circuitnet
Sponsor
DL Technology
Micro Dispensing Technology White Paper
The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size.
DL Technology
Ask the Experts
MELF Component Misalignment
We have glued SMD MELF components that are misaligned after reflow. But all the chip components are correctly aligned. In testing if we eliminate the gluing ...
Responses by:
Leo Lambert
Vice President, Technical Director, EPTAC Corporation
Richard D. Stadem
Advanced Engineer/Scientist, General Dynamics
Terry Munson
President/Senior Technical Consultant, Foresite
Bill Coleman
Vice President Technology, Photo Stencil
■ Delamination After V-cut
■ Allowable Bow and Twist on Round PC Fab
■ Is There a Spec for LDI Mask thickness?
■ Production Floor Temperature and Humidity Loggers
■ How To Reduce Solder Joint Voids in QFN Components
MORE ASK THE EXPERTS
M804
Sponsor
Air-Vac Engineering
High Precision Component Milling
Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies.
Air-Vac Engineering
Industry Calendar
■ Oct 1, 2026: Long Island Expo & Tech Forum
■ Oct 7, 2026: Guadalajara Expo & Tech Forum
■ Oct 25, 2026: SMTA International Conference & Exposition
■ Oct 27, 2026: NEPCON ASIA 2026
■ Apr 5, 2027: APEX EXPO 2027
FULL INDUSTRY CALENDAR
REL61
Sponsor
Glenbrook Technologies
Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
Glenbrook Technologies
What Year Was It?
The day was Sep 25. What year was it?
Central High School Integrated
What Year
Under escort from the U.S. Army's 101st Airborne Division, nine black students enter all-white Central High School in Little Rock, Arkansas.
See the answer below.
Sponsor
Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
Peel-A-Way
What Year Was It Answer
Central High School Integrated
Answer: September 25, 1957
Sep 25, 2026
image
China Remains World's Largest Industrial Robot Market
China installed 354,000 industrial robots in 2025, capturing 59% of global deployments, according to the IFR. Domestic robot makers supplied 55% of installations, while strong electronics, automotive and machinery demand continued driving automation and growth.
Global Times
Sponsor
Viscom
vCONNECT: Your Next Level of Digital Connectivity
Discover vCONNECT: Analyze inspection data, monitor machine performance, predict maintenance needs, store data securely and access AI tools and the latest Viscom News.
Viscom
From Qubits to Workflows: Rethinking Quantum Computing
IBM is shifting quantum computing from standalone QPUs toward quantum-centric supercomputing, where CPUs, GPUs, AI and quantum processors share workloads. The approach treats quantum as another specialized accelerator within heterogeneous systems.
EE Times
Redesigning Material Logistics for High-Mix EMS Production
High mix electronics manufacturing requires reliable material management. This white paper explains how BMK enhanced traceability, inventory accuracy and picking efficiency using integrated automated storage, digital workflows and reel-level visibility.
Technical Paper
Meta gets to consumer AI device market before OpenAI, but Zuckerberg's strategy remains unproven
Meta is expanding its AI strategy around Muse, pairing the agent with AI glasses and the new Muse Charm pendant. Zuckerberg aims to reduce reliance on smartphones and strengthen hardware distribution while developing transaction-based monetization for Muse.
CNBC
Sponsor
CircuitMedic
Professional PCB Repair Kits
Repair damaged pads, traces, plated holes and circuit board materials with professional-grade kits, tools and materials. Developed by PCB repair experts with 40+ years of experience.
CircuitMedic
Delos Data Targets Heterogeneous AI with Data Interface
Delos Data is developing Apollo, a silicon data-interface chiplet designed to connect GPUs, CPUs, accelerators, memory, and storage in low-latency domains. The startup targets major improvements in bandwidth, resiliency, scalability, and efficient AI infrastructure connectivity.
EE Times
Problem Meeting Minimum Hole Fill During Wave Soldering
We are having problems achieving the minimum hole fill of 75% on electrolytic capacitors using our wave soldering. What do you suggest? The Assembly Brothers, Jim Hall and Phil Zarrow, discuss this question and share their own advice.
