Oct 9, 2026 PC Market Woes Continue: Shipments Fall 20.1% in Q3 2026 Worldwide PC shipments plunged 20.1% year over year to 62.7 million units in Q3 2026 as early inventory buildup, supply constraints and rising prices weakened demand. Lenovo, HP and Dell lost market share as economic risks darkened the outlook. IDC

Sponsor PCB Rework Evolves, With X-ray a Constant Support Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years. Glenbrook Technologies

Global Electronics Association Releases IPC-1783-CO2E Standard for Product Carbon Footprint Data The Global Electronics Association released IPC-1783-CO2E to standardize emissions data collection and reporting across electronics supply chains, improving carbon footprint comparability, data quality and manufacturers’ ability to meet sustainability requirements. Global Electronics Association

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses Intentional contamination of PWBs offers a practical and controlled approach for evaluating cleanliness analysis techniques and for developing meaningful and effective cleanliness guidelines. Technical Paper

Why Custom Silicon Matters in AI Data Centers Custom silicon helps data centers optimize AI, analytics, networking and storage workloads. Purpose-built processors boost performance per watt, cut latency, data movement and operating costs, and improve hardware-software integration while complementing general-purpose CPUs. EE Times

Sponsor Automation in Transition The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts. SCHUNK

Being mean to AI could get you banned as Anthropic introduces new rules against abusing Claude Anthropic will prohibit sustained, needless abuse of its Claude AI models under a revised policy effective Nov. 12. The update also strengthens safeguards against deceptive campaigns, harmful hardware use, surveillance and unsafe decisions in health and finance. TechSpot

What Are the Benefits and Drawbacks of OSP Finish? What are the advantages of using an OSP surface finish? What precautions should be taken when using circuit boards supplied with OSP finish? Board Talk

Technical Papers ■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible ■ Oxide Reduction for Reliable Electronics Manufacturing ■ UHDI Fabrication for IC Substrates: SAP and mSAP Processes ■ Flux-Free, Reliable, Efficient: Soldering with Formic Acid ■ Redesigning Material Logistics for High-Mix EMS Production ■ Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education ■ Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You ■ Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse MORE TECHNICAL PAPERS

Sponsor AI Void Detection - X-Ray Inspection X-ray Inspection for hidden and buried solder joints. BGA, QFN, THT, and more. High Speed and High Resolution configurations available. Test Research, Inc.

Autonomous vehicles can still see lanes through tampered sensors—but in the wrong place TUM researchers found that thin films on cameras and LiDAR sensors can distort vehicle perceptions, triggering dangerous driving errors. Their research explores vulnerabilities and develops defences to help autonomous vehicles detect attacks and respond safely. TechXplore

James Webb Space Telescope helps detect the most distant Fast Radio Burst ever seen — and scientists are surprised by its source Astronomers discovered the most distant fast radio burst, FRB 20240304B, using MeerKAT and the James Webb Space Telescope. Located 11 billion light-years away, it offers valuable insights into cosmic evolution, galaxy formation & the environments producing these mysterious signals. Space

SERDP Tin Whisker Testing and Modeling The paper discusses testing and modeling program that aims to assess and quantify tin whisker growth on lead-free manufactured assemblies. Technical Paper

Sponsor Reflow Solderable TIM1 Thermal Grease AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering. AI Technology, Inc.

Samsung profit rises on chip windfall Samsung Electronics reported a nearly nine-fold quarterly operating profit increase to 107.4 trillion won, driven by surging AI infrastructure demand for memory chips. Results missed expectations as investors remained cautious about the semiconductor industry's cyclical risks. Taipei Times

Rising Costs, Compute Demand Push ADAS Toward Modular AI Automakers are delaying autonomous driving ambitions as rising chip, memory and development costs slow deployment. Industry leaders favor agentic AI with specialized driving agents to cut computing needs and training data, while prioritizing supervised Level 2+ systems. EE Times

Control of the Underfill of Surface Mount Assemblies Paper addresses the control of surface mount under fill assemblies, focusing on inspection techniques and possible options to overcome their limitations. Technical Paper

Sponsor From Slave to Master: flexible ISM integrations ESSEGI AUTOMATION's ISM software integrates with 250+ brands, connecting ERP, MES, WMS, Pick & Place and X-Ray systems. Flexible logic allows it to operate as master or slave in any production flow. Essegi Automation

Breaking the AI Infrastructure Power Wall: From Grid to xPU AI infrastructure faces a power wall as demand surges. Navitas targets high-growth markets with GaN, SiC and Claros IVR technologies, enabling efficient processor-level power delivery, faster response, reduced energy losses and higher power density for next-gen systems. EE Times

This Disembodied Hand Is All the Robot You Need ETH Zurich researchers transformed a commercial robotic hand into an autonomous, fingertip-walking robot that navigates varied surfaces and manipulates objects. The innovation could improve industrial maintenance, search-and-rescue operations, and access to confined spaces. IEEE Spectrum

Sponsor Need Improved Solder Joint Visibility? Solder Peel-A-Way® Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action. Advanced Interconnections Corp.

Why smarter factories can create greater operational risks Smart manufacturing increases efficiency but also creates interconnected risks. Manufacturers must improve visibility across IT, operational technology, cloud services, connectivity and suppliers to identify dependencies, minimise disruption and strengthen production resilience. New Electronics

Leadless Flip Chip PLGA for Networking Applications Initially motivated by the demand for smaller, more efficient and feature rich mobile electronics, this trend has expanded across numerous applications. Technical Paper

Gartner Says Global Quantum Computing Revenue Will Reach Over $1 Billion in 2027 Gartner projects quantum computing revenue will reach $1.1 billion in 2027, driven by technological advances and early business applications. However, market overcrowding could force over 50% of startups out by 2030, accelerating industry consolidation. Gartner

Want to Be More Likable? Just Say These 5 Magic Phrases. Entrepreneurs who struggle with conversation may find networking and collaboration challenging. Strong conversational skills help build meaningful relationships, strengthen business connections, and encourage people to buy from, work with, and collaborate with others. Entrepreneur

Sponsor Training for Certified IPC Specialists BEST's 7711 Training Rework Kit is designed for certification/re-certification of Certified IPC Specialists (CIS) so employees can be tested for speed, accuracy and quality. BEST Inc

A smart coffee maker uploaded 1TB of data in 10 days, and nobody knows why A Keurig smart coffee maker uploaded over one terabyte of data in 10 days, highlighting IoT security risks. The incident underscores how connected appliances can cause network congestion, expose personal information, and create cybersecurity vulnerabilities. TechSpot