circuitnet
Sponsor
ECD

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
Ask the Experts
Trays for MLS Baking
Is it acceptable to use glass trays for MSL integrated circuit baking? Is there a particular material recommended for MLS baking trays?
Responses by:
Richard D. Stadem
Advanced Engineer/Scientist, General Dynamics
Mark McMeen
VP Engineering Services, STI Electronics Inc.
Paul Austen
Senior Project Engineer, Electronic Controls Design Inc
Jerry Karp
President, JSK Associates
Controlling Creep Corrosion
Design Considerations and Impact on Assembly
BGA Placement Paste or Only Flux
BGA BAll Sheer Testing
Hand Soldering at Low Temperature
Spotting After DI Water Cleaning
Cause of Green/Blue Oxide Buildup
MORE ASK THE EXPERTS
Uyemura
Sponsor
Aim-Solder

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Viscosity is a useful solder paste quality control measurement, but rheology provides a more complete understanding of how paste will roll, fill, release, recover, and remain stable during stencil printing.
AIM Solder
Industry Calendar
Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA
Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMTA
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
Oct 1, 2026
Long Island Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Circuit-Technology-Center
Sponsor
Zestron

Is your PCB surface finish surviving the wash?
Aqueous cleaning can stain or strip ImSn, ImAg & ENIG finishes. Get test data on protecting surface finish integrity post-reflow.
ZESTRON Americas
What Year Was It?
First Roller Coaster in America Opens
What Year
The first roller coaster in America opens at Coney Island, in Brooklyn, New York. It traveled approximately six miles per hour and cost a nickel to ride.
See the answer below.
Sponsor
kyzen

Let our contract cleaning services help
If you have a technical cleaning question, or if you are facing process challenges or performance challenges, use this technical hotlist form to get help from a KYZEN Technical Care Expert.
KYZEN
Summit-Interconnect
What Year Was It Answer
First Roller Coaster in America Opens
Answer: June 16, 1884
June 16, 2026
image
The Numbers Don't Lie: Reading the Global EMS Data for 2025
Global EMS data shows AI-driven demand lifting markets while Europe falls 2.9% amid sharp West declines. Despite job cuts and insolvencies, 42% of firms lift margins, revealing a split industry balancing resilience with structural strain.
Global Electronics Association
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
PCB prices are up 40% in a month because of a material most people have never heard of
A shortage of high-purity PPE resin from Saudi Arabia's Jubail complex disrupts global PCB production, drives board prices higher, and tightens electronics supply chains. Analysts warn prolonged shortages could lift costs and delay output of critical tech hardware.
TechSpot
Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse
Component salvaging provides a reliable and consistent method of harvesting electronic components, reducing electronic waste, minimizing fabrication of new components, and ensuring economic reuse for automated assembly.
Technical Paper
Worldwide Server Market Revenue Surpasses $122 Billion in the First Quarter of 2026, Driven by AI Infrastructure Demand
IDC reports global server revenue hit $122.6B in 1Q26, up 30.4% YoY as AI infrastructure demand surges. GPU servers dominate 56% share, while supply constraints in DRAM and NAND limit growth. Non-x86 platforms gain rapidly worldwide driven by AI.
IDC
Sponsor
Viscom-SE

vCONNECT: Your Next Level of Digital Connectivity
Discover vCONNECT: Analyze inspection data, monitor machine performance, predict maintenance needs, store data securely and access AI tools and the latest Viscom News.
Viscom SE
Engineering Is Critical to Boosting Food Security
An IEEE smart agriculture report says meeting rising food demand will require integrated technologies like automation, sensing, data analytics, and digital twins. systems-level design to boost productivity, sustainability, and food security.
IEEE Spectrum
Reliability of Copper, Gold, Silver and PCC Wirebonds Under Operation
In this paper, a detailed study of the electrical and mechanical degradation of wirebonds under high temperature exposure is presented.
Technical Paper
Technical Papers
Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education
Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse
Digital Warehouse Automation in High-Mix PCB Assembly
Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses
Scaling SMT Traceability
The Drawbacks of Internal Recycling Systems for Solder Dross
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible
PCB Rework Evolves, With X-ray a Constant Support
MORE TECHNICAL PAPERS
Sponsor
Glenbrook-Technologies

