circuitnet
Sponsor
Viscom-SE

Viscom: Next Level of Inspection at APEX
Viscom Inc. presents its AI-powered inspection software vAI ProVision at APEX Expo 2026 in Anaheim. See live demos of faster AOI and AXI programming at Booth #2836.
Viscom SE
Ask the Experts
What's Causing Cloudy Conformal Coating
We are experiencing electrical faults with an assembly. When the units are inspected we see an abnormal cloudy/milky condition in the conformal coating between ...
Responses by:
Richard D. Stadem
Advanced Engineer/Scientist, General Dynamics
Fritz Byle
Process Engineer, Astronautics
Edithel Marietti
Senior Manufacturing Engineer, Northrop Grumman
Mark Northrup
Fellow, Raytheon
Mark Norris
Vice President Asia, Nordson Advanced Technologies
Terry Munson
President/Senior Technical Consultant, Foresite
Rick Perkins
President, Chem Logic
Greg York
Technical Sales Manager, BLT Circuit Services Ltd
What Is Causing Slanted Pins After Reflow
Components Falling Off During Wave Soldering
ESD Ground Wire Gauge
Looking for Long-term Component Storage Options
Question About PPM Defect Rate for Reversed Packages
ESD and Humidification
SMT Target Component Placement
MORE ASK THE EXPERTS
Alltemated
Sponsor
Smart-Sonic

EPA Verified Stencil Cleaning Systems
Low power density ultrasonic cleaners combined with 440-R-SMT detergent provide safe and effective cleaning of stencils, pallets, oven radiators, misprints and SMD adhesives.
Smart Sonic
Industry Calendar
Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA
Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMT
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
Oct 1, 2026
Long Island Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Aim-Solder
Sponsor
Heller-Industries-Inc

Eliminate Voids for High-Reliability Applications
Voids compromise reliability. Achieve near zero-voiding with our vacuum reflow for automotive, micro-bumping, and advanced electronics. Send your boards to see the results.
Heller Industries
What Year Was It?
FDR Inaugurated
What Year
At the height of the Great Depression, Franklin Delano Roosevelt is inaugurated as the 32nd president of the United States.
See the answer below.
Sponsor
Viscom

Pioneering 3D X-ray Inspection for Flat Assemblies
Viscom is setting a new standard for high-precision inline X-ray inspection of printed circuit boards with its iX7059 product line. Learn more.
Viscom
Creative-Electron
What Year Was It Answer
FDR Inaugurated
Answer: March 4, 1933
March 4, 2026
image
From Brussels to Taipei: The Global Race to Regulate AI
Since ChatGPT ignited the generative AI boom, governments worldwide have rushed to regulate the technology. The European Union leads with risk-based rules, while the United States resists strict oversight and China enforces tight controls, reflecting sharply divided global approaches.
Taipei Times
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
VIEWPOINT 2026: Rich DePoto, Business Development Manager, Uyemura
image
Uyemura has invested ambitiously in advanced chemical technologies. As such, we can find ourselves with extraordinary solutions . . . in search of problems. When adaptation advances slowly, this approach can appear inefficient – at least temporarily. Today's electrical design needs are clearly outpacing what's ...
Uyemura
Cutting Without Contact: How Laser Depanelling Redefines PCB Manufacturing
A laser depanelling solution delivers precision, zero mechanical stress, and cleanroom-level quality—transforming PCB manufacturing for high-reliability industries like automotive, medical, and industrial electronics.
Technical Paper
Compal expects sharper PC slowdown in 1Q26, speeds up shift to non‑PC revenue
Compal Electronics President and CEO Anthony Peter Bonadero warned that first-quarter 2026 PC shipments will drop 15% to 20% from the previous quarter, as the company accelerates diversification and targets non-PC businesses to contribute 40% of total revenue next year.
Digitimes
Sponsor
Nordson-ASYMTEK

