Requirements
We recently received our first contract to assemble Class 3 circuit board assemblies. Are there any changes we need to make in our cleaning operations to switch ...
Responses by:
Steve Stach
President, Austin American Technology
Umut Tosun
Application Technology Manager, Zestron America
Fritz Byle
Process Engineer, Astronautics
Mike Konrad
President, Aqueous Technologies
Rick Perkins
President, Chem Logic
Mixing Different SAC305 Solders
Rework of Underfilled Array Packages
What Causes Solder Balls During Rework?
Advise and suggestions for assembly using 01005 capacitors.
Selective Printing for BGA Components
PCBA Transport Between Facilities
SOT (Small Outline Transistor) Body Cracks
MORE ASK THE EXPERTS
Air-Vac-Engineering
Sponsor
DL-Technology

Micro Dispensing Technology White Paper
The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size.
DL Technology
Industry Calendar
Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA
Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMTA
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
Oct 1, 2026
Long Island Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Zestron
Sponsor
Glenbrook-Technologies

Refurbished and Demo X-ray Inspection Systems
2024 Demo JewelBox-70T X-ray System and 2024 Demo JewelBox-100T X-ray System Refurbished & Demo Systems on sale with warranty. Learn more.
Glenbrook Technologies
What Year Was It?
Amelia Earhart disappears
What Year
The Lockheed aircraft carrying American aviator Amelia Earhart and navigator Frederick Noonan is reported missing near Howland Island in the Pacific.
See the answer below.
Sponsor
BEST-Inc.

J-STD-001 Solder Training Kit
BEST's IPC J-STD-001 Revision H-J training kit features circuit boards representing actual soldering conditions including multilayer boards with challenging thermal conditions.
BEST Inc
Plasma-Etch
What Year Was It Answer
Amelia Earhart disappears
Answer: July 2, 1937
July 3, 2026
This Automaker Paid $4.8 Billion to Fix Its Cars in a Single Year. Here’s Its Unexpected Solution to Quality Control Issues.
Ford has transformed its quality strategy by pairing AI with veteran engineers, helping cut warranty and recall costs. The approach lifted Ford to the top-ranked mainstream brand in the latest JD Power Initial Quality Survey while strengthening manufacturing quality across its plants.
Entrepreneur
Sponsor
AI-Technology-Inc

Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
The US iPhone 18 Pro Might Have A Major Hardware Difference (For Better Or Worse)
A cyberattack on Apple's Indian supplier Tata reportedly leaked iPhone 18 Pro documents suggesting U.S. models will retain Qualcomm 5G modems, while global versions adopt Apple's C2 chip, offering better power efficiency, faster 5G speeds and enhanced carrier privacy features.
BGR
The Drawbacks of Internal Recycling Systems for Solder Dross
This paper examines the risks and hidden costs of in-house solder dross recycling, highlighting contamination, compliance, quality, safety, and economic challenges that often outweigh perceived savings.
Technical Paper
As AI Reshapes Global Energy Systems, Melbourne Leads Through Engineering Collaboration
AI is sharply increasing electricity demand, making energy infrastructure a critical challenge alongside computing capacity. Melbourne is positioning itself as a global leader by integrating renewable energy, grid modernization, engineering expertise and digital infrastructure to support AI-driven growth and resilient energy systems.
IEEE Spectrum
Sponsor
Summit-Interconnect

The Battle for Space Superiority Has Begun
The next conflict may begin in orbit. Learn why resilient space systems and advanced manufacturing matter more than ever.
Summit Interconnect
AI Server Demand Drives Sharp Rise in Circuit Board Material Prices
Surging AI server investments are pushing cost increases beyond GPUs and memory into upstream semiconductor materials. Rising demand for high-grade glass fiber cloth and other essential components is strengthening supplier pricing power and increasing manufacturing costs across the electronics supply chain.
The Chosun
Surface Treatment Enabling Low Temperature Soldering to Aluminum
An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates.
Technical Paper
Technical Papers
Flux-Free, Reliable, Efficient: Soldering with Formic Acid
Redesigning Material Logistics for High-Mix EMS Production
Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education
Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse
Digital Warehouse Automation in High-Mix PCB Assembly
Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses
Scaling SMT Traceability
The Drawbacks of Internal Recycling Systems for Solder Dross
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
MORE TECHNICAL PAPERS
Sponsor
Master-Bond

