circuitnet
Sponsor
AI-Technology-Inc

TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology, Inc.
Ask the Experts
Cleanliness Testing
What are the latest techniques/methods for testing the cleanliness of an assembled PCB after going through our in-house cleaning process?
Responses by:
David Bonito
Sales & Marketing Manager, Technical Manufacturing Corp.
Umut Tosun
Application Technology Manager, Zestron America
Jerry Karp
President, JSK Associates
Terry Munson
President/Senior Technical Consultant, Foresite
Steve Stach
President, Austin American Technology
Walter Pierowski
Process Engineer, Esterline Interface Technologies
Tim O'Neill
Director of Product Management, AIM
Mark McMeen
VP Engineering Services, STI Electronics Inc.
Hand Sanitizer Contamination
Epoxy Wicking up Wire Insulation
Out-gassing and Cleaning
Contamination From Anti-static Foam
Organic Flux Residue Concerns
Lifted Lead on SOT Component
Ultrasonic Cleaning and Surfactants
MORE ASK THE EXPERTS
Essegi-Automation
Sponsor
Nordson-ASYMTEK

Trailblazing Process News for Conformal Coating
Say goodbye to clogged nozzles and hello to flawless conformal coating with the ASYMTEK Select Coat SL-1040 Ultrasonic Cleaning Station.
Nordson Electronics Solutions
Industry Calendar
Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA
Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMTA
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
Oct 1, 2026
Long Island Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Air-Vac-Engineering
Sponsor
Indium-Corporation

High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability and reduces energy use up to 15%.
Indium Corporation
What Year Was It?
Castro Announces Mariel Boatlift
What Year
The Castro regime announces that all Cubans wishing to emigrate to the U.S. are free to board boats at the port of Mariel west of Havana, launching the Mariel Boatlift.
See the answer below.
Sponsor
Plasmatreat-GmbH

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
kyzen
What Year Was It Answer
Castro Announces Mariel Boatlift
Answer: April 20, 1980
April 21, 2026
Chipmakers on track to meet only 60% of AI memory demand by 2027
Big Tech and hyperscalers aggressively buy memory chips for AI, intensifying a structural shortage. Analysts expect supply will lag demand until at least 2027–2030 as manufacturers expand capacity, prioritise high-bandwidth memory, and leave consumer chip performance increasingly constrained.
TechSpot
Sponsor
Alltemated

Future-Ready Bonding Technology
ZTACH® ACE Anisotropic Conductive Epoxy – Cures under reflow or UV and can be a replacement for solder, ACF, ACA, and wire bonding. No underfilling required. Find out more.
Action Integrated Resources
Apple announces historic leadership transition: John Ternus to become CEO, Tim Cook to assume executive chairman role
Apple announced a major leadership transition effective September 1, 2026, naming John Ternus as CEO after Tim Cook’s 15-year tenure. Cook will move to executive chairman as Apple reshapes its executive structure and succession planning.
Digitimes
Optimizing BGA Rework: Challenges, Techniques and Quality Control
The complexity of BGA packages introduces challenges during rework requiring innovative methods and inspection practices to ensure performance and reliability. This paper outlines best practices for removing and replacing BGAs.
Technical Paper
Computing power behind driverless cars could cancel out the advantages
Autonomous vehicles may cut tailpipe emissions through efficient driving and reduced traffic, but CR Legal Team research warns their heavy AI computing could offset gains. Rising data centre energy demand suggests net environmental benefits depend on rapid infrastructure decarbonisation and efficiency improvements.
Digital Journal
Sponsor
ECD

