Oct 13, 2026 PC Shipments Declined 22% in Q3 As Component Cost Inflation Raised ASPs Global PC shipments plunged 22.4% to 55.4 million units in Q3 2026 as soaring memory and storage costs drove prices higher. Vendors prioritized premium configurations, while Apple gained market share despite widespread shipment declines across leading manufacturers. Gartner

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Elon Musk Admits He Has 'No Idea How to Make Microchips.' He's Building a $15 Billion Chip Factory Anyway. Elon Musk plans to invest over $15 billion in Terafab, a Texas semiconductor factory involving Tesla, SpaceX and Intel. Despite lacking chipmaking experience, Musk aims to challenge established manufacturers by adapting equipment and accelerating production. Entrepreneur

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse Component salvaging provides a reliable and consistent method of harvesting electronic components, reducing electronic waste, minimizing fabrication of new components, and ensuring economic reuse for automated assembly. Technical Paper

Alternative gravity theory offers possible explanation for dark energy changing over time Researchers at Istanbul Technical University found that an alternative gravity theory naturally allows dark energy to shift from negative to positive density over cosmic history. The model could explain evolving cosmic expansion and potentially ease the Hubble tension. Phys.org

Sponsor Discover the power of vAI ProVision from Viscom Create and optimize 3D AOI and AXI programs in minutes. vAI ProVision boosts inspection depth, quality, and speed. Viscom develops & produces premium inspection systems. Viscom

AI will make 'bad things' happen, Sam Altman says. Exhibit A: needless death OpenAI CEO Sam Altman argues society should accept some AI-related harms for technological benefits, but lawsuits, military targeting errors and near-conflicts highlight serious risks. Critics demand enforceable government oversight rather than relying on voluntary self-regulation. Taipei Times

Issues With Components Near PCB Edges What issues are we likely to see whan we place BGA components very close to PCB edges? What impact might it have on reliability? Will, equipment, screening, placement, or re-flow require modification? The Assembly Brothers, Jim Hall and Phil Zarrow, answer these questions. Board Talk

Technical Papers ■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible ■ Oxide Reduction for Reliable Electronics Manufacturing ■ UHDI Fabrication for IC Substrates: SAP and mSAP Processes ■ Flux-Free, Reliable, Efficient: Soldering with Formic Acid ■ Redesigning Material Logistics for High-Mix EMS Production ■ Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education ■ Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You ■ Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse MORE TECHNICAL PAPERS

Sponsor High Accuracy SMT / SEMI Inspection Discover TRI's High Accuracy Inspection Solutions for the SMT and SEMI Back-End Electronics Manufacturing. Test Research, Inc.

California sues major 3D-printing filament maker over claims it deliberately catered to ghost gun enthusiasts San Diego County has sued Polymaker, alleging the 3D-printing filament manufacturer marketed its products to ghost gun enthusiasts. California seeks civil penalties, revenue recovery and an injunction, while emphasizing the lawsuit does not prohibit filament sales. TechSpot

First Utility-Scale Enhanced Geothermal Plant Goes Live Fervo Energy has begun delivering electricity from its 33-megawatt Utah geothermal project, marking a global milestone for next-gen geothermal power. The $2 billion Cape Station project aims to reach 500 megawatts, supplying reliable, carbon-free electricity to growing markets. IEEE Spectrum

Influence of PCB Surface Features on BGA Assembly Yield This paper provides insight into the impact of irregularities on BGA package surface mount yield, and guidance on design and to limit their impact. Technical Paper

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Microsoft to rely more on homegrown AI chips, reducing dependence on Nvidia Microsoft will expand its use of homegrown Maia AI chips to reduce reliance on Nvidia GPUs, improve data center efficiency, and lower operating costs. Its Maia 300 accelerator, expected in 2027, promises significantly higher performance and energy efficiency. CNBC

82% of approved electronics are tested in China, but the FCC wants that figure down to zero by 2028 The FCC will vote on rules requiring manufacturers to move electronics testing out of mainland China by December 2028. The proposal aims to reduce security risks but could increase certification costs and delays for hardware companies. TechSpot

An Introduction to the Process of Printed Electronics While following best practices, researchers aim to create processes that ramp up the scale of production for simple circuits and integrated conductive structures. Technical Paper

Sponsor High Precision Component Milling Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies. Air-Vac Engineering

Intel, Broadcom CEOs warn capital crunch could become AI's biggest bottleneck Intel and Broadcom CEOs warned that rising capital costs could constrain AI infrastructure expansion more than chip, memory or power shortages. Despite strong demand through 2030, companies must demonstrate meaningful returns to sustain long-term investment. CNBC

Security Becomes a Sign-off Item Europe's Cyber Resilience Act will require chipmakers to demonstrate hardware security through auditable evidence and independent assessments. With technical standards arriving close to the 2027 deadline, the law could accelerate AI-driven verification while increasing compliance costs. EE Times

Sponsor Automation in Transition The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts. SCHUNK

How Long Has The Internet Really Been Around? The Answer Might Surprise You The internet originated with ARPANET in 1969, using packet switching to transmit data reliably. Researchers unified separate networks through TCP/IP in 1983, while Tim Berners-Lee invented the World Wide Web in 1989, enabling modern browsing. BGR

Fill the Void II: An Investigation into Methods of Reducing Voiding This paper is a continuation of previous work on voiding. The voiding results are summarized and recommendations made for reduction of voiding. Technical Paper

Apple trails Samsung as global smartphone shipments hit a 13-year low Global smartphone shipments plunged 20% year over year in Q3 2026 to a 14-year low amid a RAM shortage. Apple captured 22% of the market, trailing Samsung’s 23%, while Xiaomi, Oppo and Vivo lost share. Apple Insider

SpaceX alumni nab $100M to rethink shipping with autonomous freight trains Parallel Systems raised $100 million to scale its battery-powered, autonomous Panther rail vehicles, aiming to make short-haul freight transportation competitive, reduce congestion and emissions, and help railroads reclaim market share from struggling trucking companies. TechCrunch

Sponsor Introducing our new Board to Board Connectors These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling. Advanced Interconnections Corp

Apple's Next Big Push Isn't an iPhone. It's Your Front Door. Apple is partnering with LG to expand its smart home ecosystem with smart locks, doorbells, thermostats and security cameras. The collaboration lets Apple broaden its offerings while competing with Amazon Ring and Google Nest. Entrepreneur