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Sponsor
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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Delamination After V-cut
We have a problem with delamination after breaking our board from a multi-up panel. The material is cem3-V0. The ...
Responses by:
Georgian Simion
Engineering and Operations Management, Independent Consultant
Leo Lambert
Vice President, Technical Director, EPTAC Corporation
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Sponsor
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440-R + Ultrasonics = Safe & Efficient Cleaning
Clean any type of solder paste in the same machine using 440-R-SMT Detergent. It is the one detergent that will do it all: stencils, pallets, misprints & SMD adhesives.
Smart Sonic
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What Year Was It?
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The day was Sep 22. What year was it?
Lincoln Issues Emancipation Proclamation
President Abraham Lincoln issues a preliminary Emancipation Proclamation, which sets a date for the freedom of more than 3 million black slaves in the United States and recasts the Civil War as a fight against slavery.
See the answer below.
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Sponsor
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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What Year Was It Answer
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Lincoln Issues Emancipation Proclamation
Answer: September 22, 1862 |
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Sponsor
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Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK
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Singapore: Turning Quantum Research into Business Opportunity
Singapore is accelerating quantum commercialization with government funding, research infrastructure, semiconductor capabilities and talent programs. Its National Quantum Strategy advances computing, fabrication, sensing and communications.
EE Times
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AI Power Demands Push GaN into Data Center Design
AI's rapid power demands are pushing data centers beyond silicon's limits. GaN offers higher switching frequencies, greater power density and improved efficiency, supporting 800-V architectures and thousands of amperes as AI GPUs approach 5-kW power consumption.
EE Times
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Recommended Board Spacing During Reflow
When running boards through a re-flow oven, should there be a gap between boards, or can they run end-to-end? The Assembly Brothers, Jim Hall and Phil Zarrow, discuss this question.
Board Talk
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Taiwan can help set standards in AI race
AI's rapid progress forces the US to balance safety against competition with China. As leading executives urge caution, Taiwan faces growing geopolitical pressure and should help shape international rules for AI safety, computing governance, and semiconductor traceability.
Taipei Times
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US and China consider making AI channel
US and Chinese officials explored an AI dialogue and notification mechanism for national-security incidents, seeking limited cooperation despite rising tech tensions. Talks also covered trade, critical minerals, farm purchases and a Trump-Xi summit.
Taipei Times
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Sponsor
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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C.
Ormet® TLPS
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Microsoft to double data centers in Taiwan
Microsoft plans to double its Taiwan data centers from two to four, mainly in the north, to address persistent capacity shortages. The company also expands Azure services and develops custom ASICs to support growing AI inference workloads and reduce computing costs.
Taipei Times
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Sponsor
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actnano Materials with Nordson Equipment
actnano's PFAS-free, cure-free coatings save energy and boost safety. And they are compatible with Nordson conformal coating systems. Upgrade your system today. Learn more!
Nordson Electronic Solutions
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Scaling Physical AI Deployment Beyond the Demo
Vision-Language-Action models enable robots to understand environments, follow natural-language commands and adapt dynamically. Deployment still requires optimized inference, real-time control, heterogeneous computing and scalable software across diverse robotic platforms.
EE Times
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Sponsor
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SMTA Mexico – vAI ProVision
vAI ProVision: Smarter Inspection Programming Discover vAI ProVision by Viscom at SMTA Mexico, Booth: 343. Using proven inspection strategy and AI, it creates optimized inspection programs faster, reducing workload and enhancing reliability.
Viscom SE
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Design Once, Reuse Forever: The Reconfigurable Analog Front End
AnalogPAK combines programmable analog and digital functions to let engineers reuse and scale sensor designs without hardware changes. Gain, filtering, compensation and thresholds support multiple sensors while reducing components, cost and development time.
EE Times
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Challenges on ENEPIG Finished PCBs
Through extensive investigation, using 8D and Kepner-Tregoe problem solving methods, solutions were discovered in the majority of cases.
Technical Paper
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Sponsor
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Stop paying for silver you don't need!
Stop paying for silver you don't need! Visit indium.com to learn how Indium Corporation's low-silver alloys paired with award-winning flux deliver the performance you need.
Indium Corporation
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Test Your Knowledge
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What is quicksilver?
See answer below.
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| Industry Press |
LPMS USA to Highlight Local Supply and Simplified Electronics Protection at SMTA Guadalajara
LPMS USA will exhibit at the SMTA Guadalajara Expo & Tech Forum, October 7–8, 2026, at Expo Guadalajara. At Booth #347, LPMS will highlight low ...
LPMS USA
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ViTrox to Showcase AI-Driven Smart Manufacturing & Vision Inspection Innovations at SMTA Penang 2026
ViTrox is pleased to announce its participation in SMTA Penang 2026. The exhibition will be held from 23 to 24 September 2026 at the Iconic Marjorie Hotel ...
ViTrox Technologies Sdn Bhd
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VJ Electronix to Highlight Summit LT150 Rework System at SMTA Long Island Expo
VJ Electronix will feature its Summit LT150 semi-automated rework system at the SMTA Long Island Table-Top Expo, scheduled for Thursday, Oct. 1, 2026, ...
VJ Technologies
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YINCAE Brings New Advanced Materials to IMAPS 2026
IMAPS 2026 is less than two weeks away, and we invites you to visit Booth #408 to discover our latest material innovations and discuss your most challenging applications ...
YINCAE Advanced Materials, LLC
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ICTC Philippines Expands Manufacturing Capabilities with New Facility in Laguna
Interconnect Cable Technologies Corporation (ICTC) is proud to announce that ICTC Philippines has reached a significant milestone with the opening ...
Interconnect Cable Technologies Corporation (ICTC)
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CE3S Expands Product Portfolio to Deliver More Comprehensive Sourcing Solutions for Electronics Manufacturers
CE3S will showcase its expanded portfolio of electronics manufacturing products and solutions at the SMTA Long Island Expo on Oct. 1, giving electronics ...
Cumberland Electronics Strategic Supply Solutions (CE3S)
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Experience Laser Technology Live: IPG Photonics at EuroBLECH 2026
IPG Photonics will present new solutions and demonstrate live how modern laser technologies can improve precision, speed, and cost-effectiveness in sheet metal ...
IPG Photonics Corporation
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MORE INDUSTRY PRESS
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Quote of the Day
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"All exact science is dominated by the idea of approximation."
Bertrand Russell
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| Cartoon of the Day
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"As soon as we solve one problem, another one appears. So let's keep this problem going for as long as we can!"
Copyright © Randy Glasbergen
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Test Your Knowledge Answer
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What is quicksilver? Answer:
Mercury |
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