Insufficient Barrel Fill on Through-hole Components
We are having issues with barrel fill. We are using a lead free, no-clean flux process. The issues is with through hole connectors with lead retention ...
Responses by:
Tim O'Neill Technical Marketing Manager, AIM Leo Lambert Vice President, Technical Director, EPTAC Corporation Bill Coleman Vice President Technology, Photo Stencil Kishan Sarjoo Process Engineering Manager - Electronics, Altech UEC, South Africa Mahesh V Draksharapu Independent Consultant, Tony Lentz Field Applications, FCT Assembly Brien Bush Manufacturing Applications Specialist, Cirtronics Corp. Kay Parker Technical Support Engineer, Indium Corporation Michael Kaminsky Sr Fiald Applications Support Engineer, Kester Inc. Fritz Byle Process Engineer, Astronautics Mark Northrup VP of Advanced Technical Operations, IEC Electronics Edithel Marietti Senior Manufacturing Engineer, Northrop Grumman Mitch Holtzer Director of Reclaim Business, Alpha Assembly Solutions Tom Schardt Industrial Engineer, Red Lion Controls, Inc.
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