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Sponsor
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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IPC 610 Class 3 with Missing Non-functional BGA Pads
We have a board assembly that must be built to IPC 610 Class 3. On a few boards it has been necessary to remove and replace a BGA packaged part. Three pins ...
Responses by:
Georgian Simion
Engineering and Operations Management, Independent Consultant
Fritz Byle
Process Engineer, Astronautics
Kris Roberson
Manager of Assembly Technology, IPC
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Sponsor
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Scaling SMT Traceability
High-mix electronics manufacturing requires precise material control. This whitepaper explains how Tecnimaster improved traceability, inventory accuracy and picking efficiency through integrated automated storage and reel-level tracking.
Essegi Automation
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What Year Was It?
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The day was Oct 22. What year was it?
Cuban Missile Crisis
In a televised speech of extraordinary gravity, President John F. Kennedy announces that U.S. spy planes have discovered Soviet missile bases in Cuba.
See the answer below.
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What Year Was It Answer
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Cuban Missile Crisis
Answer: October 22, 1962 |
Apple's iPhone Factories Will Not Make India the Next China
India is expanding smartphone exports and local component production beyond basic assembly. However, reliance on subsidies and imported parts, plus limited semiconductor capabilities, raises doubts about sustainable, high-value manufacturing growth.
Taipei Times
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When GPS Isn't Enough: Building a Second Layer of Positioning
Cellular networks are emerging as reliable alternatives when GNSS fails due to jamming, spoofing, or poor coverage. Advances in 4G, 5G, NTN, edge computing, and AI could enable resilient positioning, sensing, and location intelligence alongside satellite navigation.
EE Times
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Sponsor
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Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
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Sponsor
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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
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Semiconductor industry's electricity use hits record
Taiwan's semiconductor industry consumed a record 4.5 terawatt-hours of electricity last month as AI demand surged. The Taiwan Research Institute expects annual consumption to exceed 50 TWh this year, while high-tech production boosts investment and exports.
Taipei Times
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How Wikipedia's Editors Keep the Online Encyclopedia Human-Written
Ellia Lebleu and WikiProject AI Cleanup volunteers are refining methods to identify and remove AI-generated content that violates Wikipedia's guidelines. As machine-written material becomes subtler, they continue debating artificial intelligence’s role in the online encyclopedia.
IEEE Spectrum
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Sponsor
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Plasma as a Key Technology
Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma® & PlasmaPlus®.
Plasmatreat GmbH
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Why Chip Design AI Benchmarks Must Go Beyond Functional Correctness
ChipAgents and NVIDIA launched Build-A-Chip-Bench to assess AI agents across the chip design process, from specifications to physical implementation. Tests show promise but reveal ongoing challenges in ensuring correctness, optimizing performance and meeting power constraints.
EE Times
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Sponsor
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Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect
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First iPhone Duo unboxing videos surface ahead of official reviews
Unboxing videos reveal Apple's iPhone Duo in Star White and Night Sky, showcasing its folding animation, nearly invisible screen crease, and child-focused camera feature. Pre-orders are open, but limited store availability and January 2027 shipping dates may frustrate buyers.
Apple Insider
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Sponsor
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iX7059 SMT Edition: Next-Gen 3D X-ray
Experience high-precision inline 3D X-ray inspection by Viscom with AI-powered defect detection, exceptional image quality, and reliable performance for complex SMT assemblies.
Viscom SE
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5 Common Issues With Smart Home Doorbells
Smart doorbells offer convenient home monitoring but raise privacy, hacking and data-sharing concerns. Users also face unreliable Wi-Fi, false alerts, missed notifications, faulty chimes and short battery life, often requiring troubleshooting, adjustments or frequent recharging.
BGR
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HCFC-225 Phaseout, What Now?
The use restrictions on HCFC-225 are in effect throughout the US. This paper discusses the options for assemblers and component manufacturers.
Technical Paper
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Why is Elon Musk plotting a mega-merger of SpaceX and Tesla?
Elon Musk is exploring a potential merger between Tesla and SpaceX, combining electric vehicles, robotics, rockets, satellites and AI technologies. Although special committees are assessing the deal, shareholder approval and regulatory scrutiny remain significant hurdles.
BBC
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Sponsor
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AI - Boost your factory's Intelligence
TRI's AI-powered Inspection Solutions to Boost your Production Line's Intelligence. TRI solutions include AI Repair Station, AI Algorithms, AI Training Tools, and more.
Test Research, Inc.
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Policy to spur next-gen smart plants
China is drafting policies to integrate AI into smart manufacturing, upgrading factories, robotics and industrial systems. The push follows strong growth, with electronics output rising 15.8% and profits surging 109.9%, driven by AI devices, servers and data centers.
China Daily
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Sponsor
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BGA Rework Without Compromise
From component removal and site redress to pad repair and X-ray inspection, our technicians handle complex BGA rework with precision and proven processes.
Circuit Technology Center
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Test Your Knowledge
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What was the code name for the development of the A-bomb?
See answer below.
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| Industry Press |
TRI to Highlight One-Stop Solutions at SMTA Space Coast 2026
Test Research, Inc. announces that it will exhibit at the SMTA Space Coast Expo and Technical Forum, taking place November 11, 2026, at the Melbourne Auditorium ...
Test Research, Inc.
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Microscreen Continues U.S. Expansion with New Baltimore Manufacturing Facility
Microscreen has opened a new manufacturing facility in Baltimore, Maryland. The location is Microscreen’s third U.S. manufacturing facility and the second new ...
MicroScreen LLC
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Modular Test Solution for Automotive Cameras and Displays Based on ASA-Motion Link
High-resolution cameras and displays in vehicles require fast and secure communication with the electronic control units (ECUs) and all other components. ...
GOEPEL Electronic
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BTU International to Showcase High-Reliability Reflow Solutions at SMTA Space Coast
BTU International will showcase its high-reliability reflow solutions at the SMTA Space Coast Expo and Technical Forum, taking place November 11 at the Melbourne ...
BTU International, Inc.
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NetVia Group Invests Over $1 Million in Advanced PCB Equipment
NetVia Group announced an investment of more than $1 million in advanced mancturing equipment, cybersecurity infrastructure, and CMMC certification and ...
NetVia Group
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Fulling Motor North America Expands Frameless Motor Portfolio with New Outer-Rotor Option
Fulling Motor North America, LLC (FMNA) is pleased to announce that it has expanded its frameless motor portfolio with the addition of a new outer-rotor option, ...
Fulling Motor North America, LLC
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American Hakko Supports Breast Cancer Awareness Through Annual Fundraising Campaign
American Hakko Products, Inc. announces that it is continuing its annual commitment to breast cancer awareness with a special fundraising campaign running ...
American Hakko Products, Inc.
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MORE INDUSTRY PRESS
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Sponsor
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Quote of the Day
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"Old age is not so bad when you consider the alternatives."
Maurice Chevalier
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Sponsor
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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
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| Cartoon of the Day
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"That's what I hate about computers - there's never anything yummy in the trash!"
Copyright © Randy Glasbergen
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Sponsor
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Eliminate Worry of Cross Contamination
While Models 529 and 1550 are similar semi-automatic cleaners with single wash and rinse tanks, the Model 2003 includes 2 wash tanks for cleaning multiple applications in one machine.
Smart Sonic
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Test Your Knowledge Answer
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What was the code name for the development of the A-bomb? Answer:
The Manhattan Project |
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