circuitnet
Sponsor
DL Technology
Micro Dispensing Technology Leader
DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries.
DL Technology
Ask the Experts
Moisture Barrier Bag Calculation
For calculating the life of moisture barrier bags used for long-term storage, I need to give the initial volume of the "vacuum-sealed" moisture barrier bag as input ...
Responses by:
Richard D. Stadem
Advanced Engineer/Scientist, General Dynamics
Mitch Holtzer
Director of Reclaim Business, Alpha Assembly Solutions
Jerry Karp
President, JSK Associates
Paul Austen
Senior Project Engineer, Electronic Controls Design Inc
Edithel Marietti
Senior Manufacturing Engineer, Northrop Grumman
Brianna Anderson
Senior Process Engineer, Circuit Technology Center
Mitch Holtzer
Director of Reclaim Business, Alpha Assembly Solutions
■ Acceptable Conductor Repair
■ Question About Dry Storage of PCBA's
■ MELF Component Misalignment
■ Delamination After V-cut
■ Allowable Bow and Twist on Round PC Fab
MORE ASK THE EXPERTS
Peel-A-Way
Sponsor
AI Technology, Inc.
TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology, Inc.
Industry Calendar
■ Oct 1, 2026: Long Island Expo & Tech Forum
■ Oct 7, 2026: Guadalajara Expo & Tech Forum
■ Oct 25, 2026: SMTA International Conference & Exposition
■ Oct 27, 2026: NEPCON ASIA 2026
■ Apr 5, 2027: APEX EXPO 2027
FULL INDUSTRY CALENDAR
Ultrasonic Stencil and Pallet Cleaner
Sponsor
Plasma Etch
Handheld Plasma Activation
Plug it in and start cleaning; no gas hookup! Versatile all-in-one solution you can take anywhere and activate almost anything in seconds! Learn more.
Plasma Etch
What Year Was It?
The day was Sep 30. What year was it?
USS Nautilus Commissioned
What Year
The USS Nautilus, the world's first nuclear submarine, is commissioned by the U.S. Navy.
See the answer below.
Sponsor
Uyemura
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Complete Solutions
What Year Was It Answer
USS Nautilus Commissioned
Answer: September 30, 1954
Sep 30, 2026
image
IBM Details Quantum, AI Developments in India
IBM and IIT Madras' quantum course drew 208,785 Indian enrollments in 2026. IBM is expanding quantum engineering, manufacturing, and post-quantum cryptography, while developing hardware acceleration and AI chips through its India Systems Development Lab.
EE Times
Sponsor
Ormet® TLPS
AIT ORMET® TLPS for Component Attach
AIT ORMET® TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
Global Electronics Association and Fraunhofer Group for Microelectronics Sign MoU to Support Advanced Packaging Industrial Adoption
The Global Electronics Association and Fraunhofer are partnering to move advanced packaging from pilot lines to production. Their MoU links APECS capabilities with standards and industry expertise to accelerate scalable manufacturing and adoption.
Global Electronics Association
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Technical Paper
Rare earths loom over US-China trade truce
The US-China trade truce continues after Trump and Xi's summit, but China's control over rare-earth supply chains remains a major pressure point, challenging Washington's efforts to stabilize economic ties and reduce dependence on Chinese critical minerals.
Digitimes
Sponsor
Viscom SE
SMTA Mexico – vAI ProVision
vAI ProVision: Smarter Inspection Programming Discover vAI ProVision by Viscom at SMTA Mexico, Booth: 343. Using proven inspection strategy and AI, it creates optimized inspection programs faster, reducing workload and enhancing reliability.
Viscom SE
Trump says top tech firms have signed accord to 'self-police' AI development
Trump and AI leaders signed a voluntary accord calling for internal controls, independent audits and board oversight of AI safety. The pact leaves regulation open, while critics question whether self-policing can adequately address growing risks.
NPR
Will Typical No Clean Paste Pass an SIR Test?
Will a typical no clean paste pass an SIR test? Is it really clean enough for a conformal coating and 20 years of service?