Thermally Conductive, Low Outgassing Epoxy
Master Bond EP21AOLV-2LO is an electrically insulating adhesive that meets NASA low outgassing requirements for sealing, coating and encapsulation applications. Ask an expert.
Master Bond
Tech sector gains: Consumer electronics and software shine amid semiconductor woes
US markets traded mixed as semiconductor stocks slumped, with Micron, AMD and Intel posting sharp losses, while Apple and Microsoft gained on stronger investor confidence. The divergence highlights sector rotation toward software and consumer technology amid persistent chip industry uncertainty.
Investing Live
Engineering Plastic Compounds Market to Reach USD 275.3 Billion by 2036 Driven by Rising Demand Across Automotive and Electronics Industries
The global engineering plastic compounds market is expanding as automakers, electronics manufacturers, and aerospace companies replace metals with lightweight, high-performance polymers. Growing EV production, semiconductor demand, and sustainable material innovations are expected to drive the market from USD 141 billion in 2025 to USD 275.3 billion by 2036.
Industry Today
What Causes Solder Balls During Hand Soldering?
To many operators believe the old myth that flux is your friend and you can never have to much flux. That is not true as to much flux will outgas at the end of the hand soldering process creating solder balls around the connection. This is one possible explanation as others have stated other causes as well.
Board Talk
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
Sales Forecasting Guide for Electronics Manufacturing SMBs
Sales forecasting enables electronics manufacturers to align production, procurement, and inventory with expected demand, reducing shortages, excess stock, and capacity constraints. Integrated ERP tools and AI-assisted forecasting improve planning accuracy by linking forecasts directly to production schedules, purchasing, and supplier lead times.
EE Times
Memory Chip Prices and PCB Supply Risks Tighten AI Hardware Market
AI infrastructure investment is driving memory price surges, tightening component supply and raising electronics manufacturing costs. Supply chain risks around Chinese PCB production and stricter export controls are also forcing manufacturers to adopt more flexible sourcing and procurement strategies.
Astute
Tin-Bismuth Low Temperature Solder Electromigration Behavior
This paper reviews results reported from accelerated testing compared with cross-sectional results from components on functional systems with known time in service.
Technical Paper
Sponsor
Nordson-ASYMTEK

actnano Materials with Nordson Equipment
actnano's PFAS-free, cure-free coatings save energy and boost safety. And they are compatible with Nordson conformal coating systems. Upgrade your system today. Learn more!
Nordson Electronic Solutions
AI Server Demand Drives Circuit Board Material Price Surge
Surging AI data center investments are driving price increases beyond GPUs and memory into semiconductor materials. Taiwanese manufacturer Fulltech Fiber Glass raised glass fiber cloth prices by up to 30%, while growing demand for advanced substrates is lifting costs across the AI semiconductor supply chain.
The Chosun
Kimball Electronics Acquires European-Based Medical CDMO, Helvoet Polymer Technologies B.V.
Kimball Electronics acquired Helvoet for €90 million ($103 million) to expand its global medical contract manufacturing platform. The deal strengthens its European and Indian presence, enhances U.S. growth opportunities, and adds specialized expertise in microfluidics, diagnostics, and drug delivery.
Business Wire
Sponsor
Manncorp

Keeley Pedals Perfected with Manncorp
Keeley Electronics revolutionizes production with Manncorp pick & place machines, achieving unprecedented speed, precision, and innovation in the guitar pedal industry.
Manncorp Inc.
Non-AI lead times normalising
Accelerating AI investments are tightening supply for memory and AI-related components, driving record NAND revenues and sustained HBM demand. Industry leaders expect shortages, longer lead times, and higher prices through 2030, while most other semiconductor categories maintain balanced supply and stable growth.
Electronics Weekly.com
Low Melting Temperature Solder Interconnect Thermal Cycling Performance
Sn-Bi based low melting temperature solder interconnects with elemental tuning presents enhanced interconnect solder joint thermo-mechanical performance.
Technical Paper
Panasonic launches compact PCB relay series
Panasonic launched the compact HE-S SC 2a and 2a1b PCB relay series for single-phase EV chargers and wallboxes, offering 40A switching, compact PCB integration, low power consumption and early compliance with the upcoming IEC 62955 short-circuit safety standard.
Electronics Weekly.com
India’s electronics manufacturing services market could reach $150 billion by FY30: KPMG
India’s electronics manufacturing services market is projected to exceed USD 150 billion by FY30 from USD 40-45 billion in FY25, driven by exports, policy incentives and supply chain shifts. KPMG says India must expand design, localisation and component capabilities to sustain growth.
Best Media Info
Sponsor
Viscom