X-Ray Inspection Verifies Quality of Complex PCBs
A Netherlands-based PCB supplier relies on real-time X-ray inspection to ensure the quality of HDI, hybrid, multi- layer, flex-rigid & other complex boards.
Glenbrook Technologies
Hon Hai partners with French firm on data centers
Foxconn and Schneider Electric are joining forces to build next-generation AI data centers, combining expertise in computing, manufacturing, and cooling. Their partnership aims to deliver energy-efficient, modular, standardized infrastructure that can scale to meet surging AI demand.
Taipei Times
Mark Zuckerberg Admits Meta 'Made Mistakes' as AI Reshapes 20% of Its Workforce
Meta CEO Mark Zuckerberg acknowledged mistakes during a major restructuring that cut 8,000 jobs and shifted 7,000 employees into AI roles. He pledged no further layoffs in 2026 while boosting employee programs as Meta sharply increases AI investment.
Entrepreneur
Adiabatic & Isothermal Humidification for Electronics Manufacturing
The need for including humidification into a well-rounded electronics manufacturing facilities’ ESD program is discussed.
Technical Paper
Sponsor
Manncorp

Outsourcing Costs More Than You Think
Delays, tariffs, and uncertainty come with overseas PCB assembly. In-house production with Manncorp delivers faster builds, tighter control, and long-term stability.
Manncorp Inc.
This Study On Gen Z Smartphone Users Debunks A Generational Smartphone Myth
Gen Z may not be as phone-averse as stereotypes suggest. A survey found most are comfortable calling friends and family, though many hesitate to contact strangers. The findings challenge common myths while highlighting how Gen Z adapts communication habits to modern technology.
BGR
This 1976 University Experiment Spun Up the U.S. Wind Industry
Half a century ago, University of Massachusetts Amherst engineers proved wind power’s potential with the experimental "Wind Furnace" turbine. The project helped launch the modern wind industry, inspiring innovations that transformed renewable energy into a global power source.
IEEE Spectrum
Maximum Board Temperature During Tin-Lead
IPC discusses the maximum top-side board temperature for BGAs to be 150 degrees C during a tin-lead wave solder. How is this temperature was determined?
Board Talk
Sponsor
Air-Vac-Engineering

Removal/Milling of Underfilled Parts: AVX1000M
High precision milling with zero adjacent clearance. Auto laser height measurement of board and component. Learn more.
Air-Vac Engineering
Gartner Says There is an Outsized Need for AI Talent in Supply Chain
Gartner reports a 387% surge in demand for AI-skilled supply chain professionals since early 2023, far outpacing overall job growth. The trend is widening talent shortages, raising hiring costs, and prompting organizations to invest in upskilling and entry-level talent development.
Garter
Why Orbital Data Centers Are Harder Than Silicon Valley Thinks
Companies Nvidia, SpaceX and Google invest in space-based data centers, but analysts say harsh orbital physics make them far costlier than Earth systems. Cooling radiation, and power limits persist, though they aid satellite data and collision avoidance.
IEEE Spectrum
Sponsor
BEST-Inc.