Board Talk
Technical Papers

■ Oxide Reduction for Reliable Electronics Manufacturing
■ UHDI Fabrication for IC Substrates: SAP and mSAP Processes
■ Flux-Free, Reliable, Efficient: Soldering with Formic Acid
■ Redesigning Material Logistics for High-Mix EMS Production
■ Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education
■ Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
■ Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse
■ Digital Warehouse Automation in High-Mix PCB Assembly
MORE TECHNICAL PAPERS
Sponsor
Advanced Interconnections Corp.
Need Improved Solder Joint Visibility?
Solder Peel-A-Way® Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
AI will be wrong more and more without reliable journalism
UNESCO urges AI firms to fairly compensate journalism, warning that chatbots increasingly rely on trusted news while diverting traffic and revenue. Sustainable funding, transparency and attribution could protect reliable information, strengthen democracy and improve AI credibility.
Taipei Times
Who Makes GPUs Besides Nvidia And AMD?
Nvidia dominates the consumer GPU market with roughly 95% share, while AMD remains a distant second. Intel’s Arc faces ongoing uncertainty despite competitive pricing, and Chinese challenger Moore Threads still struggles with compatibility and performance limitations.
BGR
Quantifying Stencil Aperture Wall Quality
This paper discusses a method for the measurement of stencil aperture wall roughness, producing quantifiable results which can predict paste release performance.
Technical Paper
Sponsor
Nordson Electronic Solutions
actnano Materials with Nordson Equipment
actnano's PFAS-free, cure-free coatings save energy and boost safety. And they are compatible with Nordson conformal coating systems. Upgrade your system today. Learn more!
Nordson Electronic Solutions
Gartner Predicts AI Will Allow the Majority of High-Performing Marketing Teams to Eliminate Traditional Bottom Rungs of the Corporate Ladder by 2030
Gartner predicts AI could eliminate traditional entry-level marketing roles by 2030, forcing CMOs to redesign junior talent development. Leaders must expose early-career marketers to strategic work, AI oversight and decision-making to preserve future leadership pipelines and expertise.
Gartner
China's manufacturing sector profits surge 54.7%
China's high-tech manufacturing profits surged 54.7% in the first eight months of 2026, driven by booming electronics, computing infrastructure and advanced equipment. Electronics profits more than doubled, reinforcing technology-intensive industries as growth engines.
The Manila Times
Process Development to Achieve a High Yield Wafer-to-Wafer Hybrid Bond
Discussed are ethodologies that ensure high yielding Cu-based wafer to wafer hybrid bonding includig the test vehicle used, chemical mechanical planarization.
Technical Paper
Sponsor
DELO Industrial Adhesives
Image Sensor Packaging: 5 Key Challenges Solved
Filter glass sealing, CTE mismatch, fine-pitch processing, warpage control, and outgassing – learn about AEC-Q100-compliant adhesives for automotive image sensor packaging.
DELO Industrial Adhesives
AI Data Centers Make Power, Cooling Critical to Scaling
AI is reshaping data centers into strategic infrastructure, making power, cooling, networking, memory bandwidth and advanced packaging critical. Rack-level design, HBM, chiplets and energy efficiency now drive AI deployment and chip competition.
EE Times
Tech to Replace Animal Testing Is Almost Ready. Scientists Are Not
New approach methodologies are gaining ground as regulators increasingly accept organ chips, human-cell systems and computer models in drug development. However, researchers still face major challenges in validating, standardizing & comparing these alternatives with animal testing.
IEEE Spectrum
Sponsor
BEST Inc.
Unlock the Potential of Salvaged Devices
Component harvesting is a reliable method of electronic component reclamation, reducing e-waste and ensuring economic reuse for automated assembly.
BEST Inc.
Amazon to invest NT$1.59 billion in Taiwan's Gold Circuit
Amazon will invest US$49.9 million in Taiwan's Gold Circuit Electronics through a private placement, while the PCB maker plans a US$248 million new plant. The investment supports growing demand for high-end multilayer PCBs used in AI data centers.
Taiwan News
Bending Strength of Solder Joints as a Function of Joint Length
The effect of joint length on the fracture of copper-solder-copper joints is investigated using double cantilever-beam specimens of various joint lengths.