Discover the power of vAI ProVision from Viscom
Create and optimize 3D AOI and AXI programs in minutes. vAI ProVision boosts inspection depth, quality, and speed. Viscom develops & produces premium inspection systems.
Viscom
Rapid Component Obsolescence Is Reshaping Today’s Semiconductor Procurement Dynamics
Rapid component obsolescence is forcing semiconductor procurement teams to shift from reactive purchasing to proactive lifecycle management. Companies that track component lifecycles, diversify sourcing, and strengthen inventory strategies can reduce supply chain risks and maintain long-term product availability.
EE Times
Today's Sponsor
ECD
Sponsor
ECD

Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD
Test Your Knowledge
What glass-cleaning device did Mary Anderson invent in 1902?
See answer below.
Industry Press
Less Hardware, Faster Setup – XJTAG Now Supports FTDI
XJTAG 4.3 adds FTDI JTAG support, enabling USB-based boundary scan testing and programming without an XJLink controller. The update simplifies evaluation and speeds production-line testing.
XJTAG
Military-Grade PCB Manufacturing: Meeting Highest Standards for Reliability
Military-grade printed circuit boards (PCBs) are designed for environments where failure is not an option. Standards like MIL-PRF-31032, MIL-PRF-55110, ...
San Francisco Circuits
Green Circuits Names Adam Szychowski Chief Revenue Officer
Green Circuits has appointed Adam Szychowski as Chief Revenue Officer (CRO). This appointment strengthens the company's executive leadership team as it continues ...
Green Circuits
YINCAE to Showcase Advanced Materials at IICIE 2026
YINCAE will showcase its latest innovations in advanced materials and packaging technologies at the International Integrated Circuit Innovation Expo (IICIE) 2026 ...
YINCAE Advanced Materials
Assembled Product Specialists Offers Complete Facility Solutions
Assembled Product Specialists is is highlighting its comprehensive approach to facility design, product sourcing, installation, and operational support. While many organizations know ...
Assembled Product Specialists
I.C.T Delivers SMT Line for Drone Manufacturing in Europe
I.C.T has successfully delivered a complete SMT production line to a customer in Europe, supporting their drone manufacturing business. In March 2026, I.C.T dispatched ...
Dongguan ICT Technology Co.,Ltd.
SmartController offers interfaces for controlling demanding tests
In the automotive sector, individual components—such as vehicle seats—often need to be tested or demonstrated independently of the overall configuration ...
GOEPEL Electronic
MORE INDUSTRY PRESS
kyzen
Sponsor
Circuit-Technology-Center

Eliminate Lead Tinning Issues Before They Become Reliability Failures
Learn lead tinning methods, causes of tinning defects, and solutions from the experts at Circuit Technology Center to help ensure dependable solder connections.
Circuit Technology Center
Quote of the Day
"Do not confuse motion and progress. A rocking horse keeps moving but does not make any progress."
Alfred A. Montapert
Sponsor
Circuitnet

"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC
Uyemura
Cartoon of the Day
Cartoon
"I guess arcade tokens are better than no bonus at all."
Copyright © Randy Glasbergen
Sponsor
Viscom-SE

vCONNECT: Your Next Level of Digital Connectivity
Discover vCONNECT: Analyze inspection data, monitor machine performance, predict maintenance needs, store data securely and access AI tools and the latest Viscom News.
Viscom SE
Advanced-Interconnections
Test Your Knowledge Answer
What glass-cleaning device did Mary Anderson invent in 1902?
Answer: The windshield wiper