Training for Certified IPC Specialists
BEST's 7711 Training Rework Kit is designed for certification/re-certification of Certified IPC Specialists (CIS) so employees can be tested for speed, accuracy and quality.
BEST Inc
How Multi-Sense Technologies Are Redefining Human-Machine Interfaces and Dexterous Robotics
Multi-sense sensing technology merges touch, proximity, hover, inductive, and liquid-level detection into a single low-power platform, simplifying appliance design today while enabling compact highly sensitive tactile systems for humanoid robot hands.
EE Times
Impact of BGA Escape Trace Design on Performance of Solder Joint
In this paper, a comprehensive study is presented to demonstrate the impact of different BGA escaping trace design cases on solder joint reliability.
Technical Paper
SpaceX stock jumps 20% in first full day of trading after record debut
SpaceX shares surged 20% after IPO pushed valuation above $2 trillion. Elon Musk forecasts trillion-dollar revenue while analysts split on losses and spending. Supporters cite dominance in launches, Starlink, and space AI infrastructure.
CNBC
What's The Difference Between Wi-Fi And Bluetooth?
Wi-Fi and Bluetooth power today’s wireless connectivity. Wi-Fi delivers high-speed, long-range internet and multi-device networking, while Bluetooth enables low-power, short-range device pairing. Together they complement each other, balancing performance & convenience.
BGR
Sponsor
Master-Bond

Low Outgassing, Glob Top Epoxy
Master Bond EP17HTND-CCM is a glob top epoxy that meets NASA low outgassing specifications and forms high strength bonds to a wide variety of similar/dissimilar substrates.
Master Bond
Domesticating AI – It's not coming, it's already here
Home AI systems are rapidly evolving from simple voice assistants into privacy-focused tools. Powered by local models and platforms like Home Assistant, hobbyists can now build smart homes that understand natural language, automate complex tasks & keep data within the home.
New Atlas
Today's Sponsor
AI-Technology-Inc
Sponsor
AI-Technology-Inc

Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
Test Your Knowledge
What is the largest artery in the human body?
See answer below.
Industry Press
Yamaha surface-mount line powers the future of specialised production
Yamaha Robotics SMT section has supplied a complete surface-mount production line including printing, mounting, and 3D-AOI capabilities to Inter-Company, based ...
Yamaha Robotics SMT
A.R.T. Supports IPC/WHMA-A-620 Revision F with Updated Training Materials
Advanced Rework Technology Ltd. (A.R.T. Ltd.) is supporting the transition to IPC/WHMA-A-620 Revision F with updated training materials for cable and wire harness ...
Advanced Rework Technology Ltd.
Operator assistance system make assembly processes efficient, user-friendly
GÖPEL electronic has further developed and enhanced the operation and features of its operator assistance system Multi Line Assist: Assembly instructions are now projected ...
GÖPEL electronic
TM Soldering Solutions Launches EmberX Selective Soldering Control Software
TM Soldering Solutions introduces its powerful EmberX software control package, developed for its PHOENIX Selective Soldering platforms. The PHOENIX systems ...
TM Soldering Solutions
CE3S Announces New Partnership with SpecialTeam
Cumberland Electronics Strategic Supply Solutions (CE3S) has announced a new partnership with SpecialTeam. The collaboration provides an added resource ...
CE3S
Amtech Launches Rapid NPI & RapidRFQ to Accelerate Product Launches
Amtech Electrocircuits has introduced two new capabilities—Rapid NPI and RapidRFQ—focused on solving two of the most common bottlenecks in electronics manufacturing: ...
Amtech Electrocircuits
Green Circuits Achieves CMMC Level 2 Status
Green Circuits announced that it has successfully achieved Cybersecurity Maturity Model Certification (CMMC) Level 2 Status following an independent assessment ...
Green Circuits
MORE INDUSTRY PRESS
Intraratio-Corporation
Sponsor
Schunk

Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK
Quote of the Day
"There are only two ways to live your life. One is as though nothing is a miracle. The other is as though everything is a miracle."
Albert Einstein
Sponsor
Plasmatreat-GmbH

Plasma as a Key Technology
Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma ® & PlasmaPlus®.
Plasmatreat GmbH
Heller-Industries-Inc
Cartoon of the Day
Cartoon
'Ever have one of those days when you're not sure whether you're in the zone, out of the box, under the gun, over the hump, or behind the curve?'
Copyright © Randy Glasbergen
Sponsor
Circuitnet

"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC
Smart-Sonic
Test Your Knowledge Answer
What is the largest artery in the human body?
Answer: The aorta. It passes over the heart from the left ventricle and runs down in front of the backbone.