circuitnet
Sponsor
AI Technology, Inc.
Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
Ask the Experts
Test Probe Problems After Pin-In-Paste
We are having test probe contact issues with our Pin-In-Paste process. The root cause being the flux residue on the surface of the solder joint. Test probes can't penetrate ...
Responses by:
Richard D. Stadem
Advanced Engineer/Scientist, General Dynamics
Georgian Simion
Engineering and Operations Management, Independent Consultant
Mike Scimeca
President, FCT Assembly
Mark Waterman
M.O.L.E. Line Product Manager, Electronic Controls Design, Inc. (ECD)
Fritz Byle
Process Engineer, Astronautics
Bill Coleman
Vice President Technology, Photo Stencil
Peter Biocca
Senior Market Development Engineer, Kester
■ Seeking IPC and J-STD Definitions
■ Use of Nitrogen for Hand Soldering
■ Suggested Limit for PCBA Heat Cycles
■ QFN Test Failures Caused by Flux
■ Competing Reflow Oven Zones
MORE ASK THE EXPERTS
Introducing New Board-to-Board Connectors
Sponsor
SEHO Systems GmbH
You need clear soldering results?
The SEHO PowerVision AOI system is for fast, automated optical inspection. Designed for THT processes & focusses on 2 points: Continuous quality assurance & cost-efficient production processes.
SEHO Systems GmbH
Industry Calendar
■ Nov 6, 2026: Guadalajara Chapter: Foro Estudiantil
■ Nov 10, 2026: LearnLive: Advanced Electronics Assembly Technologies Course
■ Nov 10, 2026: Tampa Bay Expo & Tech Forum
■ Nov 10, 2026: Joint Boston Chapter/EPTAC Technical Meeting: Standards Update
■ Nov 12, 2026: Space Coast Expo & Tech Forum
FULL INDUSTRY CALENDAR
Focus on Storage Solutions -post APEX
Sponsor
BEST Inc.
Bring IPC Training to Your Facility
Mobile training center offers IPC certified classes at your company’s facility making solder training effective and convenient for your entire team.
BEST Inc.
What Year Was It?
The day was Nov 6. What year was it?
U.N. Condemns Apartheid
What Year
The United Nations General Assembly adopts a resolution condemning South Africa's racist apartheid policies.
See the answer below.
Sponsor
Circuit Technology Center
The Right Tools for Every PCB Repair
Damaged circuit boards don't always need to be replaced. CircuitMedic offers professional-grade repair kits, tools, and materials for restoring damaged pads, traces, plated holes, and circuit board surfaces.
Circuit Technology Center
Innovation in Every Drop
What Year Was It Answer
U.N. Condemns Apartheid
Answer: November 6, 1962
Nov 6, 2026
image
Voters Rejected AI Data Centers Over Resource Concerns
Voters approved 40 of 41 ballot measures seeking AI data center restrictions, citing concerns over water and electricity consumption. Experts explain how cooling technologies affect resource usage, while companies explore recycling, efficient cooling systems and lower-heat chips.
CNBC
Sponsor
SCHUNK
Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK
What Makes a Quantum Company Valuable?
Quantum startups must align technology roadmaps with customer needs and commercial timelines to build sustainable businesses. Healthcare sensing offers early opportunities, but companies must prove measurable benefits and overcome adoption hurdles.
EE Times
Flux-Free, Reliable, Efficient: Soldering with Formic Acid
Whitepaper shows formic-acid-assisted, flux-free soldering enables reliable, nearly void-free joints for power semiconductors. The technology improves thermal performance and lifespan, offering strong potential for electromobility, renewable energy, and high-frequency electronics.
Technical Paper
Higher Energy Costs Will Push Telecom Operators to Raise Prices, Lifting Global Services Revenue to $1.585 Trillion in 2026, According to IDC
IDC forecasts global telecom and pay TV spending will rise 2.3% to $1.585 trillion in 2026, driven largely by inflation-driven price increases. Mobile data, fixed broadband and satellite connectivity will support growth.
IDC
Sponsor
Nordson Electronics Solutions
ASYMTEK Select Coat SL-1040
The SL-1040 Conformal Coating System upgrades the SL-940 and added significant system-level advancements to elevate automation, control, precision & preventative maintenance for better yield.