Board Talk
Technical Papers

■ Oxide Reduction for Reliable Electronics Manufacturing
■ UHDI Fabrication for IC Substrates: SAP and mSAP Processes
■ Flux-Free, Reliable, Efficient: Soldering with Formic Acid
■ Redesigning Material Logistics for High-Mix EMS Production
■ Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education
■ Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
■ Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse
■ Digital Warehouse Automation in High-Mix PCB Assembly
MORE TECHNICAL PAPERS
Sponsor
BEST Inc.
Bring IPC Training to Your Facility
Mobile training center offers IPC certified classes at your company’s facility making solder training effective and convenient for your entire team.
BEST Inc.
Self-driving cars can be fooled by a surprisingly simple pattern
University of Florida researchers found that repeated patterns such as stripes, fences, and grilles can confuse stereo-camera depth systems in autonomous vehicles, drones, and robots, causing incorrect distance estimates that may trigger sudden maneuvers, braking, or collisions.
Earth
Measure Distant Asteroids With a DIY Rig
Amateur astronomers can study asteroids by recording occultations, when asteroids briefly block distant stars. Using affordable telescopes, cameras and precise GPS timing, observers can map asteroid shapes, adding valuable measurements to professional astronomical research.
IEEE Spectrum
Electroplating of Cu in TSV
The research objective is to estimate metallurgical and mechanical properties of low alpha solder. Cu-filling property to TSV was also investigated.
Technical Paper
Sponsor
Advanced Interconnections Corp.
Need Improved Solder Joint Visibility?
Solder Peel-A-Way® Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
Gartner Predicts Only 5% of Organizations Will Make at Least 10% of Supply Chain Planning Decisions Autonomously by 2030
Gartner predicts only 5% of organizations using supply chain planning automation will make at least 10% of decisions autonomously by 2030. Data quality, human oversight, technology readiness and workforce skills will slow AI-driven planning adoption despite heavy investment.
Gartner
Enclosures in the age of customisation
Modern enclosure design supports IoT, AI, edge computing and automation with compact, thermally efficient solutions. Manufacturers combine advanced materials, modular architectures and new production techniques to manage complex electronics.
New Electronics
High Reliability, Stress-free Copper Deposit
To overcome the challenge of metallizing smooth surfaces, a new stress-free electroless copper was developed to serve this important sector.
Technical Paper
Sponsor
KYZEN
The "Fried Egg" Effect in Soldering
Burnt-on flux residue that is visible on the solder mask of PCBs after improper reflow settings produces significant challenges to the reliability of finished boards.
KYZEN
Palo Alto CEO says slowing down AI is 'unrealistic', extinction threat 'extremely small'
Palo Alto Networks CEO Nikesh Arora says slowing AI development is unrealistic because companies will move at different speeds. He urges developers to test products thoroughly, build safety guardrails and take responsibility rather than relying on regulatory protection.
CNBC
The case for bringing AI compute in-house (and on a road trip)
Companies are bringing AI models in-house to cut token costs, protect sensitive data and run agentic workflows. Local hardware enables adversarial model loops and overnight tasks, but IT teams must balance savings with security and access controls.
IT Brew
Sponsor
EOS/ESD Association
Reimagined EOS/ESD Symposium 2026
Experience the enhanced EOS/ESD Symposium with expanded learning, collaboration, and industry connections. Join experts exploring challenges and solutions in EOS/ESD control. September 28-30.
EOS/ESD Association
China's AI chip blitz arms Xi with a message for Trump: 'You can't choke us off'
China has showcased new Huawei and Alibaba chips and advanced AI models ahead of Xi Jinping's U.S. visit, signaling resilience against American technology restrictions. Experts say Chinese firms still trail U.S. companies in chip performance, production and profitability.
CNBC
The Development of a 0.3 mm Pitch CSP Assembly Process
A major study looks at different aspects of the stencil printing process and their impact upon the assembly and reliability of CSP components.
Technical Paper
Meta is trying VR glasses (again), this time with more IMAX
Meta has unveiled lighter Meta VR Glasses, priced from $1,299.99, promising immersive entertainment through 5K displays, 3D content, spatial audio and IMAX support. The glasses also integrate Disney+ experiences, transforming movies into interactive virtual environments.
