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Ask the Experts
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Recommended Solder Paste Aperture Configuration
What aperture shape/configuration do you recommend with our solder paste stencils for 008004 and 01005 pad sizes?
Responses by:
Georgian Simion Engineering and Operations Management, Independent Consultant Edithel Marietti Senior Manufacturing Engineer, Northrop Grumman Kay Parker Technical Support Engineer, Indium Corporation Bill Coleman Vice President Technology, Photo Stencil Tim O'Neill Director of Product Management, AIM
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MORE ASK THE EXPERTS
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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What Year Was It?
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Machu Picchu Discovered
American archeologist Hiram Bingham gets his first look at Machu Picchu, an ancient Inca settlement in Peru that is now one of the world's top tourist destinations.
See the answer below.
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Circuitnet Advertising Delivers Results!
Introduce your technology, new products or services in our daily e-mail newsletter & website to see how a digital advertising campaign can deliver results. Reach over 200,000 professionals.
Circuitnet LLC
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What Year Was It Answer
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Machu Picchu Discovered Answer: July 24, 1911
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July 24, 2026
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India's Moment Is Different This Time. Here's Why.
India’s electronics sector moves from promise to proof as $142B output, component programs, stronger supply chains, IPC-certified talent, and regional clusters fuel global manufacturing growth, though gaps remain in materials and infrastructure.
Global Electronics Association
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Reimagined EOS/ESD Symposium 2026
Experience the enhanced EOS/ESD Symposium with expanded learning, collaboration, and industry connections. Join experts exploring challenges and solutions in EOS/ESD control. September 28-30.
EOS/ESD Association
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U.S. Starts Genesis Mission with $5B for First Projects
The U.S. launched its $5 billion Genesis Mission to accelerate AI-driven scientific research across energy, quantum computing, and national security. Analysts welcomed the initiative but argued it lags China's far larger AI investment and growing strength in cost-efficient, physical AI.
EE Times
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Technical Paper
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The Story Behind Fuse EDA AI system
Siemens EDA's Fuse EDA AI system accelerates chip design by automating setup, debugging, and simulation across EDA workflows. It boosts productivity, cuts repetitive tasks, and delivers a flexible, trusted AI platform that extends to users' tools and data.
EE Times
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Need Improved Solder Joint Visibility?
Solder Peel-A-Way Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
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PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
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Power use rises amid AI activity, keeps index 'red'
Taiwan's industrial electricity use rose for a 15th month as AI demand boosted growth. Semiconductor, AI server and electronics firms increased power needs, offsetting traditional sector weakness, while renewable energy purchases cut Taipower sales.
Taipei Times
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Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD
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EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
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Apple's first foldable iPhone faces production hurdles
Apple is advancing its long-rumored foldable iPhone toward a potential September 2026 launch alongside the iPhone 18 series. Supply-chain reports indicate Foxconn has entered final testing, signaling Apple is nearing production and preparing to expand its premium smartphone lineup.
Digitimes
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Wistron executives say AI demand is still far from a bubble
Wistron executives say AI remains a powerful growth driver despite investor concerns. They cite strong enterprise demand, expanding real-world applications, and ongoing supply constraints as key factors sustaining momentum across the AI hardware and infrastructure market.
Digitimes
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| Today's Sponsor |
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How to Simplify Solder Paste Printing
StikNPeel removable rework stencils simplifies selective printing of solder paste leaving no residue providing cleaner alternative to metal stencils.
BEST Inc.
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Test Your Knowledge
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Which country shares the most borders with other countries: Brazil, Austria, India
See answer below.
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Industry Press
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The Commitment Behind Creative Electron's Three-Year Warranty
Creative Electron, Inc. offers an industry-leading three-year warranty across its equipment portfolio. But the real value of that warranty extends far beyond the number ...
Creative Electron, Inc.
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MW Associates Promotes Mickie Bourns, Strengthening Digital Marketing
MW Associates is pleased to announce the promotion of Mickie Bourns to Digital Marketing & Communications Manager. Since joining MW Associates in March 2019, ...
MW Associates
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Kurtz Ersa Partners with E-tronix for Sales in Illinois and Wisconsin
Kurtz Ersa Inc. has entered into a new representative agreement with E-tronix to support customers in Illinois and Wisconsin. Under the agreement, E-tronix will provide ...
Kurtz Ersa
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KIC's David Meza to Present SMTA Guadalajara Chapter Webinar
KIC announced that David Meza, Senior Service Engineer, will present a live educational webinar hosted by the SMTA Guadalajara Chapter titled "Thermocouples ...
KIC
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IBL Löttechnik presents intelligent process control at EFX 2026
IBL Löttechnik GmbH's Advanced Process Control (APC) and Automatic Gradient Control ensure greater process reliability, reproducible soldering profiles, and reduced setup ...
IBL Löttechnik GmbH
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Siemens to acquire Defacto Technologies to complement its EDA portfolio
Siemens announced that it has entered into an agreement to acquire Defacto Technologies, a privately held EDA software company active in the register-transfer ...
Siemens
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Koh Young America Promotes Ramiro Mora to Lead Service and Applications
Koh Young Technology is pleased to announce the promotion of Ramiro Mora to Service and Applications Manager for Mexico and South America. The promotion recognizes ...
Koh Young Technology
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MORE INDUSTRY PRESS
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Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect
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Quote of the Day
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"The secret of success is sincerity. Once you can fake that you've got it made." Jean Giraudoux
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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| Cartoon of the Day
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"Always criticize the other guy before he has a chance to criticize you. That's called 'constructive criticism'."
Copyright © Randy Glasbergen
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3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch
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Test Your Knowledge Answer
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Which country shares the most borders with other countries: Brazil, Austria, India Answer: Brazil (bordered by 10 countries), Austria (8), India (7)
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