March 5, 2026

Cloud Spending to Surpass a Trillion in 2026, Driven by PaaS and AI Platform Adoption Global public cloud spending will exceed $1T in 2026, rising 21%, as enterprises accelerate AI adoption, application modernization, and cloud-native development. SaaS dominates spending while fast-growing PaaS platforms power AI, data analytics, and scalable digital infrastructure. IDC

Sponsor IC Programming: Memory & Logic Devices Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products. Alltemated

VIEWPOINT 2026: John Singer, Chief Operations and Engineering Officer, Qnity The global semiconductor industry is entering a new era of expansion – driven largely by growth in AI. In 2025, Qnity launched as an independent company, and we've quickly made our mark. It's no secret that at Qnity we believe our materials are essential in powering the next leap. We also believe that tomorrow's ... Qnity

The Economics of Electronic Component Salvage and Reuse This paper explores the feasibility and benefits of salvaging and reconditioning the leads and pads of electronic components, focusing on high-value components such as microprocessors, microcontrollers, and artificial intelligence chips. Technical Paper

DRAM shortage to last through 2028: Nanya Nanya Technology warned the global DRAM shortage could last until 2028 as AI demand drives chipmakers to prioritize HBM production over standard memory. Limited new capacity will keep supply tight and push DRAM prices higher through this year. Taipei Times

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Taiwan Builds the Future Taiwan's electronics industry is set to break chip production and technology records as AI demand surges. But power, water and workforce limits loom. Government programs, partnerships and talent pipelines aim to sustain industry leadership. EE Times

The Causes of Tiny Solder Balls After Reflow We have been seeing tiny solder balls across our boards after reflow. It appears that the solder is exploding as the balls are in areas where there is no paste or components. Board Talk

Technical Papers ■ The Drawbacks of Internal Recycling Systems for Solder Dross ■ Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics ■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible ■ PCB Rework Evolves, With X-ray a Constant Support ■ How pH Cleaning Agents Affect Production Performance ■ A Universal AI-Powered Segmentation Model for PCBA & Semiconductor ■ RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG ■ High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin ■ Understanding Solder Dross: Causes and Control Strategies ■ Optimizing BGA Rework: Challenges, Techniques and Quality Control MORE TECHNICAL PAPERS

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Tech industry group expresses 'concern' to Pete Hegseth over supply chain risk label The Information Technology Industry Council warned Pete Hegseth that labeling AI firm Anthropic a supply-chain risk after a contract dispute misuses emergency authorities and could damage the U.S. tech sector and broader industry confidence. CNBC

Expertise Isn't Everything. Here's Why Industry Experience Is Losing Its Power. Entrepreneurs can build expertise faster today as AI, open-source tools and shared knowledge compress learning timelines. Leaders like Elon Musk show that transferable execution skills—team building and first-principles thinking—often matter more than deep sector experience. Entrepreneur

Rework and Reball Challenges for Wafer-Level Packages The present work addresses the rework and reball challenges of a specific WLP case study, and suggests improvements for maintaining the true failure signature. Technical Paper

Sponsor Is My PCB Wash Concentration in Check Evaluating wash concentration levels through varying testing methods can potentially save process time, reduce overall process costs, and increase cleaning efficacy on PBCs. Read more. KYZEN

This Student-Built EV Focuses on Repairability Students at Eindhoven University of Technology built the Aria EV to prove electric cars can be designed for easy owner repair. Its modular battery and diagnostic app enable users to replace components and fix faults, challenging the industry's trend toward sealed, integrated EV systems. IEEE Spectrum

US says weapons supply under control US defense officials told senators the country remains ahead of munitions shortages despite the Iran war. Washington is strengthening its defense industrial base and focusing readiness and allied support along the first island chain to deter conflict over Taiwan. Taipei Times

Heterogeneous Integration Roadmap: Technology for Systems of the Future The new Heterogeneous Integration Roadmap provides a long-term vision for the electronics industry, identifying future challenges and potential solutions. Technical Paper

Sponsor Micro Dispensing Technology Leader DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries. DL Technology

Trump has an AI data center problem ahead of the midterms — with no easy solutions Donald Trump gathered major tech firms at the White House to sign a pledge to fund their own power for AI data centers, aiming to curb rising electricity costs. Critics, however, say the voluntary agreement lacks binding commitments as energy prices continue climbing. CNBC

China's Honor shows off smartphone with robotic camera arm and teases a humanoid robot Honor unveiled its Robot Phone and Magic V6 foldable at Mobile World Congress, showcasing innovative camera tracking, AI integration, and premium design. The launches highlight Honor's push into high-end smartphones and robotics amid chip shortages and rising prices. CNBC

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

Apple announces MacBook Neo, its most affordable laptop ever Apple unveiled the $599 MacBook Neo, its cheapest laptop ever, powered by an iPhone-class A18 Pro chip. The colorful 13-inch device targets students and budget buyers, as Apple seeks to compete with Chromebooks and revive slowing Mac sales. CNBC

Reworkable Edgebond Applied Wafer-Level Chip-Scale Package This paper presents data showing that localized distribution of recrystallized grains is an accurate indicator of solder joint life-cycle degradation and enhancement. Technical Paper

Supply chain disruptions from the Iran war could raise prices for drugs, electronics and more Iran war has halted tanker traffic through the Strait of Hormuz, disrupting global supply chains. Ships reroute around Africa and Middle East airspace closures ground cargo flights, raising risks of delays, shortages, and higher prices worldwide. AP News

China's Xiaomi tells CNBC it's planning a yearly smartphone chip release and its own AI assistant for overseas Xiaomi plans to release a new smartphone processor annually, expanding beyond its first 3-nanometer XRing O1 chip. The company also prepares an overseas AI assistant and aims to integrate its chip, HyperOS software, and AI features into future smartphones and vehicles. CNBC

Sponsor AI - Boost your factory's Intelligence TRI's AI-powered Inspection Solutions to Boost your Production Line's Intelligence. TRI solutions include AI Repair Station, AI Algorithms, AI Training Tools, and more. Test Research, Inc.

Hackers can now track your car's location through tire pressure sensors Researchers have revealed that tire pressure monitoring systems (TPMS) in many vehicles, including models from Toyota, Renault, Hyundai, and Mercedes, transmit unencrypted data with unique IDs, allowing hackers to track and potentially hijack cars using inexpensive devices. TechSpot