TechCrunch
Nvidia's Open Weight Letter Is More About AI Sovereignty Than Anything
Nvidia and major technology firms backed open-weight AI models, arguing they strengthen technological sovereignty. Open weights let businesses control model behavior, data, infrastructure, costs and deployment, while reducing dependence on providers' updates.
Entrepreneur
Sponsor
AI Technology, Inc.
Corrosion, UV Protection for Power Transmission
Moisture, corrosive gas, oxidation & UV blocking prop-erties. FLUOROSEAL® conformal coating for electrical contacts & ceramic insulator protection.
AI Technology, Inc.
Big tech says AI can find a cure for cancer. So where is it?
AI is advancing cancer detection, diagnosis, treatment planning and drug discovery, but experts caution that biology's complexity, limited data and regulatory barriers prevent quick cures. Researchers expect AI to improve personalised, equitable care while humans remain essential.
The Guardian
Today's Sponsor
Sponsor
Sponsor
Ormet TLPS
AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
Test Your Knowledge
Which two countries are connected by the Simplon Pass?
See answer below.
Industry Press
TRI Brings AI-Powered Inspection Solutions to SMTAI 2026
Test Research, Inc. (TRI) will exhibit at SMTA International 2026, taking place October 27-29 at the Donald E. Stephens Convention Center in Rosemont, Illinois. Attendees ...
Test Research, Inc.
Seika Machinery Highlights Smarter PCB Routing, Inspection, and Process Control at SMTAI
Seika Machinery, Inc. will exhibit at SMTA International 2026, taking place October 27–29 at the Donald E. Stephens Convention Center in Rosemont, Illinois. Attendees ...
Seika Machinery, Inc.
KIC to Bring Heat to Data™ and Automatic Profiling to SMTAI
KIC will exhibit at SMTA International 2026, taking place October 27-29 at the Donald E. Stephens Convention Center in Rosemont, Illinois. Visitors are invited to Booth #2834 ...
KIC
Fuji America to Demo Smart Factory Placement Technologies at SMTAI
Fuji America Corporation will exhibit at SMTA International 2026, taking place October 27–29 at the Donald E. Stephens Convention Center in Rosemont, Illinois. ...
Fuji America Corporation
ViTrox Brings AI-Powered Smart Manufacturing Innovations to SMTAI
ViTrox is excited to announce its participation in SMTA International 2026. The exhibition will take place at the Donald E. Stephens Convention Center ...
ViTrox Technologies Sdn Bhd
Europlacer to Showcase Connected SMT Ecosystem for High-Mix Productivity at SMTAI
Europlacer will showcase its approach to high-mix productivity at SMTA International 2026, highlighting a connected ecosystem of intelligent automation, flexible SMT ...
Europlacer
Scienscope Brings AI Counting, Smart Storage, and X-Ray Inspection to SMTAI
Scienscope International will exhibit at SMTA International 2026, taking place October 27–29 at the Donald E. Stephens Convention Center in Rosemont, Illinois. Attendees ...
Scienscope International Corporation
MORE INDUSTRY PRESS
Filling Paste
Sponsor
SCHUNK
What are your economic depaneling needs?
Our depaneling machines are high-performance machines for single circuit boards with electronic components. The cutting principles are fast, the best quality.
SCHUNK
Quote of the Day
"What we play is life."
Louis Armstrong
Sponsor
SEHO Systems GmbH
SEHO makes production lines smarter
Improve your work flow and reduce manufacturing costs with creative ideas and innovative solutions for automation, board handling and material management.
SEHO Systems GmbH
Process Assessment Engineer
Cartoon of the Day
Cartoon
"I haven't read your proposal yet, Bob, but I already have some great ideas on how to improve it."
Copyright © Randy Glasbergen
Sponsor
Plasma Etch
Contaminant Removal with Plasma
Plasma provides organics removal and other benefits to increase bond strength! Many chamber sizes available, all with a low environmental impact. Learn more.
Plasma Etch
Focus on Storage Solutions -post APEX
Test Your Knowledge Answer
Which two countries are connected by the Simplon Pass?
Answer: Switzerland and Italy