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
Apple CEO Tim Cook Is Stepping Down - Here's Who Is Taking His Place
Apple CEO Tim Cook will step down after nearly 15 years and become executive chairman on September 1, 2026. Hardware chief John Ternus will succeed him, while Apple promotes Johny Srouji to chief hardware officer amid broader leadership reshuffle.
BGR
Cu Conductive Paste as Via Filling Materials for Various Substrates
In this study, we developed a Cu paste that can be used as a filling material for through silicon via (TSV), through glass via (TGV), and organic substrates.
Technical Paper
Technical Papers
Scaling SMT Traceability
The Drawbacks of Internal Recycling Systems for Solder Dross
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible
PCB Rework Evolves, With X-ray a Constant Support
How pH Cleaning Agents Affect Production Performance
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin
Understanding Solder Dross: Causes and Control Strategies
MORE TECHNICAL PAPERS
Sponsor
Schunk

Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK
Apple taps John Ternus as CEO to replace Tim Cook, who will become chairman
Apple appoints hardware chief John Ternus as CEO, replacing Tim Cook on Sept. 1. Cook shifts to executive chairman while overseeing a smooth transition. Ternus joins the board and inherits leadership amid AI competition and operational challenges.
CNBC
Why I Take a ‘Roll up Your Sleeves’ Approach to Leadership – And How it’s Paying Off
A CEO traveled to work closely with teammates to streamline priorities and projects. He emphasized that such collaboration reflects his leadership style, focused on coaching and guidance rather than control, empowering employees to manage workloads effectively.
Entrepreneur
The Effect of Sb and Ag Addition on the Behavior of Sn-Bi LTS
This study focuses on the changes in melting and solidification behavior of near-eutectic Sn-Bi alloys with Sb (0.5-2wt%) and Ag (0-1wt%) additions.
Technical Paper
Sponsor
Glenbrook-Technologies

Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
Glenbrook Technologies
Resilience must be multilateral
Washington and Tokyo expand Indo-Pacific cooperation through a US$50 billion initiative as rising China pressure and alliance volatility expose limits of bilateralism. They push multilateral frameworks to improve coordination, strengthen deterrence, and reduce miscalculation risks, especially for Taiwan.
Taipei Times
Man and machine
Hannover Messe 2026 in Hanover, Germany, showcases humanoid robots from Agile Robots as Brazil leads as partner country promoting sustainable industrial transformation and renewable energy, attracting around 4,000 exhibitors and over 123,000 visitors from 150 countries.
Taipei Times
Opens With Assembled QFN Components
We are experiencing opens on assembled QFN components at a rate of 9%. The failure only appears in rows near the component center. What is happening?
Board Talk
Sponsor
Viscom

Latest 3D AOI System from Viscom
iS6059 PCB Inspection Plus. Its new and faster sensor technology, data processing and analysis functions all stand for the best 3D AOI performance that meets the highest requirements.
Viscom
Japan companies hit by aluminum shortage
Disrupted Middle East shipping routes amid the Iran conflict are squeezing Japan’s aluminum supply, forcing automakers to cut output and seek alternatives. Prices have surged, inventories are shrinking, and prolonged shortages threaten production halts and wider global supply chain instability.
Taipei Times
EDA AI Agents: Intelligent Automation in Semiconductor & PCB Design
Semiconductor design is advancing on two fronts: faster engines and smarter engineers. AI-powered EDA tools boost simulation speed, while Siemens introduces Fuse EDA AI to unify workflows, automate decisions, and enhance productivity across the entire chip and PCB design lifecycle.
EE Times
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
Why AI Is Redefining the Future of Commercial Power Infrastructure
Artificial intelligence is reshaping commercial power infrastructure, pushing systems beyond their original limits. Companies now redesign distribution with modularity, real-time monitoring, and energy storage to handle fluctuating demand, improve efficiency, manage heat, and ensure reliability in high-intensity AI environments.
EE Times
Miniaturization of Hearing Aid Electronics Using Embedded Die Packaging
This paper examines the use of second generation embedded die packaging to drive further size reduction in custom hearing instruments.
Technical Paper
NASA shuts off another Voyager science instrument to save power. The spacecraft is now 15 billion miles from Earth
NASA has powered down Voyager 1’s Low-energy Charged Particles instrument to conserve dwindling energy, extending the spacecraft’s deep-space mission. Engineers aim to keep the 1977 probe transmitting rare interstellar data as it continues exploring beyond the Solar System.
Sky At Night Magazine
Inside the strategy of Anthropic's CFO as AI spending surges
Anthropic accelerates growth as CFO Krishna Rao drives massive fundraising and infrastructure expansion. Backed by Google and Nvidia, the firm invests heavily in compute capacity to meet soaring demand for its Claude AI models.
Digitimes
Sponsor
Manncorp

