Ask the Experts
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Gold Plating and Embrittlement
What is your opinion regarding gold plating removal to improve soldering? I believe in the past gold plating was thick enough (>50 micro inches) to cause gold ...
Responses by:
Karl Seelig , Deck Street Consultants Kay Parker Technical Support Engineer, Indium Corporation KN Murli Head-Quality, Astra Microwave Products, Hyderabad, AP India Richard D. Stadem Advanced Engineer/Scientist, General Dynamics Dr. Craig D. Hillman CEO & Managing Partner, DfR Solutions Fritz Byle Process Engineer, Astronautics Leo Lambert Vice President, Technical Director, EPTAC Corporation Brien Bush Manufacturing Applications Specialist, Cirtronics Corp. Gerard O'Brien President, S T and S Testing and Analysis
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Circuitnet Advertising Delivers Results!
Introduce your technology, new products or services in our daily e-mail newsletter & website to see how a digital advertising campaign can deliver results. Reach over 200,000 professionals.
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The "Fried Egg" Effect in Soldering
Burnt-on flux residue that is visible on the solder mask of PCBs after improper reflow settings produces significant challenges to the reliability of finished boards.
KYZEN
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What Year Was It?
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Burr Slays Hamilton in Duel
In a duel held in Weehawken, New Jersey, Vice President Aaron Burr fatally shoots his long-time political antagonist Alexander Hamilton.
See the answer below.
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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What Year Was It Answer
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Burr Slays Hamilton in Duel Answer: July 11, 1804
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July 11, 2025
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Can We Please Put Back Some Common Sense in Component Purchasing?
The semiconductor industry faces renewed volatility as Samsung plans to halt DDR4 production by end-2025, sparking panic buying and distorted demand. Legacy tech is vanishing faster, urging companies to build strong partnerships and plan smarter for supply security.
EE Times
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Unlock the Potential of Salvaged Devices
Component harvesting is a reliable method of electronic component reclamation, reducing e-waste and ensuring economic reuse for automated assembly.
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology
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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process especially those with vacuum is challenging. ECD's M-VP sealed barrier can take it. Learn more.
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Next-gen Apple Pencil might finally work with your iPhone
Apple's new patent reveals a next-gen Apple Pencil that can draw on non-touch surfaces like iPhones or tabletops using advanced optical sensors. This tech could explain why Apple hasn't yet enabled Pencil support on the Vision Pro headset.
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In-House Assembly? We Make It Easy
We match you with the right equipment, install it, train your team, run your first jobs, and back it with strong warranties plus expert remote and on-site support.
Manncorp Inc.
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Windows 11 is now the most-used desktop operating system
Windows 11 has overtaken Windows 10 as the most-used desktop OS, now holding 52% of the market. After years of slow growth, stricter hardware requirements, and user hesitation, Microsoft's AI-driven push is accelerating Windows 11 adoption.
Quartz
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Plasma Etch PE-Avenger
The PE-Avenger is an ultra low-cost entry level plasma cleaning system allowing more labs to utilize plasma. It's a low frequency plasma cleaner designed for surface activation and organics removal.
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Tenstorrent Acquires Blue Cheetah, Opens Chiplet Spec
Tenstorrent acquired analog IP firm Blue Cheetah and opened its Open Chiplet Architecture (OCA) to accelerate chiplet adoption. The move strengthens in-house die-to-die capabilities and fosters a scalable, collaborative ecosystem for next-gen silicon diversity.
EE Times
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Memory Safety Will Be Key to Tackle Fundamental Cyber Security
The U.K.'s Digital Security by Design initiative showcased CHERI, a memory-safe hardware technology, in London. Experts praised its cybersecurity potential but noted adoption challenges. With 160+ companies involved, standardizing memory safety remains a key priority.
EE Times
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Today's Sponsor |
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Electrically Conductive Die Attach Epoxy
Master Bond EP17HTS-DA is a silver filled, die attach adhesive that withstands high temperatures and passes MIL-STD-883J thermal stability requirements.
Master Bond
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Test Your Knowledge
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What date did man first land on the moon?
See answer below.
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Quote of the Day
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Silence is one great art of conversation. Anonymous
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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Cartoon of the Day
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"It's not just you. We're all insecure in one way or another."
Copyright © Randy Glasbergen
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Test Your Knowledge Answer
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What date did man first land on the moon? Answer: July 20, 1969
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