Reclaim Your Factory's Future
Space is a precious resource. With SELECT Synchro, reclaim it, and reimagine your factory's workflow for greater efficiency and scalability.
Nordson Electronic Solutions
Apple reportedly explores Google Cloud to power next-generation Siri
Apple is in talks with Google to host a new version of Siri in Google's data centers, signaling a potential expansion of Apple's use of third-party cloud infrastructure as it accelerates efforts to upgrade Siri and strengthen its artificial intelligence capabilities.
Digitimes
Moisture Effects in Common Solderable RF Connector Dielectrics
The tendencies of commonly used RF connector polymeric materials to absorb and desorb moisture under various humidity and temperatures are characterized.
Technical Paper
Technical Papers
The Drawbacks of Internal Recycling Systems for Solder Dross
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible
PCB Rework Evolves, With X-ray a Constant Support
How pH Cleaning Agents Affect Production Performance
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin
Understanding Solder Dross: Causes and Control Strategies
Optimizing BGA Rework: Challenges, Techniques and Quality Control
MORE TECHNICAL PAPERS
Sponsor
Test-Research-Inc.

AI Void Detection - X-Ray Inspection
X-ray Inspection for hidden and buried solder joints. BGA, QFN, THT, and more. High Speed and High Resolution configurations available.
Test Research, Inc.
Momentum Returns, But Structural Bottlenecks Test the Electronics Industry
The Global Electronics Association reports February momentum in electronics manufacturing as new orders, shipments, and backlogs expand, but rising labor/material costs, talent shortages, and distributed capacity bottlenecks constrain growth, testing the industry's scalability.
Global Electronics Association
The lead U.S. cyber agency is stretched thin as Iran hacking threat escalates
Cybersecurity experts warn escalating Middle East fighting could spark Iranian cyberattacks on U.S. businesses and critical infrastructure. As retaliatory strikes intensify, a weakened CISA faces staff cuts and funding gaps, heightening fears of disruptive digital assaults.
CNBC
Issue with BGAs and SAC Balls After Switching to Low-Temp Solder Paste
If we switch to low temp solder paste, will we have issues with BGAs and SAC balls? We are trying to build a product with low temperature solder.
Board Talk
Sponsor
Essegi-Automation

From Slave to Master: flexible ISM integrations
ESSEGI AUTOMATION's ISM software integrates with 250+ brands, connecting ERP, MES, WMS, Pick & Place and X-Ray systems. Flexible logic allows it to operate as master or slave in any production flow.
Essegi Automation
This Offshore Wind Turbine Will House a Data Center Underwater
Aikido Technologies plans to embed data centers inside floating offshore wind turbines, using onboard wind power and freshwater cooling. It will test a 100-kW prototype in the North Sea, aiming to meet AI energy demand with secure, renewable offshore infrastructure.
IEEE Spectrum
MIPS, GlobalFoundries Bet on Physical AI
MIPS speeds its comeback by acquiring Synopsys's ARC IP and going all-in on RISC-V to target physical AI and automotive markets. With 200 million deployed SoCs and a Mobileye EyeQ7 win, it advances customizable, real-time, safety-certified chips for software-defined vehicles.
EE Times
Effect of TIM Compression Loads on BGA Reliability
This work aims to provide guidance for the potential trade-offs between thermal performances and second level interconnect reliability.
Technical Paper
Sponsor
Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Global Security Spend to Exceed $300 Billion in 2026 as the Adoption of AI-Driven Security Platforms Gains Momentum
Global security spending is set to hit $308B in 2026, growing 11.8% YoY, driven by AI-focused software and services. Banking, government, and capital markets lead investments, while the U.S., Western Europe, and APeJC dominate spending amid rising cyber threats.
IDC
Qualcomm is getting ready for Wi-Fi 8 this year, 6G in 2029
Telecom and tech giants including Qualcomm, Nvidia, Microsoft and Samsung are accelerating 6G development, targeting commercial rollout by 2029. They aim to build AI-native, open-source networks, while advancing Wi-Fi 8 devices expected to debut later this year.
TechSpot
Sponsor
SEHO