Outsourcing Costs More Than You Think
Delays, tariffs, and uncertainty come with overseas PCB assembly. In-house production with Manncorp delivers faster builds, tighter control, and long-term stability.
Manncorp Inc.
China’s Hesai adds colour to lidar as EV makers race to level up in self-driving tech
Hesai Group unveiled a 6D full-colour lidar platform that detects colour to boost object recognition in autonomous driving. Its upcoming ETX sensors promise improved accuracy and spatial intelligence, as the company scales production amid rising demand for self-driving vehicle technology.
South China Morning Post
Today's Sponsor
Viscom-SE
Sponsor
Viscom-SE

iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
Test Your Knowledge
During its earliest days in development, Windows was known by what name?
See answer below.
Industry Press
KYZEN Announces Exclusive Partnership with Manufacturers' Rep Restronics
KYZEN proudly announces its strategic partnership with Manufacturers’ Representative REStronics Southern California. As an extension of KYZEN's commitment ...
KYZEN
EPTAC Opens New Corporate Headquarters and Training Facility in Salem, NH
EPTAC will celebrate the relocation and expansion of its corporate headquarters and training facility at 7 Stiles Road, Suite 300, Salem, NH, on Thursday, April 23, 2026, ...
EPTAC
SMTA Announces Technical Program for 2026 High Reliability
The SMTA announced the finalized program for the High Reliability: Strategic Technology Advancement Research Forum which takes place on May 6-7, 2026 in Olathe, Kansas, ...
SMTA
Special flux for nitinol & nickel in high-performance military applications
Miniaturization, robustness, adaptive functions, and maximum reliability are crucial factors in the performance of defense and aerospace technologies today. ...
Emil Otto GmbH
RBB Systems Honors David Hill for 45 Years of Service and Contribution
RBB is proud to recognize David Hill, Document Specialist and Materials Specialist, for his 45-year service anniversary. David began his journey with RBB in February ...
RBB Systems
FlashPCB Welcomes Adam Broeckert, EIT as Manufacturing Engineer
FlashPCB is pleased to announce the addition of Adam Broeckert, EIT, as Manufacturing Engineer. In this role, Broeckert will support FlashPCB's production operations, ...
FlashPCB
MORE INDUSTRY PRESS
Summit-Interconnect
Sponsor
Intraratio-Corporation

See How Proven Leaders Make Operational Success Happen
4-part series addressing head-on the challenges faced by manufacturing operations in today's highly complex and hyper-competitive environment. No registration required.
Intraratio
Quote of the Day
Problems are only opportunities in work clothes.
Henry Kaiser
Sponsor
Circuit-Technology-Center

See How Expert Circuit Board Repair Solved a Critical Failure
Discover how a complex electronic failure was diagnosed and repaired with precision in this real-world case study.
Circuit Technology Center
Smart-Sonic
Cartoon of the Day
Cartoon
"How come you never bring me any of your stupid ideas anymore?"
Copyright © Randy Glasbergen
Sponsor
Master-Bond

Silver Filled Electrically Conductive Epoxy
Master Bond EP3HTSDA-2Med is a silver filled adhesive system with high electrical and thermal conductivity that passes ISO 10993-5 for cytotoxicity.
Master Bond
SEIKA-America
Test Your Knowledge Answer
During its earliest days in development, Windows was known by what name?
Answer: "Interface Manager," which was First developed in 1981 by computer scientist Chase Bishop who named the software project. Marketers at Microsoft later decided that the name "Windows" was more consumer-friendly.