June 5, 2026

Foxconn and Intel Team Up to Build AI Systems Foxconn and Intel partnered to build next-generation AI infrastructure, combining manufacturing, chip and software expertise. The alliance targets AI data centers, edge AI, robotics and smart cities, while expanding work with SK Group on AI servers, data centers and energy solutions. Taipei Times

Sponsor EZ-FLO High Precision Dispense Tips Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more. DL Technology

European Electronic Waste Dilemma Europe's e-waste recyclers processed a record 62 million metric tons of electronic waste in 2022, but shrinking margins from unregulated rivals, volatile commodity prices, and strict rules threaten the sector's long-term sustainability. EE Times

PCB Rework Evolves, With X-ray a Constant Support Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years. Technical Paper

AI boom pushes server makers beyond traditional assembly role: Wistron Wistron CTO David Shen says AI is driving "super integration" in server manufacturing, demanding expertise across computing, networking, cooling and power. Suppliers are racing to manage complexity, heat and energy limits as global AI infrastructure scales. Taipei Times

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

Warren invites Nvidia CEO Jensen Huang to Senate hearing on China AI chip sales Nvidia CEO Jensen Huang will testify before the Senate Banking Committee on June 11 after Senator Elizabeth Warren raised concerns about the company's China sales, export controls, and national security risks tied to AI chips powering global data centers. CNBC

Advancing Bonding Techniques for Electronic Interconnects This study focuses on two major bonding techniques: Cu nanoparticle (Cu NP) sintering and Cu-Sn3.0Ag0.5Cu (Cu-SAC305) hybrid paste bonding. Both methods aim to address the limitations of conventional soldering processes, especially in high-temperature, high-power applications. Technical Paper

Technical Papers ■ Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse ■ Digital Warehouse Automation in High-Mix PCB Assembly ■ Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses ■ Scaling SMT Traceability ■ The Drawbacks of Internal Recycling Systems for Solder Dross ■ Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics ■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible ■ PCB Rework Evolves, With X-ray a Constant Support ■ How pH Cleaning Agents Affect Production Performance ■ A Universal AI-Powered Segmentation Model for PCBA & Semiconductor MORE TECHNICAL PAPERS

Sponsor The Battle for Space Superiority Has Begun The next conflict may begin in orbit. Learn why resilient space systems and advanced manufacturing matter more than ever. Summit Interconnect

This Common 'Negative Perception' Is Holding Back New Graduates, Says a Top Deloitte Executive Deloitte Asia-Pacific CEO Rob Hillard says universities are failing to prepare students for AI-driven workplaces by treating AI as cheating rather than a practical tool. He urges hands-on AI training as firms expand hiring despite growing worker concerns about automation and job displacement. Entrepreneur

Global Electronics Association Commends the European Commission for Strengthening Technological Sovereignty by Proposing the Chips Act 2.0 The European Commission advances Chips Act 2.0 under the Technological Sovereignty Package expanding support from semiconductors to full electronics ecosystem It strengthens PCBs, PCBAs, IC substrates and packaging to boost EU tech independence. Global Electronics Association

Printed Electronics for Medical Devices This paper will share details about multiple medical sensing applications and the advanced materials and processes used to assemble them for optimal functionality. Technical Paper

Sponsor Vapor Phase Profiling Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more. ECD

Artificial intelligence companies warn of bottlenecks Taiwanese AI supply-chain firms forecast strong growth as AI investment surges, boosting demand for memory, custom chips, substrates, and packaging. Executives warn shortages in capacity, packaging, and materials could constrain expansion phase. Taipei Times

PC shipments could drop 20% by year's end as AI datacenters consume 70% of high-end DRAM A global shortage of high-end DRAM fueled by AI data center demand is squeezing PC makers, lifting prices and slowing shipments. IDC forecasts 11.3% shipment declines and 17% higher PC prices as vendors face tight supply and MacBook Neo competition TechSpot

Solder Balls on Neighboring Components After Rework During the rework of SMT components on conformal coating boards we see solder balls occurring on neighboring components. How can this be eliminated? Board Talk

Sponsor Plasma as a Key Technology Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma ® & PlasmaPlus®. Plasmatreat GmbH

Kevin O'Leary says he will shrink his Utah AI data center project after political backlash Celebrity investor Kevin O'Leary has softened his stance on a controversial 40,000-acre AI data center project in Utah after public criticism. While continuing to support the development, he now says he is open to reducing the campus's size to address community concerns. NBC News

71% of Americans now oppose data centers near their homes, up from 42% just nine months ago A new survey finds U.S. opposition to nearby data centers has surged to 71%, as rising electricity costs, heavy water use, and AI-driven demand fuel backlash. Regulators and lawmakers now weigh stricter oversight and cost-sharing rules proposals. TechSpot

Sponsor Build Your Solution with Manncorp Get a custom SMT equipment plan in minutes and source your entire line from one trusted supplier—backed by lifetime expert support you won't find anywhere else. Manncorp Inc.

China's long march to technological supremacy China's long-term investment in research, education and industrial policy is driving rapid gains in AI, energy and frontier technologies, turning scientific strength into global influence, while reshaping competition with the US and accelerating a shift toward technological self-reliance. Taipei Times

Counterfeit Electronics Component Conundrum with Smart Labeling Electronics manufacturers hurting from supply chain disruptions and component shortages are challenged by the rise in counterfeit components. Technical Paper

Advancing the Future of Apprenticeship Through Collaboration At the 2026 Apprenticeships for America Summit, David Hernandez of the Global Electronics Association urged collaboration, employer-centered design, and cross-state coordination to scale apprenticeships while preserving flexibility and responsiveness. Global Electronics Association

Ferrari Says It Won't Build Self-Driving Cars, And Gas Engines Aren't Going Anywhere Ferrari CEO Benedetto Vigna reaffirmed that the brand will not build fully autonomous cars, prioritizing driver engagement over hands-free technology. As Ferrari launches its first EV, the Luce, it positions electric, hybrid, and combustion models as equal choices for customers. Auto Blog

Sponsor Reduce Risk - Test PCBA Cleaning Under Real Conditions Validate your cleaning process with real assemblies and proven analytics. Gain reliable results and a clear recommendation. Request your cleaning trial today. ZESTRON Europe

AI has a water problem — Google thinks it has a fix Google set five water sustainability goals, pledging to replenish more water than its data centers consume by 2030. It will invest in infrastructure, expand alternative sourcing, and increase transparency amid rising community pushback over AI-driven data center growth. The Verge