circuitnet
Sponsor
ECD

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
Ask the Experts
Challenge Wetting Solder to Brass Pins
In our production we have a product with a connector. The connector pins are made of brass, and tin plated. Unfortunately, the connector pin plating is made by ...
Responses by:
Georgian Simion
Engineering and Operations Management, Independent Consultant
Jerry Karp
President, JSK Associates
John De Leeuw
Manufacturing Process Engineer, TE SubCom
Carlos Bouras
General Manager, Nordson SELECT
Gregory Arslanian
Global Segment Manager, Air Products & Chemicals, Inc.
Kevin Mobley
PCBA Engineering Liaison, General Atomics Electromagnetic Systems Group
Andres Rojas
Engineering Director / Master IPC Trainer (MIT), AMMSA Solutions
Raju Wagh
Senior Engineer SMT , Advance Power Display system Ltd Mumbai
Leo Lambert
Vice President, Technical Director, EPTAC Corporation
Tony Lentz
Field Applications, FCT Assembly
Brianna Anderson
Senior Process Engineer, Circuit Technology Center
Rick Kompelien
Principal Product Engineer, Benchmark Electronics, Inc.
Class 3 Cleaning Requirements
Mixing Different SAC305 Solders
Rework of Underfilled Array Packages
What Causes Solder Balls During Rework?
Advise and suggestions for assembly using 01005 capacitors.
Selective Printing for BGA Components
PCBA Transport Between Facilities
MORE ASK THE EXPERTS
Viscom
Sponsor
Zestron

Defluxing Ultra-Fine Pitch CoW Devices? Read This.
DI water falls short on copper pillar packages. Get proven cleaning parameters for CoW devices with <25μm pitch in our white paper.
ZESTRON Americas
Industry Calendar
Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA
Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMTA
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
Oct 1, 2026
Long Island Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Air-Vac-Engineering
Sponsor
Plasma-Etch

Contaminant Removal with Plasma
Plasma provides organics removal and other benefits to increase bond strength! Many chamber sizes available, all with a low environmental impact. Learn more.
Plasma Etch
What Year Was It?
Building of Hoover Dam Begins
What Year
Construction of the Hoover Dam begins. Over the next five years, a total of 21,000 men would work ceaselessly to produce what would be the largest dam of its time.
See the answer below.
Sponsor
Viscom-SE

vCONNECT: Your Next Level of Digital Connectivity
Discover vCONNECT: Analyze inspection data, monitor machine performance, predict maintenance needs, store data securely and access AI tools and the latest Viscom News.
Viscom SE
EOS-ESDA-Association
What Year Was It Answer
Building of Hoover Dam Begins
Answer: July 7, 1930
July 7, 2026
image
9 Features Exclusive To Foldable Phones
Foldable phones combine innovative designs with practical features, offering tablet-like multitasking, enhanced productivity, versatile cameras, and convenient cover screens. Despite their premium prices, growing adoption and expanding options from Samsung, Google, and Motorola make foldables an increasingly appealing smartphone choice.
BGR
Sponsor
Master-Bond

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond
Foxconn reports 40% quarterly sales jump, driven by cloud and AI server revenue
Foxconn reported record second-quarter 2026 revenue of $78.7 billion, driven by surging AI server demand rather than iPhone production. Strong growth underscores booming AI infrastructure spending, while geopolitical tensions and US-China trade risks remain key challenges for the manufacturing giant.
Crypto Briefing
Scaling SMT Traceability
High-mix electronics manufacturing requires precise material control. This whitepaper explains how Tecnimaster improved traceability, inventory accuracy and picking efficiency through integrated automated storage and reel-level tracking.
Technical Paper
What Does CE Stand For On Electronics?
The CE mark confirms that products sold in the European Economic Area meet EU safety, health, and environmental standards. Manufacturers must complete compliance assessments before using it, while consumers should remain alert for fake CE markings on unverified products sold online.
BGR
Sponsor
Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Automotive Power Electronics Market Size Forecast to USD 19.4 Billion by 2036 | Top Companies are Infineon Technologies AG, Robert Bosch GmbH and more
The global automotive power electronics market is set to grow from US$5.1 billion in 2025 to US$19.4 billion by 2036, driven by rising electric vehicle adoption, advanced SiC and GaN semiconductors, and increasing demand for efficient power management and autonomous vehicle technologies.
Open PR
How X-Ray Technology is Improving the Electronics Assembly Process
X-ray inspection of electronic components is now standard practice for any company working in the electronics industry.
Technical Paper
Technical Papers
Flux-Free, Reliable, Efficient: Soldering with Formic Acid
Redesigning Material Logistics for High-Mix EMS Production
Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education
Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse
Digital Warehouse Automation in High-Mix PCB Assembly
Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses
Scaling SMT Traceability
The Drawbacks of Internal Recycling Systems for Solder Dross
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
MORE TECHNICAL PAPERS
Sponsor
Nordson-ASYMTEK

