circuitnet
Sponsor
Plasmatreat GmbH
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
Ask the Experts
Competing Reflow Oven Zones
We have an 8 zone reflow oven in our SMT production line. We recently purchased an oven profiler and I'm having some issues with our tin lead process. There is a fairly ...
Responses by:
Richard D. Stadem
Advanced Engineer/Scientist, General Dynamics
Fred Dimock
Manager, Process Technology, BTU International
Carlos Bouras
General Manager, Nordson SELECT
Tim O'Neill
Director of Product Management, AIM
Bjorn Dahle
President, inspīre solutions LLC
Tony Lentz
Field Applications, FCT Assembly
Georgian Simion
Engineering and Operations Management, Independent Consultant
Richard Burke
National Sales Manager, Datapaq
Rick Kompelien
Principal Product Engineer, Benchmark Electronics, Inc.
Mark Waterman
M.O.L.E. Line Product Manager, Electronic Controls Design, Inc. (ECD)
Paul Austen
Senior Project Engineer, Electronic Controls Design Inc
Kevin Pigeon
Senior Applications Manager, AIM Solder
■ Confused About IPC-A-610 Class 2 vs. Class 3
■ Burned Chip Repair
■ Idle Wave Solder Temperature
■ IPC 610 Class 3 with Missing Non-functional BGA Pads
■ BGA Component Cleaning Spec
MORE ASK THE EXPERTS
SMT Wastewater Treatment
Sponsor
SEHO Systems GmbH
Simply Double the Production Volume
SEHO SelectLine features the award-winning Synchro and SmartSplit production modes that allow to halve cycle times in batch production and mixed operation. Find out more.
SEHO Systems GmbH
Industry Calendar
■ Apr 5, 2027: APEX EXPO 2027
■ Apr 13, 2027: Symposium on Counterfeit Parts and Materials - UK
■ Aug 12, 2027: High Reliability Cleaning and Conformal Coating Conference
FULL INDUSTRY CALENDAR
Introducing New Board-to-Board Connectors
Sponsor
DL Technology
EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
What Year Was It?
The day was Oct 29. What year was it?
John Glenn Returns to Space
What Year
Nearly four decades after he became the first American to orbit the Earth, Senator John Hershel Glenn, Jr., is launched into space again as a payload specialist aboard the space shuttle Discovery.
See the answer below.
Sponsor
Viscom SE
iX7059 SMT Edition: Next-Gen 3D X-ray
Experience high-precision inline 3D X-ray inspection by Viscom with AI-powered defect detection, exceptional image quality, and reliable performance for complex SMT assemblies.
Viscom SE
Die Module Attach (static)
What Year Was It Answer
John Glenn Returns to Space
Answer: October 29, 1998
Oct 29, 2026
image
Excess Electronic Components Could be Someone Else's Supply
AI-driven demand is tightening component supplies, extending lead times and raising prices. Analysts urge procurement teams to tap surplus inventory from cancelled orders, revised forecasts & obsolete designs to secure parts & ease shortages across electronics manufacturing.
Sourceability
Sponsor
Master Bond
Optically Clear Nanosilica Filled Epoxy
Master Bond EP4NS-80 is a low viscosity epoxy for bonding and sealing that possesses excellent dimensional stability, low CTE and minimal shrinkage upon curing.
Master Bond
Intel Wants a Quantum Business, Classiq Could Help Build One
Intel plans to acquire Classiq to bring its quantum computing research to market, combining quantum hardware, control electronics and software with enterprise algorithm design. The deal positions Intel to pursue commercial opportunities across diverse quantum platforms.
EE Times
Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses
Intentional contamination of PWBs offers a practical and controlled approach for evaluating cleanliness analysis techniques and for developing meaningful and effective cleanliness guidelines.
Technical Paper
North American EMS Orders Climb Despite Lower September Shipments
The Global Electronics Association reports a 1.68 EMS book-to-bill ratio for September 2026, as bookings rose 41.7% year over year while shipments fell 10.8%. Year-to-date bookings climbed 19.3%, signaling strong demand and longer lead times.
