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Thixotropic, Dual Cure Adhesive
Master Bond UV23FLDC-80TK is a dual curing adhesive that withstands rigorous thermal cycling and is suitable for applications where low stress is critical. View full specs.
Master Bond
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Ask the Experts
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ENIG Solderability Issues
We are facing solderability issues on a particular lot of electroless nickel - immersion gold plated circuit boards. The nickel thickness measured with an XRF ...
Responses by:
Umut Tosun Application Technology Manager, Zestron America Richard D. Stadem Advanced Engineer/Scientist, General Dynamics Walter Pierowski Process Engineer, Esterline Interface Technologies Robert "Bob" Lazzara President, Circuit Connect, Inc.
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MORE ASK THE EXPERTS
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Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD
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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
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What Year Was It?
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14th Amendment Adopted
Following its ratification by the necessary three-quarters of U.S. states, the 14th Amendment, guaranteeing to African Americans citizenship and all its privileges, is officially adopted into the U.S. Constitution.
See the answer below.
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High power atmospheric plasma system
Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength!
Plasma Etch
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What Year Was It Answer
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14th Amendment Adopted Answer: July 28, 1868
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July 28, 2026
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Gartner Forecasts Worldwide IT Spending to Grow 14.2% in 2026
Gartner projects global IT spending will reach $6.37 trillion in 2026, rising 14.2% as organisations accelerate AI investments. Data centres, cloud and AI software drive growth, while inflation, supply limits and hardware costs pressure budgets.
Gartner
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How Design-Led Companies Build Stronger Customer Experiences
Many teams treat design as a final polish rather than a core part of the process, rushing designers just before launch. This last-minute approach limits creativity, weakens user experience and often results in avoidable compromises that affect the project's overall quality.
Entrepreneur
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PAE Certification – Oct 2-5, 2026
Advance your expertise with the ESDA Process Assessment Engineer (PAE) Certification at the 2026 EOS/ESD Symposium. Learn ANSI/ESD SP17.1 principles to assess and improve EOS/ESD processes.
EOS/ESD Association
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Why Did LG Stop Making Smartphones?
LG officially ends its smartphone journey on July 31 after exiting the market in 2021, closing a chapter marked by innovations like the Prada and G3. The company shifted focus to EV components, AI and B2B businesses, where it has since achieved strong growth.
BGR
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Why Uneven Conformal Coating?
We are experiencing an issue with our conformal coating. On matte finish boards the coating is vibrating away from some others and building up in others.
Board Talk
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TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology, Inc.
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Adaptive Hardware Could Change How EV Chargers Are Designed
Vanix Technologies is using AMD's Zynq Adaptive SoC to build AC EV chargers that support remote hardware and software updates. The design helps operators adapt to India’s evolving grid, standards and future power needs without replacing controller hardware.
EE Times
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Rheology of Solder Paste: Shelf Life Study
This study offers a better understanding of the correlation between rheological properties and shelf life of solder paste exposed to extreme conditions.
Technical Paper
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Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK
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Unlock the Potential of Salvaged Devices
Component harvesting is a reliable method of electronic component reclamation, reducing e-waste and ensuring economic reuse for automated assembly.
BEST Inc.
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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom
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| Sponsor |
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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
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Apple ends day as world's most valuable company, passing Nvidia
Apple reclaimed the title of the world's most valuable company after its shares rose and Nvidia's declined amid investor concerns over AI spending. Investors also shifted focus toward memory and data-centre infrastructure ahead of Apple's upcoming earnings report.
CNBC
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| Today's Sponsor |
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| Sponsor |
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Test Your Knowledge
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What was the diameter of the first-generation floppy disk?
See answer below.
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Industry Press
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KIC Brings Automatic Profiling & Thermal Intelligence to Midwest SMTA Expos
KIC will exhibit at two consecutive SMTA Expo & Tech Forum events this August, bringing its latest Automatic Profiling technology and Heat to Data™ approach to Thermal ...
KIC
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ViTrox Americas Welcomes Doug Ennis as Senior Field Applications
ViTrox Americas is pleased to announce the addition of Doug Ennis as Senior Field Applications & Service Engineer, further strengthening the company's technical ...
ViTrox Americas
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DISTRON Brings High-Rel Medical Manufacturing Expertise to MEDevice Boston
Distron Corporation will be exhibiting at MEDevice Boston 2026, taking place August 26–27 at the Thomas M. Menino Convention Center in Boston. Visitors can find ...
Distron Corporation
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SEHO Spotlights Smart, Scalable Soldering, Automation & productronica India
SEHO Systems will highlight its latest approaches to efficient, highly controlled electronics manufacturing at productronica India, taking place September 16-18, 2026 ...
SEHO Systems
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Cementex Launches VIP American-Made 250th Anniversary Flag Giveaway
Cementex announces the launch of its VIP American-Made 250th Anniversary Flag Giveaway, a monthly program recognizing customer loyalty while celebrating ...
Cementex
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The Commitment Behind Creative Electron's Three-Year Warranty
Creative Electron, Inc. offers an industry-leading three-year warranty across its equipment portfolio. But the real value of that warranty extends far beyond the number ...
Creative Electron, Inc.
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MW Associates Promotes Mickie Bourns, Strengthening Digital Marketing
MW Associates is pleased to announce the promotion of Mickie Bourns to Digital Marketing & Communications Manager. Since joining MW Associates in March 2019, ...
MW Associates
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MORE INDUSTRY PRESS
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Quote of the Day
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Motivation is what gets you started. Habit is what keeps you going. Jim Ryun
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Let our contract cleaning services help
If you have a technical cleaning question, or if you are facing process challenges or performance challenges, use this technical hotlist form to get help from a KYZEN Technical Care Expert.
KYZEN
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| Cartoon of the Day
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"When we pay women less, that's discrimination. To make it fair, we should pay everyone less."
Copyright © Randy Glasbergen
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Start Micro Dispensing Today
The DL Micro Valve is specifically designed for dispensing micro volumes of material in precise, repeatable patterns. Learn more about the DL Micro Valve.
DL Technology
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Test Your Knowledge Answer
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What was the diameter of the first-generation floppy disk? Answer: 8 inches (approx 200mm) in diameter. Invented by Alan Shugart at IBM in 1967.
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