Nordson Electronics Solutions
The 4 Most Powerful Foldable Phones You Can Buy Right Now
Apple's iPhone Duo, Samsung's Galaxy Z Fold 8 Ultra, and Google's Pixel 11 Pro Fold lead 2026's foldable market. Each delivers strong real-world performance, multitasking, and cameras, while differing in battery life, durability, cooling, and pricing.
BGR
What Causes Exploding Solder Joints?
We have seen joint voids that look like "explosions" after wave soldering. Is this due to moisture absorption? Can these be salvaged? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question and provide their insight.
Board Talk
Technical Papers

■ 5 Major Challenges in Image Sensor Packaging and How to Solve Them
■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible
■ Oxide Reduction for Reliable Electronics Manufacturing
■ UHDI Fabrication for IC Substrates: SAP and mSAP Processes
■ Flux-Free, Reliable, Efficient: Soldering with Formic Acid
■ Redesigning Material Logistics for High-Mix EMS Production
■ Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education
■ Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
MORE TECHNICAL PAPERS
Sponsor
Uyemura
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Tech Giants Are Putting Billions Behind a Decades-Old Engineering Model. Here's Why It Matters More Now.
Forward Deployed Engineers bridge business needs and AI technology, transforming AI-generated prototypes into secure, scalable enterprise solutions. They integrate data, workflows and systems while accelerating development and delivering measurable business outcomes.
Entrepreneur
Bluetooth's new HDT technology delivers nearly four times the data transfer speed
The Bluetooth SIG introduced HDT in Bluetooth 7.0, boosting data transfer speeds to 7.5 Mbps while improving energy efficiency, capacity and reliability. The technology could enhance wireless audio, AI devices and wearables, with products expected from 2027.
TechSpot
The Quest for Reliability Standards
Many methods simulate end-use characteristics of equipment, but a clear understanding is required to differentiate between the methods.
Technical Paper
Sponsor
Viscom SE
iX7059 SMT Edition: Next-Gen 3D X-ray
Experience high-precision inline 3D X-ray inspection by Viscom with AI-powered defect detection, exceptional image quality, and reliable performance for complex SMT assemblies.
Viscom SE
Global AI server shipments expected to jump 36%
Global AI server shipments are projected to rise 36% to 3.83 million units next year, driven by major cloud providers' infrastructure investments. Their capital spending will surge 60%, while Nvidia maintains dominance amid growing AMD competition.
Taipei Times
Democrat control of Congress presents opportunity and challenge for China
Democrats' midterm victory and control of Congress could reshape US policy toward Taiwan, potentially pressuring Trump to resume arms sales. However, China may exploit political divisions in Washington to increase pressure on Taipei or adopt greater caution.
Taipei Times
Effect of Process Changes and Flux on Mid-Chip Solder Balling
Paper documents experimental work performed to understand the impact on mid-chip solder balling from the manufacturing process and flux chemistry.
Technical Paper
Sponsor
Glenbrook Technologies
Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
Glenbrook Technologies
Nvidia, Municipal Leaders Frame AI as Critical Urban Infrastructure
Nvidia and city leaders are promoting AI factories as essential civic infrastructure, helping municipalities analyze urban data, improve public services, protect sensitive information, streamline operations, and attract technical talent through locally controlled AI systems.
EE Times
Google's Message to Schools K-12: If You Ban AI, You'll Lose Access to Google Search
Google will disable AI tools for K-12 students by default unless schools opt in next year. However, schools blocking AI will also lose Google Search, intensifying concerns as districts increasingly restrict student access to generative AI.
Entrepreneur
Sponsor
KYZEN
Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN
Why a Mathematician Is Chasing Eclipses With Algorithms and Cameras
Researchers led by solar eclipse expert Miloslav Druckmüller use advanced telescopes and imaging techniques during total solar eclipses to study the sun's corona, tracking superhot iron ions and investigating heat distribution within this mysterious atmospheric region.
IEEE Spectrum
Side Wall Wetting Induced Void Formation
In this study the authors examine the mechanism of void formation in the processing of microbumps.
Technical Paper
Gartner Says Access to Energy Is Becoming a Major Constraint on Supply Chain Growth
Gartner warns that energy shortages and grid constraints could increase manufacturers’ operating costs by 20% to 30% by 2029. It urges supply chain leaders to integrate energy availability into network design, expansion planning and resilience strategies.
