circuitnet
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
Ask the Experts
Components Jumping Around During Reflow
We reflowed a set of boards using a lead-free solder process and had issues with components jumping around from their initial placed position. We then changed ...
Responses by:
Brian Smith
General Manager - Electronic Assembly Americas, DEK International
Peter Biocca
Senior Market Development Engineer, Kester
T.J. Hughes
Manufacturing Engineer, Esterline Interface Technologies
Fred Dimock
Manager, Process Technology, BTU International
Gary Freedman
President, Colab Engineering
Estimating Failure Rate During Rework
Long Term Component Storage
How To Measure Solder Paste Rolling Diameter
Class 3 Pin Contact Question
Solder Paste Print Test Boards
Removing Cleaning Residues Under BTC Packages
BGA Solder Ball Wetting
MORE ASK THE EXPERTS
Essegi-Automation
Sponsor
Glenbrook-Technologies

Counterfeit Components Identified With X-ray Inspection
Automated component sourcing and procurement platform relies on real-time X-ray inspection to remove counterfeit components from supply chain.
Glenbrook Technologies
Industry Calendar
Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA
Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMT
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
Oct 1, 2026
Long Island Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Uyemura
Sponsor
Alltemated

Seeking Alternatives for Dispensed Adhesives?
No more dispensing, no more curing. PLACE-N-BOND™ Underfilm is pre-formed adhe-sive for automated placement. Learn more.
Alltemated, Inc.
What Year Was It?
War in Iraq Begins
What Year
The United States, along with coalition forces primarily from the United Kingdom, initiates war on Iraq.
See the answer below.
Sponsor
AI-Technology-Inc

Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
SEHO
What Year Was It Answer
War in Iraq Begins
Answer: March 19, 2003
March 19, 2026
image
The Electronics Industry Prepares for 'Verified Sustainability' in 2026
Consumer electronics firms face rising pressure to prove sustainability claims with verified data. EU regulations, digital product passports, and investor and consumer scrutiny are driving a shift toward circularity, forcing companies to embed transparency across product lifecycles.
EE Times
Sponsor
Indium-Corporation

High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability and reduces energy use up to 15%.
Indium Corporation
Five-layer tariff stack: what the effective rate actually looks like for electronics components
Sourcing teams often miscalculate duty exposure on imported electronics by relying on a single figure. In reality, effective duty rates combine five distinct layers, each controlled by different authorities, published separately, and updated on independent timelines.
Venture Outsource
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
Electrostatic discharge (ESD) threatens IoT and high-reliability electronics as components shrink and densify. This paper details design protections, assembly controls, and validation methods to help engineers and OEMs enhance device resilience and ensure long-term performance.
Technical Paper
How China is getting everyone on OpenClaw, from gearheads to grandmas
China is rapidly driving adoption of OpenClaw, with tech giants like Baidu and Tencent hosting public events as users embrace its automation power. While boosting productivity and "one-person companies," authorities warn of security risks and tighten controls in sensitive sectors.
CNBC
Sponsor
Manncorp

Built to Scale. Proven in Production.
Microsystems World CNC boosted throughput and automation by trading up to a complete inline SMT solution—powered by Manncorp and designed for long-term growth.
Manncorp Inc.
ENIAC, the First General-Purpose Digital Computer, Turns 80
ENIAC, unveiled in 1946, revolutionized computing with its electronic, programmable design, enabling high-speed calculations for wartime needs. Its success launched the modern computing industry, driving decades of innovation & establishing the foundation for today's digital economy.
IEEE Spectrum
Reexamination of Thermal Cycling Reliablity of BGA Components
A direct comparison was conducted between SnPb and lead-free solder joints focused on long-term thermal cycling reliability after being exposed to high-temperature aging for a long period of time using two test vehicle designs.
Technical Paper
Technical Papers
Scaling SMT Traceability
The Drawbacks of Internal Recycling Systems for Solder Dross
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible
PCB Rework Evolves, With X-ray a Constant Support
How pH Cleaning Agents Affect Production Performance
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin
Understanding Solder Dross: Causes and Control Strategies
MORE TECHNICAL PAPERS
Sponsor
Circuit-Technology-Center