Global Electronics Association
Sponsor
Plasma Etch
3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch
Samsung Electronics shares slid despite record profit in the third-quarter
Samsung Electronics reported record fourth-quarter-like performance for a fourth consecutive quarter, driven by booming AI memory demand, with semiconductor profits surging. Shares fell 4.13% as investors questioned valuation and the company's growing reliance on memory chips.
CNBC
Is Baking Required After Water Cleaning?
Do circuit board assemblies need to be baked after routine aqueous cleaning? If so, how long and at what temperature?
Board Talk
Technical Papers

■ 5 Major Challenges in Image Sensor Packaging and How to Solve Them
■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible
■ Oxide Reduction for Reliable Electronics Manufacturing
■ UHDI Fabrication for IC Substrates: SAP and mSAP Processes
■ Flux-Free, Reliable, Efficient: Soldering with Formic Acid
■ Redesigning Material Logistics for High-Mix EMS Production
■ Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education
■ Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
MORE TECHNICAL PAPERS
Sponsor
Circuit Technology Center
Professional BGA Component Reballing
Need to restore a BGA component? Our controlled reballing process includes solder ball removal, precision reballing, custom fixtures, and rigorous inspection for reliable results.
Circuit Technology Center
Hands-on with Apple's first touchscreen laptop: Touch is totally optional
Apple unveiled its first touchscreen MacBook Pro models, pairing tandem OLED displays, Dynamic Island and illuminated logos with optional touch controls. The macOS laptops retain keyboards and trackpads, targeting creators and professionals seeking better display quality.
CNBC
Gartner Predicts 30% of Employees Replaced by AI Will Be Rehired by 2029 if Organizations Don’t Overhaul Workforce Planning
Gartner reports that only 19% of organizations plan workforces effectively around AI and business goals. Its new framework prioritizes enterprise strategy before workforce decisions, helping leaders align talent and technology to improve revenue and cost performance.
Gartner
Computed Tomography on Electronic Components
The combination of improved computers, detectors, and new software has allowed the addition of a fourth dimension to a computed tomography data set.
Technical Paper
Sponsor
Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Systems Thinking Is Vital in the Age of AI
AI is reshaping engineering by helping professionals explore designs, analyze research, and test solutions. Engineers must combine AI capabilities with human judgment, specialist expertise, systems thinking, and adaptability to ensure safe, and practical, responsible outcomes.
IEEE Spectrum
Gartner says only 3% of organizations are getting AI cost savings from productivity, yet 85% plan to spend more
Gartner reports only 3% of organizations exceed AI cost-saving targets through productivity gains, despite widespread executive optimism. With 38% overspending and 85% planning increased investment, businesses must clarify AI goals and redirect saved employee time.
TechSpot
Is Cleaning Critical to POP Assemblies?
Paper addresses the cleanliness level of package-on-package assemblies including underneath package-on-package components.
Technical Paper
Sponsor
DELO Industrial Adhesives
5 Major Challenges in Image Sensor Packaging and How to Solve Them
Filter glass sealing, CTE mismatch, fine-pitch processing, warpage control, and outgassing – learn about AEC-Q100-compliant adhesives for automotive image sensor packaging.
DELO Industrial Adhesives
iPhone Duo vs. Pixel 11 Pro Fold: Which Foldable Is Right For You?
Apple's iPhone Duo emphasizes widescreen entertainment, compact design and refined software, while Google's Pixel 11 Pro Fold delivers camera versatility and multitasking. Both cost about $1,900 but target different preferences in the growing foldable-phone market.
BGR
Metal-free magnetic sensor can be safely implanted for wireless monitoring
Researchers have developed a biocompatible, metal-free magnet that enables wireless heart monitoring through implanted sensors. Tested in pigs, the biodegradable patch accurately measured cardiac function before gradually breaking down into nontoxic molecules.
Phys.org
Sponsor
AI Technology, Inc.
AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives
240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity.
AI Technology, Inc.
Google alters its cloud playbook, enlisting partners to sell more AI chips
Google is expanding its AI chip business by partnering with Oracle to offer TPUs externally, challenging Nvidia's dominance. Strong demand from Anthropic and OpenAI could boost revenue, although lower margins and infrastructure demands pose challenges for future growth.
CNBC
Stereo Vision Based Automated Solder Ball Height Detection
An automatic, stereo vision based, in-line ball height inspection method is presented. This includes an imaging setup with a computer vision algorithm.
