circuitnet
Sponsor
Indium-Corporation

The Industry Standard Solder Paste
Looking to Avoid the Void® and enhance SIR performance? Indium8.9HF is your proven, versatile and stable, no-clean, halogen-free, Pb-free solder paste solution.
Indium Corporation
Ask the Experts
Bottom Terminated Components and Vias
Should the thermal vias of bottom terminated components be tented on both sides to prevent flux trapping and solder wicking, or is it sufficient to tent ...
Responses by:
Kathy Nargi-Toth
Director Quality and Technology, NCAB Group USA
Kay Parker
Technical Support Engineer, Indium Corporation
Robert "Bob" Lazzara
President, Circuit Connect, Inc.
Edithel Marietti
Senior Manufacturing Engineer, Northrop Grumman
Fritz Byle
Process Engineer, Astronautics
Gerard O'Brien
President, S T and S Testing and Analysis
Cleanliness Standards for Electronic Components
Baking Concerns for Stacked Trays of Components
Cleanliness Requirement for Populated Printed Boards
Flux Residue During Pin-in-Paste
Storage To Prevent Corrosion
Manual or Automated Assembly?
Soldering Station Calibration
MORE ASK THE EXPERTS
Zestron
Sponsor
Nordson-ASYMTEK

ASYMTEK Select Coat SL-1040
The SL-1040 Conformal Coating System upgrades the SL-940 and added significant system-level advancements to elevate automation, control, precision & preventative maintenance for better yield.
Nordson Electronics Solutions
Industry Calendar
Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA
Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMTA
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
Oct 1, 2026
Long Island Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Advanced-Interconnections
Sponsor
Summit-Interconnect

Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect
What Year Was It?
English Channel Tunnel Opens
What Year
A rail tunnel under the English Channel was officially opened, connecting Britain and the European mainland for the first time since the Ice Age.
See the answer below.
Sponsor
Plasmatreat-GmbH

Low Pressure Plasma for Electronics
Expand your knowledge of plasma technology. Register now for the new PlasmaTalk webinar to learn how low-pressure plasma can advance your production.
Plasmatreat
Uyemura
What Year Was It Answer
English Channel Tunnel Opens
Answer: May 6, 1994
May 6, 2026
Samsung crossses $1 trillion valuation as AI frenzy drives historic rally, lifting shares over 15%
Samsung Electronics shares surged over 15%, lifting its valuation past $1 trillion as AI-driven chip demand and record earnings fueled investor optimism. Strong memory sales, HBM4 progress and potential Apple chip talks boosted momentum across South Korea’s semiconductor sector.
CNBC
Sponsor
Circuit-Technology-Center

Simplify Your Most Challenging BGA Rework
When complex BGA repairs demand precision and reliability, turn to the trusted resource used by leading military contractors for all their rework.
Circuit Technology Center
In the global AI race, a sanctioned Chinese firm says cheaper models can still win
China’s AI firms like DeepSeek, Alibaba, Xiaomi and SenseTime race to launch models while balancing high compute costs. SenseTime pivots to efficient multimodal AI, cuts losses, and competes on price as companies battle for users and revenue amid fierce competition.
CNBC
Maintenance: The Basics of Cleaning Series Part 4
This article is the fourth and final part of the series titled "The Basics of Cleaning". In this final chapter, some of the common mistakes in maintenance cleaning applications found in electronic assembly operations will be covered and a summary of the entire series.
Technical Paper
Apple and Samsung are dominating smartphone sales so thoroughly that only one other company makes the top 10
Apple and Samsung dominated Q1 2026 smartphone sales, taking nine of top ten spots, led by iPhone 17 series and Galaxy A07/A17. Xiaomi’s Redmi A5 broke in tenth as high-end models drove strong demand despite supply constraints.
TechSpot
Sponsor
Viscom-SE

iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
EDITORIAL: AI boom left economy unbalanced
Taiwanese tech firms rapidly capture AI supply chains, driving a 23% surge in the TAIEX and record market values. TSMC, Hon Hai, and MediaTek post strong gains, boosting GDP sharply, while traditional industries lag amid uneven AI-driven growth.
Taipei Times
Low Temperature Solder “Reverse Hybrid” Method
This paper will review the implementation of LTS “Reverse Hybrid”, which is the assembly of a ball grid array component with LTS solder balls to the motherboard.
Technical Paper
Technical Papers
Scaling SMT Traceability
The Drawbacks of Internal Recycling Systems for Solder Dross
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible
PCB Rework Evolves, With X-ray a Constant Support
How pH Cleaning Agents Affect Production Performance
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin
Understanding Solder Dross: Causes and Control Strategies
MORE TECHNICAL PAPERS
Sponsor
Schunk

Gripping Systems from micro assembly to heavy lifting
The first industrial-suited grippers from SCHUNK were a milestone. Since then we have brought countless newly and further developments to market.
SCHUNK
Chicken or the Egg? Why We Need to Rethink Data and Funding in Startups
Biopharma startups continue driving healthcare innovation but face early funding hurdles due to limited data. Founders must balance storytelling and evidence, using strong narratives to reduce uncertainty, attract investors, and build trust, as waiting for perfect data can stall progress indefinitely.
Entrepreneur
The FCC wants to ban Chinese labs from certifying electronics, but 75% of devices are tested there now
The FCC unanimously advanced a proposal to bar Chinese and Hong Kong labs from certifying electronics for the U.S., citing security risks. The move could raise costs, delay approvals, and disrupt manufacturers—especially smaller firms reliant on faster, cheaper Chinese testing facilities.
TechSpot
Machine Vision-based Defect Inspection for Plated Through Hole Components
This study delineates the conceptualization of a machine vision-based defect inspection model, meticulously engineered to confront the intricacies of high-throughput PCB assembly.
Technical Paper
Sponsor
AI-Technology-Inc

AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives
240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity.
AI Technology, Inc.
Apple's 5 Most Infamous Design Flaws
Apple rarely stumbles on design, but when it does, failures draw intense scrutiny. From the iPhone 4 antenna scandal to the flawed butterfly keyboard, high-profile missteps triggered lawsuits, payouts, and eventual design reversals despite the company’s reputation for innovation.
BGR
Intel soars 13% on report of Apple chip talks, hits new all-time high
Intel shares surged 13% to a record high, fueled by reports that Apple may diversify chip production to Intel and Samsung. Strong AI demand, strategic partnerships, and major investments have driven a dramatic turnaround and sustained rally.
CNBC
Single Device Traceability in Assembly without ECID
The recent evolution of data analytics allows correlation analysis from wafer fab to wafer test to assembly and packaging to product level test and field performance.
Technical Paper
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
AI Data Centers Stretch Tech Innovation Limits
The electronics industry races to build AI data centers, driving massive growth and redesigning power, cooling, and system architectures. Engineers adopt higher-voltage, DC-based systems and advanced cooling while chipmakers boost CPUs and GPUs to meet soaring compute and efficiency demands.
Design News
Gartner Says Autonomous Business and AI Layoffs May Create Budget Room, but Do Not Deliver Returns
A Gartner survey finds 80% of firms piloting autonomous technologies report workforce cuts, yet gains in ROI remain inconsistent. The study highlights that investing in skills and human-AI collaboration—not layoffs—drives better returns, with long-term adoption expected to create more jobs.
Gartner
Sponsor
Intraratio-Corporation

Discover Real Operational Strategies from Proven Global Leaders
In this 4-part series we asked three experienced global leaders for their insights on the biggest challenges faced by manufacturing operations today. No Registration required.
Intraratio
TCL reportedly in talks to sell majority stake in India display plant
TCL Electronics is in advanced talks to sell a majority stake in its Indian display unit, highlighting intensifying localization pressures on foreign firms and signaling a broader shift in Chinese supply chain strategies and operations within India’s evolving electronics market.
Digitimes
Can High Particle Concentrations Impact PCB Assembly?
At our SMT facility we currently control ambient temperature, relative humidity and particle count. Is particle count a good parameter to control? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question.
Board Talk
Apple reportedly explores Intel and Samsung chip production to reshape advanced manufacturing strategy
Apple is exploring a major shift in its chip supply chain, holding early talks with Intel and Samsung to manufacture its device processors, signaling a potential move to diversify beyond its long-time exclusive partner, TSMC.
Digitimes
Two Hon Hai-built Satellites Launched from US Into Orbit
Hon Hai launches PEARL-1A and PEARL-2B satellites from California into low Earth orbit, testing Ka-band inter-satellite links, ionospheric monitoring, and payload tech, advancing Taiwan-US cooperation and future constellation design capabilities.
Taipei Times
Sponsor
Manncorp

