February 17, 2026

China's Tech Shock Threatens the U.S. AI Monopoly and is 'Just Getting Started' China is rapidly closing the AI gap with the U.S., challenging America's tech dominance. Analysts warn a "China tech shock" is accelerating as Beijing invests billions in AI, scales Huawei chips, and offers low-cost tech, raising doubts about U.S. leadership and returns on massive spending. CNBC

Sponsor Counterfeit Components Identified With X-ray Inspection Automated component sourcing and procurement platform relies on real-time X-ray inspection to remove counterfeit components from supply chain. Glenbrook Technologies

VIEWPOINT 2026: Rob Boguski, President, Datest For Datest, 2025 was a tale of two years. The first half of 2025 moved at a pace even with our record sales in 2024. The second half moved at a pace reminiscent of the dot-com vaporization in 2000-2001. The bottom dropped out in July; regained nominal cruising altitude in August and September, popped a crankshaft ... Datest

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation. Technical Paper

Amazon sold 60% fewer CPUs than a year ago, pointing to a stalled PC refresh cycle Amazon's US CPU sales plunged 59% year-over-year in January 2026, as DDR5 shortages fueled by AI demand hit PC upgrades. AMD dominates with X3D chips, but older Ryzen 5000 and 3000 processors see a resurgence due to cheaper DDR4 memory. TechSpot

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

Apple set to unveil new iPhone, MacBooks, iPads at March 4 event Apple has invited media to a March 4 "special Apple Experience" across New York, London, and Shanghai. The company is widely expected to unveil the iPhone 17e, new MacBooks with M5 chips, refreshed iPads, and other updated hardware. TechSpot

Intrusive Soldering vs. Wave Solder We are wave soldering with top and bottom side preheat. Would a pin in paste, or intrusive soldering, be a better option than wave soldering? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question. Board Talk

Technical Papers ■ Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics ■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible ■ PCB Rework Evolves, With X-ray a Constant Support ■ How pH Cleaning Agents Affect Production Performance ■ A Universal AI-Powered Segmentation Model for PCBA & Semiconductor ■ RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG ■ High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin ■ Understanding Solder Dross: Causes and Control Strategies ■ Optimizing BGA Rework: Challenges, Techniques and Quality Control ■ Maintenance: The Basics of Cleaning Series Part 4 MORE TECHNICAL PAPERS

Sponsor Vapor Phase Profiling Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more. ECD

Is AI Actually Making a Difference in Your Company? Most Executives Aren't Seeing the Whole Picture. Companies rapidly adopt AI tools promising greater efficiency and convenience in work and daily life. Yet opinions remain divided, as some praise AI's impact while others question whether it truly improves every aspect of business operations. Entrepreneur

Japan, US commit to deepening ties At the Munich security talks, U.S. Secretary of State Marco Rubio and Japan's Foreign Minister Toshimitsu Motegi strengthened bilateral ties, pledging to bolster economic security, counter China's trade curbs, and back dialogue to support Taiwan and regional stability. Taipei Times

The Dynamics of Low Stress Epoxy Curing This study compares uniform variable frequency microwave (VFM) field cure to standard oven curing at temperatures below Tg (transition temperature). Technical Paper

Sponsor Macurco Doubles Output with Manncorp Scaled fast. Improved speed and quality. Full control of SMT production in under a year—with no prior in-house experience. See how Manncorp helped Macurco make it happen. Manncorp Inc.

World leaders, CEOs attend AI summit in India India hosts the AI Impact Summit in New Delhi, gathering global leaders & tech execs to shape AI's future. Officials promote inclusive growth, reskilling & digital infrastructure, while experts debate safety, governance & regulation amid rapid technological transformation worldwide. Taipei Times

AI disruption could spark a 'shock to the system' in credit markets, UBS analyst says UBS analyst Matthew Mish warns that AI-driven disruption, accelerated by advances from OpenAI and Anthropic, could trigger $75–$120 billion in defaults among heavily leveraged software and data firms, sparking a broader credit crunch across corporate loan markets. CNBC

Design for Testability to Overcome Functional Board Test Complexities In this paper the author reviews how Design for Testability techniques can be an effective way to reduce functional board test programming complexity. Technical Paper

Sponsor AIT ORMET® TLPS for Component Attach AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC Ormet® TLPS

This Former Physicist Helps Keep the Internet Secure Alan DeKok pivoted from nuclear physics to network security, cofounding the FreeRADIUS Project. Over nearly 30 years, he turned it from a hobby into the world's leading RADIUS server, powering authentication for ISPs, banks, and Fortune 50 companies. IEEE Spectrum

Engineering SDVs at China Speed Without Losing Control Automakers are speeding toward 18-month vehicle launches, adopting software-defined architectures to replace traditional ECUs. By using certified toolchains, CI/CD workflows, and long-term support, OEMs balance rapid release cycles with safety, compliance, and quality. EE Times

Sponsor Inline Automatic X-Ray Inspection: TruView™ Verus TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed. Creative Electron

Aurora's driverless trucks can now travel farther distances faster than human drivers Aurora's self-driving trucks now cover the 1,000-mile Fort Worth-to-Phoenix route nonstop, cutting transit times far below human limits. With 30 trucks in operation, expanding fleets, and flawless safety, Aurora advances commercially, scaling autonomous freight across the Sun Belt. TechCrunch

Engineered Tin-Copper Alloys in Selective Soldering The performance with one alloy under design conditions that make soldering difficult demonstrate the need to evaluate the performance differences. Technical Paper

Airplanes Still Use Floppy Disks For Their Software - Here's Why The iconic Boeing 747 still relies on floppy disks to load critical software, as regulators prioritized reliability and security over modernization. Mounting system failures & a recent crisis at Newark Liberty International Airport are accelerating efforts to upgrade outdated aviation technology. BGR

SMTLINK Solutions: Connecting Technology, Knowledge, and Reliability SMTLINK Solutions, in Querétaro's Bajío hub, partners with electronics manufacturers across North America, delivering integrated technical support, automation, training, and Industry 4.0 solutions to streamline operations, boost reliability, and drive digital transformation. Global Electronics Association

Sponsor 6 Common Mistakes of BGA Rework BGA rework is one of the most challenging procedures you may need to master. Doing it right depends in large part on the skills and knowledge of the rework technician. Learn more ... Circuit Technology Center

These Four Charts Show How Reliant Europe is on U.S. Digital Infrastructure Despite pledges for digital independence, Europe remains heavily reliant on U.S. tech providers. American companies dominate the cloud market, holding over 85%, while European firms struggle to compete amid geopolitical tensions and regulatory concerns like the Cloud Act. CNBC