Cold Precision Milling for Underfilled BGA Removal
Traditional thermal removal methods for underfilled BGAs risk pad cratering, substrate delamination, and damage to nearby circuitry.
Circuit Technology Center
Samsung and AMD to partner as workers mull strike
Samsung Electronics agreed to supply AMD with next-generation HBM4 memory for MI455X AI accelerators and collaborate on future technologies. It plans longer chip contracts to stabilize supply, even as rising demand, shortages, and potential worker strikes threaten production.
Taipei Times
Dell Shrunk Its Workforce By 10% for the Third Year in a Row — Without Layoffs
Dell trimmed its workforce by about 10% over the past year through hiring freezes and reorganizations, avoiding mass layoffs. A recent filing shows headcount fell by roughly 11,000 employees, reaching 97,000 as of January 31.
Entrepreneur
Test Methods for Electrochemical Consistency in PCB Assembly Processes
This paper will review traditional and emerging methods to characterize flux residues and cleanliness of finished assemblies.
Technical Paper
Sponsor
Schunk

Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK
Is Ethernet Actually More Reliable Than Wi-Fi?
Ethernet delivers faster, more stable internet than Wi-Fi, offering lower latency and fewer dropouts. While modern Wi-Fi provides flexibility and mobility, wired connections remain the best choice for reliability and peak speeds, especially for gaming, PCs & performance-critical devices.
BGR
How the red-hot AI data center boom is igniting demand for a new, lucrative career path: Trade workers
Surging AI data center demand drives Amazon, Meta, Microsoft, and Alphabet to invest $700 billion, creating jobs but exposing a critical shortage of skilled technicians, engineers, and construction workers needed to sustain global tech expansion.
CNBC
Limitations of ROSE Testing Versus Localized Contamination
Recognizing the limitations of ROSE testing versus localized contamination, what can I use to validate the cleanliness of my finished product?
Board Talk
Sponsor
Rehm-Thermal-Systems-GmbH

The perfect protection for your electronics
Rehm's ProtectoXP and ProtectoXC systems offer flexible, high-quality coating solutions that shield electronics from moisture, corrosion, and other environmental damage.
Rehm Thermal Systems
One Billion Cellular IoT LPWAN Connections
The global telecom sector reached 1 billion NB-IoT and LTE-M connections by 2025, marking cellular IoT’s maturity. Industry collaboration enabled scalable deployments, while emerging 5G eRedCap technology and eSIM adoption are set to drive the next phase of IoT growth.
EE Times
Taiwan's Emerging Power Electronics Strategy in the AI Era
Taiwan is expanding beyond digital logic by advancing power electronics, leveraging SiC and GaN technologies, strong packaging expertise, and policy support to build an integrated ecosystem that boosts energy efficiency across EVs, renewables, and AI-driven data centers.
EE Times
Sponsor
DL-Technology

EZ-FLO High Precision Ceramic Dispense Tips
The ceramic molding process allows for smaller more precise inner diameters with a glass-like finish, giving you the ultimate control. Learn more.
DL Technology
How Meta's Manus acquisition ignited a new tech war
Meta's $2 billion Manus acquisition faces collapse as Chinese regulators probe alleged "Singapore washing" and illegal AI transfers. Rising geopolitical tensions, U.S. scrutiny, and internal pressures threaten the deal, underscoring growing global barriers to cross-border AI expansion.
Digitimes
Simulation and Fault Diagnosis in Post-Manufacturing Mixed Signal Circuits
In this paper, an effective method for predicting circuit failures in post-market circuit boards through simulation and deep learning is proposed and implemented.
Technical Paper
No chip supply shortage: SEMI
SEMI Taiwan says chipmakers face no immediate material shortages despite the Middle East conflict, as diversified sourcing secure helium supply. However, rising raw material costs threaten margins, prompting firms to strengthen supply chains and accelerate renewable energy adoption.
Taipei Times
AI Ushers In the Age of No-Compromise Gaming
AI-powered super-resolution tools like AMD's FSR Redstone and Nvidia's DLSS 4.5 remove the tradeoff between FPS and visual quality. By blending upscaling, frame generation, and ray enhancements, they enable smoother gameplay and more immersive experiences.
EE Times
Sponsor
ECD

Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD
iFixit Tears Down the iPhone 17e, Discovers MagSafe Upgrade Path for iPhone 16e Owners
Apple's iPhone 17e restores MagSafe magnets, fixing clunky wireless charging and enabling accessories. Even better, 16e users may upgrade by swapping the back panel. While performance gains are modest, expanded parts compatibility boosts repairability and lowers costs.
iFixIt
Today's Sponsor
Viscom-SE
Sponsor
Viscom-SE

Discover the power of vAI ProVision from Viscom
Create and optimize 3D AOI and AXI programs in minutes. vAI ProVision boosts inspection depth, quality, and speed. Viscom develops & produces premium inspection systems.
Viscom SE
Test Your Knowledge
What yellow, fossilized resin did the Greeks and Romans use in jewelry?
See answer below.
Industry Press
KYZEN Proves 100 Was Just the Beginning with 101st Award
KYZEN has earned its 101st industry award with a 2026 New Product Introduction (NPI) Award in the Cleaning Materials category for its innovative MICRONOX® MX2123 ...
KYZEN
Seika Machinery Wins 2026 NPI Award for New Stencil Inspection Platform
Seika Machinery, Inc. has received a 2026 NPI Award in the Process Control Tools category for its SAWA Automatic Stencil Inspection System T100. The SAWA T100 ...
Seika Machinery, Inc.
Keiron's Laser-Driven LiFT Technology Wins 2026 NPI Award
Keiron Printing Technologies
Arch Systems Wins NPI Award for AI Dashboard Vision, Turning Factory Data
Arch Systems
VJ Electronix Wins 2026 NPI Award for Summit LT150
VJ Electronix, Inc.
Kurtz Ersa Sweeps 2026 NPI Awards at APEX for Reflow, Selective Soldering
Kurtz Ersa Inc.
PEMTRON's EAGLE 3D 8800 TWIN DL Wins 2026 NPI Award
PEMTRON
Data I/O's LumenX2 Platform Earns 2026 NPI Award
Data I/O Corporation
Elisa Industriq's CalcuQuote Wins 2026 NPI Award
CalcuQuote
Fuji America Wins Two 2026 NPI Awards
Fuji America
The Adaptsys Group's 3DInspect Earns 2026 NPI Award
The Adaptsys Group
KIC® HeatMap™ Advances Oven Health Monitoring Wins 2026 NPI Award
KIC
Austin American Technology's Typhoon Super T8 Wins 2026 NPI Award
Austin American Technology
MORE INDUSTRY PRESS
Air-Vac-Engineering
Sponsor
Advanced-Interconnections

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
Quote of the Day
"Expecting the world to treat you fairly because you are a good person is a little like expecting the bull not to attack you beause you're a vegetarian."
Dennis Wholey
Sponsor
kyzen

The "Fried Egg" Effect in Soldering
Burnt-on flux residue that is visible on the solder mask of PCBs after improper reflow settings produces significant challenges to the reliability of finished boards.
KYZEN
Smart-Sonic
Cartoon of the Day
Cartoon
"There's going to be a lot of finger pointing around here and I'd like to put you in charge. You have exquisite hands."
Copyright © Randy Glasbergen
Sponsor
Master-Bond

One Part, Thermally Conductive Epoxy
Master Bond EP3UF is an electrically insulative, thermally conductive adhesive that passes NASA low outgassing tests and can be used for bonding and underfill applications.
Master Bond
Heller-Industries-Inc
Test Your Knowledge Answer
What yellow, fossilized resin did the Greeks and Romans use in jewelry?
Answer: Amber