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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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Ask the Experts
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Components Jumping Around During Reflow
We reflowed a set of boards using a lead-free solder process and had issues with components jumping around from their initial placed position. We then changed ...
Responses by:
Brian Smith General Manager - Electronic Assembly Americas, DEK International Peter Biocca Senior Market Development Engineer, Kester T.J. Hughes Manufacturing Engineer, Esterline Interface Technologies Fred Dimock Manager, Process Technology, BTU International Gary Freedman President, Colab Engineering
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MORE ASK THE EXPERTS
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What Year Was It?
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War in Iraq Begins
The United States, along with coalition forces primarily from the United Kingdom, initiates war on Iraq.
See the answer below.
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Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
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What Year Was It Answer
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War in Iraq Begins Answer: March 19, 2003
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March 19, 2026
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The Electronics Industry Prepares for 'Verified Sustainability' in 2026
Consumer electronics firms face rising pressure to prove sustainability claims with verified data. EU regulations, digital product passports, and investor and consumer scrutiny are driving a shift toward circularity, forcing companies to embed transparency across product lifecycles.
EE Times
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High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability and reduces energy use up to 15%.
Indium Corporation
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How China is getting everyone on OpenClaw, from gearheads to grandmas
China is rapidly driving adoption of OpenClaw, with tech giants like Baidu and Tencent hosting public events as users embrace its automation power. While boosting productivity and "one-person companies," authorities warn of security risks and tighten controls in sensitive sectors.
CNBC
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Built to Scale. Proven in Production.
Microsystems World CNC boosted throughput and automation by trading up to a complete inline SMT solution—powered by Manncorp and designed for long-term growth.
Manncorp Inc.
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ENIAC, the First General-Purpose Digital Computer, Turns 80
ENIAC, unveiled in 1946, revolutionized computing with its electronic, programmable design, enabling high-speed calculations for wartime needs. Its success launched the modern computing industry, driving decades of innovation & establishing the foundation for today's digital economy.
IEEE Spectrum
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Reexamination of Thermal Cycling Reliablity of BGA Components
A direct comparison was conducted between SnPb and lead-free solder joints focused on long-term thermal cycling reliability after being exposed to high-temperature aging for a long period of time using two test vehicle designs.
Technical Paper
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Samsung and AMD to partner as workers mull strike
Samsung Electronics agreed to supply AMD with next-generation HBM4 memory for MI455X AI accelerators and collaborate on future technologies. It plans longer chip contracts to stabilize supply, even as rising demand, shortages, and potential worker strikes threaten production.
Taipei Times
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Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK
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Is Ethernet Actually More Reliable Than Wi-Fi?
Ethernet delivers faster, more stable internet than Wi-Fi, offering lower latency and fewer dropouts. While modern Wi-Fi provides flexibility and mobility, wired connections remain the best choice for reliability and peak speeds, especially for gaming, PCs & performance-critical devices.
BGR
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The perfect protection for your electronics
Rehm's ProtectoXP and ProtectoXC systems offer flexible, high-quality coating solutions that shield electronics from moisture, corrosion, and other environmental damage.
Rehm Thermal Systems
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One Billion Cellular IoT LPWAN Connections
The global telecom sector reached 1 billion NB-IoT and LTE-M connections by 2025, marking cellular IoT’s maturity. Industry collaboration enabled scalable deployments, while emerging 5G eRedCap technology and eSIM adoption are set to drive the next phase of IoT growth.
EE Times
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Taiwan's Emerging Power Electronics Strategy in the AI Era
Taiwan is expanding beyond digital logic by advancing power electronics, leveraging SiC and GaN technologies, strong packaging expertise, and policy support to build an integrated ecosystem that boosts energy efficiency across EVs, renewables, and AI-driven data centers.
EE Times
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How Meta's Manus acquisition ignited a new tech war
Meta's $2 billion Manus acquisition faces collapse as Chinese regulators probe alleged "Singapore washing" and illegal AI transfers. Rising geopolitical tensions, U.S. scrutiny, and internal pressures threaten the deal, underscoring growing global barriers to cross-border AI expansion.
Digitimes
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No chip supply shortage: SEMI
SEMI Taiwan says chipmakers face no immediate material shortages despite the Middle East conflict, as diversified sourcing secure helium supply. However, rising raw material costs threaten margins, prompting firms to strengthen supply chains and accelerate renewable energy adoption.
Taipei Times
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AI Ushers In the Age of No-Compromise Gaming
AI-powered super-resolution tools like AMD's FSR Redstone and Nvidia's DLSS 4.5 remove the tradeoff between FPS and visual quality. By blending upscaling, frame generation, and ray enhancements, they enable smoother gameplay and more immersive experiences.
EE Times
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Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD
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| Today's Sponsor |
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Discover the power of vAI ProVision from Viscom
Create and optimize 3D AOI and AXI programs in minutes. vAI ProVision boosts inspection depth, quality, and speed. Viscom develops & produces premium inspection systems.
Viscom SE
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Test Your Knowledge
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What yellow, fossilized resin did the Greeks and Romans use in jewelry?
See answer below.
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Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
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Quote of the Day
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"Expecting the world to treat you fairly because you are a good person is a little like expecting the bull not to attack you beause you're a vegetarian." Dennis Wholey
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The "Fried Egg" Effect in Soldering
Burnt-on flux residue that is visible on the solder mask of PCBs after improper reflow settings produces significant challenges to the reliability of finished boards.
KYZEN
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| Cartoon of the Day
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"There's going to be a lot of finger pointing around here and I'd like to put you in charge. You have exquisite hands."
Copyright © Randy Glasbergen
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One Part, Thermally Conductive Epoxy
Master Bond EP3UF is an electrically insulative, thermally conductive adhesive that passes NASA low outgassing tests and can be used for bonding and underfill applications.
Master Bond
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Test Your Knowledge Answer
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What yellow, fossilized resin did the Greeks and Romans use in jewelry? Answer: Amber
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