Aug 21, 2026 Three Strategic Imperatives for Energy-Efficient AI Computing AI's rapid growth is driving data center energy use and inference costs sharply higher, making energy efficiency a strategic priority. Smarter AI systems can reduce costs, improve ROI, and enable efficient physical AI applications despite growing infrastructure demands. Semiconductor Engineering

Sponsor Need Improved Solder Joint Visibility? Solder Peel-A-Wayš Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action. Advanced Interconnections Corp.

Total investment in Vietnam by Foxconn expected to hit $5bln Foxconn plans to invest another $265 million in Vietnam, expanding manufacturing of electronics and electric vehicle components. The latest funding will lift its total Vietnamese investment toward $5 billion, reinforcing the country's role in Foxconn's global manufacturing strategy. Vn Economy

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics Electrostatic discharge (ESD) threatens IoT and high-reliability electronics as components shrink and densify. This paper details design protections, assembly controls, and validation methods to help engineers and OEMs enhance device resilience and ensure long-term performance. Technical Paper

Micron CEO: AI has 'totally changed' the equation for the boom-and-bust memory industry Micron says AI has made memory strategic infrastructure, driving sustained demand for faster, lower-power products. The company expects shortages to persist as customers seek more supply, while long-term deals support U.S. manufacturing investments. CNBC

Sponsor The Battle for Space Superiority Has Begun The next conflict may begin in orbit. Learn why resilient space systems and advanced manufacturing matter more than ever. Summit Interconnect

How credit allocation is becoming part of the AI supply chain As AI evolves, bottlenecks are shifting, signaling the industry's growing maturity. Early constraints centered on GPUs, HBM and advanced packaging, but newer challenges increasingly involve power, data centers, networking and infrastructure needed to sustain rapid AI expansion. Digitimes

Eliminate Tin Whiskers on Component Leads Is there a process that can be used to re-plate component leads to add lead to eliminate the problem of tin whisker formation? Board Talk

Technical Papers ■ UHDI Fabrication for IC Substrates: SAP and mSAP Processes ■ Flux-Free, Reliable, Efficient: Soldering with Formic Acid ■ Redesigning Material Logistics for High-Mix EMS Production ■ Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education ■ Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You ■ Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse ■ Digital Warehouse Automation in High-Mix PCB Assembly ■ Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses MORE TECHNICAL PAPERS

Sponsor Low Outgassing, Glob Top Epoxy Master Bond EP17HTND-CCM is a glob top epoxy that meets NASA low outgassing specifications and forms high strength bonds to a wide variety of similar/dissimilar substrates. Master Bond

Lack of low-carbon power could deter investment Taiwan's limited supply of reliable, low-carbon electricity could discourage AI data center investment despite its technological strengths. Industry experts warn that rapid data center growth requires scalable green power and grid infrastructure, which can take years to develop. Taipei Times

China Steel reports 55% slump in pretax profit China Steel Corp's pretax profit fell 55% in July as weak Asian steel demand squeezed margins, while operating profit plunged 84%. However, seven-month profits, revenue and shipments improved, signaling recovery despite regional overcapacity and rising oil costs. Taipei Times

Corrosion and Contaminant Diffusion Multi-Physics Model Models for copper interconnect degradation are needed for life prediction modeling to ensure 10-year, 100,000 mile reliability for automotive applications. Technical Paper

Sponsor EZ-FLO High Precision Dispense Tips Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more. DL Technology

Export order growth hits 61.9% Taiwan's export orders surged 61.9% year-on-year to a record US$97.94 billion in July, driven by strong AI, high-performance computing and cloud demand. ICT orders jumped 89.5%, while robust US, ASEAN and China demand boosted overall growth. Taipei Times

The Autonomous Vehicle's Manufacturing Reckoning Arrives The autonomous vehicle race is shifting from software to manufacturing scale. Waymo favors asset-light partnerships, Zoox pursues vertical integration, while Tesla bets on mass-market production, making cost efficiency, factory capacity and scalability crucial to robotaxi success. Advanced Manufacturing

Reworkable Edge Bond Adhesives for BGA Applications Reworkable edge bond materials designed to improve the reliability of large area BGAs and ceramic BGAs assemblies are presented. Technical Paper

Sponsor The "Fried Egg" Effect in Soldering Burnt-on flux residue that is visible on the solder mask of PCBs after improper reflow settings produces significant challenges to the reliability of finished boards. KYZEN

Attention-grabbing virtual agents could help improve safety of self-driving cars University of Glasgow researchers found animated virtual agents in AR glasses can steer drivers toward hazards as effectively as conventional warnings. But excessive personality may distract drivers, reducing safety gains in semiautonomous vehicles. TechXplore

AI data center outrage is showing up everywhere from ads to elections Liquid Death and Garage Beer use a provocative ad to spotlight AI data centers’ heavy water demands as public opposition grows. The facilities are becoming a bipartisan political issue, prompting stricter rules and new industry pledges nationwide. CNBC

Sponsor Depaneling machine for separating circuit boards SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling. SCHUNK

China's New 'Superman' Robot Is A Back-Flipping, Record-Breaking Powerhouse Unitree Robotics has unveiled its "Superman" humanoid, which jumps about two meters and runs at 12.66 meters per second. The breakthrough highlights China’s rapid robotics advances, using sophisticated motors and AI to surpass human physical capabilities. BGR

Testing of Soldering Materials vs. Soldering Processes This paper discusses Surface Insulation Resistance (SIR) data of solder pastes and other soldering materials on IPCB-52 coupons. Technical Paper

Stop Counting Backlinks. Start Counting Brand Mentions. AI is reshaping SEO as brand mentions gain influence in assistant recommendations. Research finds earned media drives most AI citations, while unlinked coverage, YouTube mentions, expert commentary and consistent branding can boost visibility. Entrepreneur

Foxconn ramps up urgent hiring for iPhone 18 mass production; sign-on rebate tops out at 7,800 yuan, down from last year Foxconn is ramping up hiring in Zhengzhou and Shenzhen ahead of Apple's fall launch, raising hourly wages and sign-on incentives as iPhone 18 production accelerates. However, incentives remain below last year's peak due to Apple’s narrower premium-model lineup. Finance Big Go

Sponsor Affordable Profiling Excellence Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here. ECD

Delta expands AI automation push into robotics, semiconductors, machinery Delta Electronics unveiled a broader AI strategy at the Taipei International Industrial Automation Exhibition, showcasing robotics and smart manufacturing solutions aimed at accelerating deployment across machinery, electronics, and semiconductor industries. Digitimes