Oct 6, 2026 India's Semiconductor 2.0: Building a Global Semiconductor Ecosystem India's Semicon 2.0 commits Rs. 1.275 trillion to build a full semiconductor ecosystem spanning chip design, fabs, packaging, materials, R&D and talent. The program aims to expand India's global supply-chain role and attract long-term investment. Global Electronics Association

Sponsor What are your economic depaneling needs? Our depaneling machines are high-performance machines for single circuit boards with electronic components. The cutting principles are fast, the best quality. SCHUNK

Electric Car Makers Need to Appeal to the 'Other 90%' Declining U.S. EV sales highlight a need for innovation, not reliance on tax credits. Automakers must deliver cheaper batteries, faster charging and better infrastructure to attract the 90% of buyers who still reject electric cars today. EE Times

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics Electrostatic discharge (ESD) threatens IoT and high-reliability electronics as components shrink and densify. This paper details design protections, assembly controls, and validation methods to help engineers and OEMs enhance device resilience and ensure long-term performance. Technical Paper

Hon Hai monthly revenue surpasses NT$1 trillion Hon Hai reported record revenue of NT$1.16 trillion in September, up 38.42% year-on-year, driven by strong AI server, cloud, networking and computing demand. Third-quarter revenue reached NT$3.27 trillion, beating forecasts as AI-related orders accelerated. Taipei Times

Sponsor Large Component SMT Rework & Repair A Rework System developed to address the increasing size, complexity, and thermal demands of Advanced Electronic Assemblies. Air-Vac Engineering

Qualcomm signs its first 5G patent deal with Huawei, and agrees to buy some of its US patents Huawei and Qualcomm signed a multiyear patent cross-license covering 5G, computing, AI and networking, while Qualcomm agreed to buy Huawei's US patents. The deal expands Huawei's licensing business but awaits regulatory approval and leaves financial terms undisclosed. TechSpot

Solder Defects and Continuous Improvement We get a lot of questions about solder defects. Is that telling us something about what's going on in the industry? Are you settling for mediocrity? The Assembly Brothers, Phil Zarrow and Jim Hall, answer these questions. Board Talk

Technical Papers ■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible ■ Oxide Reduction for Reliable Electronics Manufacturing ■ UHDI Fabrication for IC Substrates: SAP and mSAP Processes ■ Flux-Free, Reliable, Efficient: Soldering with Formic Acid ■ Redesigning Material Logistics for High-Mix EMS Production ■ Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education ■ Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You ■ Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse MORE TECHNICAL PAPERS

Sponsor Die-Module Attach (Pastes & Films) Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding. AI Technology, Inc.

6 Guidelines for Governing AI AI transformation increasingly requires leaders to govern autonomous systems, not just build them. As enterprise adoption expands, success depends on setting clear intent, boundaries and accountability, helping organizations convert AI investments into measurable business value. IEEE Spectrum

Trusted AI: Why Intelligence Alone Isn't Enough Siemens EDA's Juan Rey says trusted AI for semiconductor engineering must blend AI intelligence, domain expertise and deterministic verification. Engineers remain accountable as AI accelerates workflows, solves problems and boosts productivity. EE Times

Effect of Bi Content on Properties of Low Silver SAC Solders A systematic study is presented to address the effect of Bi content on soldering and mechanical performance of low silver SAC alloys. Technical Paper

Sponsor SEHO makes production lines smarter Improve your work flow and reduce manufacturing costs with creative ideas and innovative solutions for automation, board handling and material management. SEHO Systems GmbH

The Web is not ready for millions of rule-bending bots AI agents are increasingly acting independently online, but their tendency to exploit loopholes and make mistakes raises serious risks. Experts warn that millions of competing agents could overwhelm poorly secured websites, cybersecurity threats and costly errors. Taipei Times

What happens when Chinese AI goes rogue? US and Chinese AI developers face rising safety risks as autonomous agents gain capabilities. Recent incidents expose containment failures and potential existential threats, driving calls for safeguards, cooperation and preventive regulation. Taipei Times

The EMS Gateway Model - Local to Global, Seamlessly This case study highlights the value of the Gateway Model and that shows some of the key elements that allow for seamless transitions from plant to plant. Technical Paper

Sponsor The "Fried Egg" Effect in Soldering Burnt-on flux residue that is visible on the solder mask of PCBs after improper reflow settings produces significant challenges to the reliability of finished boards. KYZEN

AI and establishment distrust Public backlash is increasingly delaying US data-center projects as communities fear higher utility bills, environmental damage and quality-of-life impacts. The trend is spreading across Asia-Pacific, highlighting concerns over AI expansion, governance and power-grid resilience. Taipei Times

Cyber official plans AI testing Taiwan's National Institute of Cybersecurity will deploy agentic AI next year to simulate hackers, conduct black-box penetration tests, scan software, analyze global threats and strengthen defenses, while helping government & businesses establish faster vulnerability response systems. Taipei Times

Sponsor Plasma Etch PE-Avenger The PE-Avenger is an ultra low-cost entry level plasma cleaning system allowing more labs to utilize plasma. It's a low frequency plasma cleaner designed for surface activation and organics removal. Plasma Etch

Satya Nadella reinvented Microsoft once. Can he do it again in the AI era? Satya Nadella is reshaping Microsoft's AI strategy around enterprise adoption, consumption-based pricing and agentic software. Its strong cloud business offers an edge, but OpenAI, Anthropic, Google and Nvidia intensify the race for AI leadership. CNBC

Impractical Stencil Aperture Designs to Enable M0201 Assembly Implementation of metric 0201 or M0201 size surface mount passives will help enable the next generation form factor electronic packaging. Technical Paper

There's A Big Problem With Building Data Centers Underground Underground data centers could reduce noise, land use, water consumption, and cooling costs, but high construction expenses, ventilation challenges, limited scalability, and power connectivity hinder adoption. Existing mines offer promising alternatives, though suitable sites remain scarce. BGR

Smart Car Researcher Wants to Eliminate Stoplights Christos Cassandras pioneered cyber-physical systems and intelligent transportation, using mathematical models to prove autonomous vehicle safety. His latest work coordinates vehicles to eliminate traffic lights, improve flow, safety, and energy use. IEEE Spectrum

Sponsor AI Void Detection - X-Ray Inspection X-ray Inspection for hidden and buried solder joints. BGA, QFN, THT, and more. High Speed and High Resolution configurations available. Test Research, Inc.

When Switching To An EV Is (And Isn't) Worth It EV buyers should weigh charging access, driving range, housing, upfront costs, and depreciation before switching from ICE vehicles. While EVs offer lower fuel and maintenance expenses, hybrids and plug-in hybrids may better suit drivers facing infrastructure or budget limitations. BGR