SEHO makes production lines smarter
Improve your work flow and reduce manufacturing costs with creative ideas and innovative solutions for automation, board handling and material management.
SEHO Systems GmbH
Second-hand phones surf rising green consumer wave
The global market for refurbished smartphones is surging as consumers seek cheaper, eco-friendly alternatives to new devices showcased at Mobile World Congress. Companies like Back Market drive growth, despite lingering quality concerns and geopolitical trade tensions.
Taipei Times
Solder Paste Inspection Tools to Support Industry 4.0 & Package Scaling
This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability.
Technical Paper
Apple's iPhone and iPad become first consumer devices to receive NATO security clearance
Apple has reached a cybersecurity milestone: iPhones and iPads running iOS 26 and iPadOS 26 are now certified to handle NATO's restricted-level classified data. The approval, granted by German authorities, makes Apple the first consumer device maker meeting NATO's standards.
TechSpot
Why the Global Fight for Your Digital Data Has Already Begun
Data once sat quietly behind business operations, collected and monetized with little public scrutiny. That era has ended. Companies now confront growing visibility and accountability as data shifts from a back-office asset to a central force shaping strategy, trust and public debate.
Entrepreneur
Sponsor
Air-Vac-Engineering

Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
4 Smartwatches You Should Avoid, According To Consumer Reports
Consumer Reports urges buyers to think twice before choosing certain smartwatches, ranking the budget-friendly 3Plus Vibe Plus (Gen 2) last for poor battery life and limited smarts, and placing the pricier Polar Ignite 3 near the bottom despite solid fitness features.
BGR
Today's Sponsor
Master-Bond
Sponsor
Master-Bond

Low Thermal Resistance Epoxy
Master Bond EP53TC is a thermally conductive, electrically insulating adhesive that combines good physical properties and the ability to transfer heat rapidly and effectively.
Master Bond
Test Your Knowledge
With reference to electronic components, what does the acronym SOIC stand for?
See answer below.
Industry Press
Indium to Showcase High-Reliability Solder Technology at APEX EXPO 2026
Indium Corporation® will feature its high-reliability solder solutions at APEX EXPO 2026, March 17-19, in Anaheim, California. Indium Corporation's showcased ...
Indium Corporation
LPMS USA Demos New LED Light Giveaway at IPC APEX 2026
LPMS USA will exhibit at IPC APEX 2026, bringing live equipment demonstrations and advanced molding material technologies to
the show floor. This year's live ...
LPMS USA
Discover ViTrox's Advanced Inspection & Smart Manuf. Solutions at APEX
ViTrox aims to be the World's Most Trusted Technology Company in providing innovative, advanced, and cost-effective automated Machine Vision Inspection Solutions ...
ViTrox Technologies Sdn. Bhd.
TopLine Corporation to Exhibit Packages, Learning Solutions at APEX Expo
TopLine Corporation will exhibit a number of innovative solutions and learning tools at APEX Expo 2026, in Booth# 3300. The main features on display will be as follows ...
TopLine Corporation
Kurtz Ersa Expands Competence in Microelectronics & Advanced Packaging
Kurtz Ersa Inc. is strengthening its position in microelectronics and semiconductor technology. Effective September 1, 2025, ATV Technologie GmbH officially became ...
Kurtz Ersa Inc.
Siemens accelerates integrated circuit design and verification
Siemens announced the Questa One Agentic Toolkit, which brings domain-scoped agentic AI workflows to its Questa™ One smart verification software portfolio ...
Siemens
CE3S and Desco Announce ANSI/ESD S20.20-2021 Certification Webinar Series
Cumberland Electronics Strategic Supply Solutions (CE3S) is pleased to announce the upcoming ANSI/ESD S20.20-2021 Training Course hosted by Desco Industries ...
Cumberland Electronics Strategic Supply Solutions
MORE INDUSTRY PRESS
Circuit-Technology-Center
Sponsor
Advanced-Interconnections

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
Quote of the Day
"Computers are useless. They can only give you answers."
Pablo Picasso, 1967
Sponsor
ECD

Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD
Indium-Corporation
Cartoon of the Day
Cartoon
"Are you part of the problem, part of the solution, part of the problem with the solution or part of the solution to the problem with the solution?"
Copyright © Randy Glasbergen
Sponsor
BEST-Inc.

Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly.
BEST Inc.
Plasma-Etch
Test Your Knowledge Answer
With reference to electronic components, what does the acronym SOIC stand for?
Answer: Small-Outline Integrated Circuit which is a surface-mounted integrated circuit (IC) package which occupies an area about 30 to 50% less than an equivalent dual in-line package (DIP), with a typical thickness that is 70% less.