Gartner
OpenAI president says AI could make death a choice, predicts major medical breakthroughs within 18 months
OpenAI President Greg Brockman predicts AI will deliver major medical breakthroughs and disease cures within 12 to 18 months. He believes future advances in biology and healthcare could even make death optional, although such longevity promises remain speculative.
TechSpot
Sponsor
Advanced Interconnections Corp
Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
Democrats Win Texas in U.S. Midterms, Putting Focus on Foxconn, Wistron, Wiwynn’s AI Server Expansion
Texas election gains raise concerns over tighter data center regulations that could delay AI infrastructure projects. However, Taiwanese manufacturers, including Foxconn, Wistron and Wiwynn, continue U.S. expansion with investments exceeding $7 billion.
Trend Force
Today's Sponsor
Sponsor
Sponsor
DL Technology
EZ-FLO High Precision Ceramic Dispense Tips
The ceramic molding process allows for smaller more precise inner diameters with a glass-like finish, giving you the ultimate control. Learn more.
DL Technology
Test Your Knowledge
What does an acrophobic fear?
See answer below.
Industry Press
Seika Machinery to Highlight Advanced Process Control and PCB Cleaning Solutions at SMTA Silicon Valley Expo
Seika Machinery, Inc. is pleased to announce its participation in the SMTA Silicon Valley Expo & Tech Forum, scheduled for Thursday, December 3, 2026, at the Fremont ...
Seika Machinery, Inc.
ViTrox's V810Ai QX1 Named Global Technology Award Winner for Smart AXI Inspection
ViTrox is excited to announce that its ViTrox Smart 3D AXI System – V810Ai QX1 received a 2026 Global Technology Award in the Inspection Equipment – AXI/X-ray ...
ViTrox Technologies Sdn Bhd
DISTRON Corporation Wins Global Technology Award for Contract Manufacturing Excellence
DISTRON Corporation has received a 2026 Global Technology Award in the Contract Manufacturers $15–50 Million category. The award was presented during ...
Distron Corporation
Greenliant Focuses on Long-Term SSD Availability at electronica 2026
Greenliant will showcase its broad portfolio of solid state drives (SSDs) for applications requiring high endurance, longevity and high reliability at electronica 2026, ...
Greenliant
Green Circuits Appoints David Kim as Vice President of Quality
Green Circuits has appointed David Kim as Vice President of Quality. Bringing more than 30 years of experience in quality management, manufacturing engineering, ...
Green Circuits
Littelfuse Introduces IXD704 Dual-Channel 4 A Low-Side MOSFET Gate Drivers
Littelfuse, Inc. announced the IXD704, a family of non-isolated, dual-channel, 4 A, low-side MOSFET and IGBT gate drivers with inverting or non-inverting outputs. ...
Littelfuse, Inc.
CE3S Sponsors SMTA Pennsylvania Alliance Group Networking and Technical Event
CE3S is pleased to be a sponsor for the upcoming SMTA Pennsylvania Alliance Group Networking and Technical Presentation, Factory Analytics on the Floor: How ...
Cumberland Electronics Strategic Supply Solutions (CE3S)
MORE INDUSTRY PRESS
Protecto - Create Your Connections
Sponsor
Indium Corporation
Stop paying for silver you don't need!
Stop paying for silver you don't need! Visit indium.com to learn how Indium Corporation's low-silver alloys paired with award-winning flux deliver the performance you need.
Indium Corporation
Quote of the Day
No one is listening until you make a mistake.
Anonymous
Sponsor
Master Bond
Toughened, Non-Drip Epoxy
Master Bond Supreme 121AOND is a toughened, heat curing adhesive for bonding and sealing applications that offers chemical resistance and a high glass transition temperature.
Master Bond
Is Thermocouple Connection the Problem?
Cartoon of the Day
Cartoon
"I'm on the Pasta Diet. I walk pasta donut shop without stopping, I walk pasta pizza place without stopping..."
Copyright © Randy Glasbergen
Sponsor
Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Get Mastery Over PCB Repair and Soldering
Test Your Knowledge Answer
What does an acrophobic fear?
Answer: Heights