Technical Paper
New growth drivers, policy push raise industrial profits
China's industrial profits rose 15.5% to 6.03 trillion yuan in the first three quarters of 2026, driven by booming electronics and high-tech manufacturing. Officials urged stronger domestic demand & continued technological upgrades to sustain growth & address sectoral weaknesses.
China Daily
Electronics, high-tech manufacturing drive double-digit growth in China's industrial profits
China's major industrial firms increased profits 15.5% to 6.03 trillion yuan in the first nine months of 2026, driven by booming electronics and high-tech manufacturing, as surging AI and data center demand accelerated industrial growth.
China Daily
Sponsor
Uyemura
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Your Samsung TV Could Allegedly Use Other Bluetooth Devices To Listen To You - Here's How
Samsung smart TVs may share users' device activity with third parties, according to a security analyst. Many consumers unknowingly accept tracking terms by skipping lengthy agreements, raising privacy concerns about how technology companies collect and use personal data.
BGR
Today's Sponsor
Sponsor
Sponsor
ECD
Vapor Phase Profiling
Thermal profiling the vapor phase soldering process — especially those with vacuum — is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
Test Your Knowledge
List the date of these inventions in chronological order: Nylon, Stainless Steel, Plastics
See answer below.
Industry Press
Rehm Thermal Systems Introduces Vision RCC
Rehm Thermal Systems has launched the new Vision RCC, an innovative reflow soldering system specifically developed to meet the requirements of heavy and complex ...
Rehm Thermal Systems GmbH
TRI Receives the 2026 Global Technology Award for AI Verify Host
Test Research, Inc. announces that the company's AI-Powered Repair Station, AI Verify Host, received a 2026 Global Technology Award in the Software Process ...
Test Research, Inc.
KYZEN's MICRONOX® MX2123 Earns Global Technology Award for Cleaning Materials
KYZEN is proud to announce that its MICRONOX® MX2123 was honored with a 2026 Global Technology Award in the Cleaning Materials category. The award was ...
Kyzen Corporation
AI is splitting the PCB industry in two
The printed circuit board industry closed 2025 at about $88 billion in revenue, and a conservative forecast puts it at $140 billion by 2031, following an 8.1% CAGR. ...
YOLE Group
BW Packaging expands Hayssen portfolio with new X650 long-dwell flow wrapper
BW Packaging, Barry-Wehmiller's packaging machinery business, has unveiled the Hayssen X650, a long-dwell, bottom-fed flow wrapper engineered to help manufacturers ...
BW Packaging
Essemtec Opens New U.S. Headquarters and Advanced Demo Center in Greater Boston
Essemtec is proud to announce the official opening of its new U.S. Headquarters and Customer Demonstration Center in Woburn, Massachusetts. The milestone was ...
Essemtec AG
MORE INDUSTRY PRESS
Semicon Europa
Sponsor
AIM Solder
Beat Rising Silver Prices with AIM REL61™ lead-free alloy
With silver at historic levels, there's never been a better time to switch. Reduce material costs significantly while maintaining the reliability your applications demand.
AIM Solder
Quote of the Day
Following a precedent is an easy substitute for thinking.
Anonymous
Sponsor
Glenbrook Technologies
Probe Card Manufacturer 'Sees the Unseen' With X-ray
Probe card manufacturer relies on mobile real-time x-ray inspection to verify the quality of its aligned probes at different stages along the assembly line.
Glenbrook Technologies
Full-Rotation X-Ray Imaging
Cartoon of the Day
Cartoon
"You've been losing market share for years, profits and stock values have plummeted, and you've lost your way. What this company needs now is a good old fashioned Capitalist Pig!"
Copyright © Randy Glasbergen
Sponsor
BEST Inc
Boost Reballing with EZReball Preforms
EZReball reballing preforms provide fast, clean, and accurate reballing of complex BGA packages while eliminating traditional complexities and the need for operator dexterity.
BEST Inc
AI-Driven Innovation
Test Your Knowledge Answer
List the date of these inventions in chronological order: Nylon, Stainless Steel, Plastics
Answer: Plastics 1868, Stainless Steel 1913, Nylon 1938