Get the Revisiting Underfill Handbook
Today's underfill applications are constantly evolving. As chip populations increase, dispensing applications must deliver smaller amounts of fluid with precision. Read this handbook.
Nordson Electronics Solutions
Where Robots and Engineers Build India’s Smart Displays
Online Instruments’ Dobbaspet facility manufactures interactive displays every two minutes through nearly 70 production and quality checks. India’s first CKD plant for interactive displays strengthens domestic electronics manufacturing, supports the Make in India initiative, and reduces reliance on imported finished products.
Deccan Chronicle
Taiwan semiconductor suppliers are moving to the US, creating new opportunities
TechForce Robotics partnered with Taiwan's JJ Enterprise to strengthen its semiconductor automation capabilities as chip manufacturing shifts toward the United States. The alliance positions the company to support AI-driven demand and expanding North American semiconductor production amid broader supply chain relocation.
EP&T
Adhesive Bonding of Polymeric Substrates Through Plasma Treatment
This study assesses the effect of atmospheric plasma treatment used with compressed air. and te effect of plasma surface treatment on adhesive bond strength.
Technical Paper
Sponsor
Manncorp

Turnkey Lines: In-Stock & Ready
In-stock, fully integrated SMT lines with Manncorp's U.S.-based support. Skip the wait, cut lead times, and get your operation producing sooner.
Manncorp Inc.
Why strategy has become the defining question for Europe's EMS industry
European electronics manufacturers are shifting from growth-focused strategies to resilience and long-term competitiveness as geopolitical risks, supply chain changes and global competition reshape the market. Industry leaders say companies must adopt diverse strategies, including specialization, digitalization and acquisitions, to remain competitive.
Evertiq
SEMI asks US government not to intervene in memory crisis
SEMI opposed government intervention in memory chip pricing and capacity, warning it could worsen the market downturn. Instead, it urged expanded tax incentives, long-term supply contracts and consumer credits, while forecasting rising AI-driven demand will intensify memory shortages across multiple industries.
Electronics Weekly
Cure for the Grape Effect
We are processing lead-free boards with large components. Our parts are showing the grape effect. What is the best solution for this?
Board Talk
Sponsor
DL-Technology

EZ-FLO High Precision Ceramic Dispense Tips
The ceramic molding process allows for smaller more precise inner diameters with a glass-like finish, giving you the ultimate control. Learn more.
DL Technology
How AI Is Transforming Electronics Assembly in Poland’s Smart Factories
AI is transforming Poland's electronics manufacturing by improving quality inspection, predictive maintenance, and production planning. As manufacturers embrace smart factory technologies, AI-driven automation enhances efficiency, strengthens supply chain resilience, and boosts competitiveness while complementing skilled human expertise.
The AI Journal
Electronics: The assembly boom, the component gap
India’s electronics exports reached a record $48 billion in FY26, led by booming smartphone shipments. However, heavy reliance on imported components keeps domestic value addition low, prompting the government to expand manufacturing from assembly to components, equipment and materials.
Financial Express
Sponsor
BEST-Inc.

Training for Certified IPC Specialists
BEST's 7711 Training Rework Kit is designed for certification/re-certification of Certified IPC Specialists (CIS) so employees can be tested for speed, accuracy and quality.
BEST Inc
World Capacitor Assemblies - Market Analysis, Forecast, Size, Trends and Insights
The global capacitor assemblies market is poised for steady growth through 2035 as renewable energy, EV charging, and industrial automation boost demand. Asia-Pacific will remain dominant, while digital procurement, recurring replacement demand, and regional supply diversification reshape industry growth.
IndexBox
Reliability in Low Temperature Soldering for BGA Components
The adoption of LTS presents compatibility challenges. This study explores the reliability of different ball-paste combinations for LTS soldering.
Technical Paper
Why enterprise AI in manufacturing is stuck at the pilot stage
Industry leaders from Taiwan's TPIsoftware, the Institute for Information Industry, and Phison Electronics said manufacturers must look beyond AI model performance. They stressed that successful large-scale AI adoption depends on strong data governance, seamless system integration, and practical implementation across production processes.
Digitimes
Miniaturized Electronics Market Study Explores Industry Growth Toward $75.31 Billion
Miniaturized electronics demand continues to accelerate, with the global market projected to reach $75.31 billion by 2030 at an 8% CAGR. Growth stems from automotive, healthcare, IoT, and wearable technologies, while innovations, strategic acquisitions, and advanced compact components drive industry expansion.
Open PR
Sponsor
Schunk

Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK
Flexible Barrier Films for Electronics Market to Reach US$ 1,104.4 Mn by 2033 Driven by Rapid Growth in Flexible Electronics and Semiconductor Manufacturing
The flexible barrier films for electronics market is set to grow from US$400.3 million in 2026 to US$1.1 billion by 2033, driven by rising demand for flexible displays, semiconductors, wearable devices, and government-backed electronics manufacturing investments worldwide.
Yahoo Finance
Today's Sponsor
Ormet-TLPS
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
Test Your Knowledge
What color does litmus paper turn if a solution is acidic?
See answer below.
Industry Press
CE3S Brings Back Free ANSI/ESD S20.20 Training Series with Desco Industries
Cumberland Electronics Strategic Supply Solutions (CE3S) in partnership with Desco Industries Inc., will host its next free ANSI/ESD S20.20 training series throughout ...
Cumberland Electronics Strategic Supply Solutions
Saelig Introduces Micsig MHO 6 Series 12-bit 1GHz 8-ch Oscilloscopes
Micsig's MHO6 Series 12-bit oscilloscopes deliver up to 1GHz bandwidth, 8 channels, and 6GSa/s sampling for precise, high-speed signal analysis in advanced electronics testing.
Saelig Co. Inc.
The Test Connection, Inc. Becomes First Test Engineering Company in Space
TTCI supports Capitol Technology University's NASA ODIN rocket mission with design reviews, electrical testing, and assembly expertise to improve payload reliability and mission success.
The Test Connection, Inc.
Absolute EMS Helps Customers Meet SWaP-C Demands
Absolute EMS helps customers meet SWaP-C goals with advanced miniaturization, precision assembly, and smart factory manufacturing for smaller, lighter, more efficient, and reliable electronics.
Absolute EMS
NETZSCH Highlights NEMO® Dispensers
NETZSCH's NEMO® Dispenser delivers precise, valve-free dispensing of adhesives, sealants, solder paste, and other high-viscosity materials for electronics manufacturing applications.
NETZSCH Pumps USA
Metal Etch Services Installs First NEVIS Stencil Laser System in the U.S.
Metal Etch Services installed the first NEVIS stencil laser system in the U.S., boosting stencil precision, production speed, and quality for advanced electronics manufacturing.
Metal Etch Services, Inc.
Mycronic appoints Peter Andries as General Manager of MRSI Systems
Mycronic appointed Peter Andries as General Manager of MRSI Systems and VP of Global Technologies to drive innovation, operational excellence, and global growth in die bonding solutions.
Mycronic
MORE INDUSTRY PRESS
Summit-Interconnect
Sponsor
Glenbrook-Technologies

X-ray Rentals & Rent-to-Own
Rent any of our machine models, with up to 3 months of rental costs applied toward purchasing X-ray equipment. Our flexible plan lets you test the system before committing to purchase.
Glenbrook Technologies
Quote of the Day
"There is no such thing in anyone's life as an unimportant day."
Alexander Woollcott
Sponsor
AI-Technology-Inc

TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology, Inc.
kyzen
Cartoon of the Day
Cartoon
"I want you to find a bold and innovative way to do everything exactly the same way it's been done for 25 years!"
Copyright © Randy Glasbergen
Sponsor
Circuit-Technology-Center

Improve PCB Repair Quality with 100+ Proven Rework Procedures
Access a collection of repair and rework procedures covering damage assessment, troubleshooting, conductor repair, pad replacement, BGA rework, and more.
Circuit Technology Center
Advanced-Interconnections
Test Your Knowledge Answer
What color does litmus paper turn if a solution is acidic?
Answer: Red. Litmus indicator solution turns red in acidic solutions and blue in alkaline solutions - and it turns purple in neutral solutions.