Technical Paper
India targets 40% domestic value addition in electronics manufacturing
India plans to lift domestic value addition in mobile manufacturing from 22–23% to 35–40% by expanding component production. Incentives for components, semiconductors and suppliers aim to shift the industry beyond assembly toward a stronger, more resilient electronics ecosystem.
Global Sources
Gartner Predicts 70% of Enterprises Will Abandon Agentic AI Built by Vendor Forward-Deployed Engineering by 2028
Gartner predicts 70% of enterprises will abandon vendor-built agentic AI by 2028 as costs rise and systems become difficult to evolve. It urges leaders to establish clear governance, ownership, knowledge transfer and exit strategies from the outset.
Gartner
Sponsor
Smart Sonic
Safe and Effective Cleaning with 440-R
Not consumed during the stencil cleaning process so there is no need to monitor concentration. Simply replace with fresh solution every 4-6 weeks. Learn more.
Smart Sonic
Apple's foldable iPhone puts precision manufacturing and laser technology to the test
Litilit is scaling femtosecond laser production for OLED, semiconductor and consumer electronics markets. Its heat-free precision protects delicate components, while automated, modular designs target growth from 1,000 to 3,000 lasers annually.
Robotics and Automation News
Today's Sponsor
Sponsor
Sponsor
Circuit Technology Center
40+ Years of PCB Repair Expertise
CircuitMedic provides circuit board repair kits, tools and materials developed from decades of hands-on PCB repair experience. Find the right solution for your repair needs.
Circuit Technology Center
Test Your Knowledge
What is the main metal used in making pennies?
See answer below.
Industry Press
Indium Corporation Expert to Examine Formic Acid Soldering at PCB West
Indium Corporation® Senior Applications Development Engineer, Engineered Solder Materials (ESM), Ryan Mayberry will discuss formic acid soldering and its rise ...
Indium Corporation
Inovaxe to Showcase LS350 Smart Rack at SMTA Long Island Expo
Inovaxe will exhibit at the SMTA Long Island Expo on Thursday, October 1, 2026. The company will feature its Line Side Model LS350 Smart Rack, a mobile storage ...
Inovaxe Corporation
RBB Adds Second Shift to Expand Production Capacity
RBB is pleased to announce that it has expanded its production capabilities with the launch of a second manufacturing shift, effective September 21, 2026. ...
RBB
PVA to Showcase DeltaFlex™ at The ASSEMBLY Show 2026
PVA will showcase a range of coating, dispensing and automation technologies at The ASSEMBLY Show, October 27-29, 2026, at the Donald E. Stephens Convention ...
Precision Valve & Automation PVA
IPTE expands PCB depaneling portfolio with new MultiRouter platform
IPTE announces the launch of the MultiRouter, a new offline PCB depaneling platform designed to combine high precision, configurable routing and sawing ...
IPTE LLC
Comtree, Inc. to Highlight Kurtz Ersa Soldering and Rework Solutions at EPTECH Kitchener
Kurtz Ersa Inc. announces that its long-time Canadian representative, Comtree, Inc., will exhibit at the EPTECH Show in Kitchener, Ontario, on September 30, 2026, ...
Kurtz Ersa North America
Panasonic Connect to Introduce Arcova™ Welding Solutions at FABTECH 2026
Manufacturers across North America are accelerating adoption of automation technologies to address persistent labor shortages and increasing production ...
Panasonic Connect
MORE INDUSTRY PRESS
SMTA Mexico October 8
Sponsor
Air-Vac Engineering
High Precision Component Milling
Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies.
Air-Vac Engineering
Quote of the Day
"Nearly all men can stand adversity, but if you want to test a man's character, give him power."
Abraham Lincoln
Sponsor
Summit Interconnect
Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect
Co. Overview
Cartoon of the Day
Cartoon
"Bring Someone Else's Child To Work Day. You wouldn't want your own kid to see what you go through every day!"
Copyright © Randy Glasbergen
Sponsor
Heller Industries
Eliminate Voids for High-Reliability Applications
Voids compromise reliability. Achieve near zero-voiding with our vacuum reflow for automotive, micro-bumping, and advanced electronics. Send your boards to see the results.
Heller Industries
Advanced Plating Tool
Test Your Knowledge Answer
What is the main metal used in making pennies?
Answer: Zinc