SMT Line Builder Tool – Fast & Easy
Skip the guesswork. Our SMT Line Builder gives you instant, expert-recommended setups based on your budget and output. Or send us your BOM—we'll handle it.
Manncorp Inc.
The chip industry is booming again, but only for companies building AI infrastructure
Silicon wafer shipments rise 13.1% year-on-year as AI-driven data center demand surges, while PC and smartphone markets weaken. Chipmakers redirect capacity toward memory & computing chips, signaling a recovery in industrial semiconductors despite uneven consumer demand.
TechSpot
Today's Sponsor
Master-Bond
Sponsor
Master-Bond

Thermally Conductive, Low Outgassing Epoxy
Master Bond EP21AOLV-2LO is an electrically insulating adhesive that meets NASA low outgassing requirements for sealing, coating and encapsulation applications. Ask an expert.
Master Bond
Test Your Knowledge
What do you call the natural, molecular-attraction force that inhibits the spread of a liquid at its interface with a solid surface.
See answer below.
Industry Press
NASA Low Outgassing, Chemically Resistant Epoxy Features High Tg
Master Bond EP64 is a two-component, vacuum-compatible epoxy system engineered for bonding, sealing, and coating applications. It features a high glass transition ...
Master Bond
EEEA, Inc. installs Glenbrook Jewel Box Ultra Compact X-ray System
Since its founding in 1974, EEEA, Inc. has been driven by a singular mission: to provide high-quality electromechanical assembly and printed circuit board ...
Glenbrook Technologies
KYZEN AQUANOX A4618 & Process Control Take Centerstage at SMTA Capital Exp
KYZEN will exhibit at the SMTA Capital Expo and Tech Forum scheduled to take place Thursday, May 14 at the DoubleTree Baltimore - BWI Airport in Linthicum Heights, ...
KYZEN
Creative Electron Reinforces Commitment to U.S.-Built X-ray & CT Systems
Creative Electron is strengthening its commitment to something that has become increasingly important in manufacturing: X-ray systems designed, built, and supported ...
Creative Electron
NSI Expands Bishop & Brogdon, Inc. Southeast Representative Partnership
NSI is proud to announce that it has expanded their partnership with Atlanta-based Bishop & Brogdon, Inc. for the entire state of Florida, effective immediately. The agency has ...
NSI
EMAC Returns with Bright Electronics Manufacturing Challenge 2026
The Electronics Manufacturing & Assembly Collaborative (EMAC) has announced the return of the Bright Electronics Manufacturing Challenge 2026, an immersive, hands-on ...
The Electronics Manufacturing & Assembly Collaborative (EMAC)
MORE INDUSTRY PRESS
Rehm-Thermal-Systems-GmbH
Sponsor
Glenbrook-Technologies

PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
Quote of the Day
"Whatever the mind can conceive and believe, the mind can achieve."
Dr. Napoleon Hill
Sponsor
BEST-Inc.

J-STD-001 Solder Training Kit
BEST's IPC J-STD-001 Revision H-J training kit features circuit boards representing actual soldering conditions including multilayer boards with challenging thermal conditions.
BEST Inc
SEHO
Cartoon of the Day
Cartoon
"I want you to prepare a dynamic, intense, powerful, energy-charged Relaxation Workshop!"
Copyright © Randy Glasbergen
Sponsor
ECD

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
Plasma-Etch
Test Your Knowledge Answer
What do you call the natural, molecular-attraction force that inhibits the spread of a liquid at its interface with a solid surface.
Answer: Surface Tension