June 10, 2026

Intel Stock Jumps After Report Claims Google Ordered 3 Million AI Chips Intel is gaining traction as AI companies seek alternatives to TSMC's constrained chip capacity. Google reportedly plans a major TPU order with Intel, while Nvidia is evaluating its technology, signaling growing confidence in Intel's foundry comeback strategy & boosting investor optimism. TechSpot

Sponsor Vapor Phase Profiling Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more. ECD

The Apple Car Is Dead, and Waymo Just Bought Its Gravesite Waymo has acquired Apple's former Arizona autonomous vehicle testing facility for $220 million, repurposing the site to advance its Waymo Driver system. The purchase supports Waymo's rapid robotaxi expansion, fleet growth, and broader autonomous vehicle testing ambitions. Gizmodo

The Drawbacks of Internal Recycling Systems for Solder Dross This paper examines the risks and hidden costs of in-house solder dross recycling, highlighting contamination, compliance, quality, safety, and economic challenges that often outweigh perceived savings. Technical Paper

How JPL Keeps the 13-Year-Old Curiosity Rover Doing Science Thirteen years after its dramatic Mars landing, NASA's Curiosity rover continues delivering scientific discoveries, traveling 37 kilometers, analyzing 42 rocks, and capturing nearly 763,000 images. JPL engineers have sustained the aging rover through software updates. IEEE Spectrum

Sponsor Beat Rising Silver Prices with AIM REL61TM lead-free alloy With silver at historic levels, there's never been a better time to switch. Reduce material costs significantly while maintaining the reliability your applications demand. AIM Solder

GM eyes new battery chemistry to grow AI data center, energy storage business General Motors expands beyond EVs by developing sodium-ion batteries for grid-scale energy storage and advancing vehicle-to-grid services. It builds partnerships and charging programs to cut energy costs and tap rising AI data center demand. CNBC

Conformal Coating Prevention and Analysis of Resistor Silver Sulfide Corrosion This paper covers all the long-term test results as a follow-up to an earlier publication reporting interim results and preliminary conclusions. Physical analyses were completed to investigate possible differences in the failure mode at the various FoS test temperatures. Technical Paper

Technical Papers ■ Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You ■ Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse ■ Digital Warehouse Automation in High-Mix PCB Assembly ■ Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses ■ Scaling SMT Traceability ■ The Drawbacks of Internal Recycling Systems for Solder Dross ■ Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics ■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible ■ PCB Rework Evolves, With X-ray a Constant Support ■ How pH Cleaning Agents Affect Production Performance MORE TECHNICAL PAPERS

Sponsor Discover Real Operational Strategies from Proven Global Leaders In this 4-part series we asked three experienced global leaders for their insights on the biggest challenges faced by manufacturing operations today. No Registration required. Intraratio

Apple shares slide after big Siri AI reveal Apple shares fell over 3% after WWDC despite showcasing Apple Intelligence tools, upgraded Siri, and new AI developer frameworks. Analysts praised the updates but pointed to delayed rollouts, limited availability, and uncertain demand impact. CNBC

XENSIV™ TMR-based Sensors: Unlocking New Possibilities in Magnetic Sensing Infineon highlights tunnel magnetoresistance (TMR) sensing as a high-sensitivity, low-noise method for contactless position and current measurement, improving motion control, power conversion, and protection across consumer, industrial automotive systems. EE Times

Low Temperature SMT Solder Evaluation Recent advances in alloy "doping" have opened the door to revisit Sn/Bi alloys as a possible alternative to SAC-305 for many applications. Technical Paper

Sponsor AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives 240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity. AI Technology, Inc.

Beyond Dexterity: Why Contact May Define the Next Era of Robotics AGILINK's balloon-dog robot captivated ICRA 2026 attendees by mastering deformable-object manipulation, showcasing advances in motion and contact intelligence. OmniHand 3 Ultra-M adds enhanced tactile sensing and force control for complex real-world interactions. IEEE Spectrum

Beyond Smartphones: Electronics Firms Explore New Segments India's electronics manufacturers are moving beyond consumer device assembly into higher-value sectors defence aerospace healthcare automotive and industrial as firms like Dixon Syrma SGS Amber and Kaynes expand to boost margins design expertise. Electronics For You

Blow Holes After Switching from Lead-Free HASL to ENIG After switching our PCB finish from lead-free HASL to ENIG blow holes started occurring in the solder joints of the through-hole LEDs. The PCBs and LEDs are from the same suppliers as before, only the finish changed. Board Talk

Sponsor Plasma as a Key Technology Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma ® & PlasmaPlus®. Plasmatreat GmbH

As Chips Go Vertical, Metrology Struggles to Keep Up Chipmakers shift advanced manufacturing to complex 3D structures, pushing traditional inspection to limits. They adopt inline non-destructive metrology—fast AFM X-ray—to detect buried defects, improve control, and enable angstrom-scale production. EE Times

Why AI Wearables Are The Next Big Thing In Personal Tech Wearable AI is shaping up as the next consumer-tech battleground, with companies racing to embed smart assistants into glasses, earbuds and other devices. Success hinges on balancing AI power, battery life, usability and personalized commerce. Entrepreneur

Sponsor Maximize Yield with Patented Vacuum Reflow Heller's innovative, patented vacuum reflow solves the throughput bottleneck by shortening cycle times for maximum yield and minimal voiding. Experience the speed with us. Heller Industries

Apple introduces Siri AI, a profoundly more capable and personal assistant Apple unveiled Siri AI, rebuilt with Apple Intelligence, delivering conversational interaction, personal context awareness, and web answers. It enables cross-app actions, writing tools, and stronger privacy, with beta later this year features. Apple

A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability The industry standard for accelerated temperature cycling, IPC-9701B, defines test conditions for characterizing solder interconnect fatigue. The document specifies a maximum cycling ramp rate of 20 °C/minute to avoid thermal shock conditions that can accelerate failure modes other than low cycle fatigue in the bulk solder. Technical Paper

Study Shows AI Can Pass The Turing Test More Reliably Than Humans A new study found that OpenAI's GPT-4.5 fooled human judges in a Turing test 73% of the time, outperforming human participants in short text conversations. Researchers caution that the results depended on specific prompts and highlight growing concerns about AI-driven deception. BGR

SpaceX signs US$30bn data deal with Google Google agreed to pay SpaceX $920 million monthly for cloud computing through 2029, securing 110,000 Nvidia Corporation GPUs to meet surging AI demand, while adding termination clauses and reinforcing competition as SpaceX prepares a major IPO. Taipei Times

Sponsor Need Improved Solder Joint Visibility? Solder Peel-A-Wayš Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action. Advanced Interconnections Corp.

Apple puts parents back in control of kids' iPhone use Apple Apple unveiled parental controls at WWDC 2026 for children's iPhone use. New tools manage contacts, apps, websites, screen time, and content limits, plus developer APIs for iOS 27. and safety features. TechCrunch