March 13, 2026

Outlook for PC’s cut as Memory Shortages and Supply Chain Disruptions Persist New data from International Data Corporation (IDC) shows global PC shipments will drop 11.3% in 2026 and tablets 7.6% as memory shortages, rising component costs, and supply constraints squeeze production, pushing device prices higher and weakening demand. IDC

Sponsor Probe Card Manufacturer 'Sees the Unseen' With X-ray Probe card manufacturer relies on mobile real-time x-ray inspection to verify the quality of its aligned probes at different stages along the assembly line. Glenbrook Technologies

Section 301 Investigations Signal New Phase in U.S. Trade Policy The Donald Trump administration launched Section 301 investigations into 16 trading partners, including China, the EU, Japan, and India, targeting unfair excess manufacturing capacity and electronics trade practices. Jamieson Greer signaled further probes. Global Electronics Association

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for PCBAs and semiconductors, further improving accuracy, speed and consistency - streamlining inspection processes. Technical Paper

Worldwide Server Market finished 2025 with an all-time record of 444 billion dollars revenue, according to IDC Global server revenue hit a record $125.3B in Q4 2025 as AI infrastructure spending surged, IDC reported. Vendor revenue jumped 52.4% year over year, led by hyperscaler demand and rapid growth in GPU-powered systems, despite economic uncertainty. IDC

Sponsor How to Simplify Solder Paste Printing StikNPeel removable rework stencils simplifies selective printing of solder paste leaving no residue providing cleaner alternative to metal stencils. BEST Inc.

The Silicon Hegemon Taiwan dominates advanced chip manufacturing, producing about 92% of sub-5-nm logic chips as TSMC leads the sector. Founded by Morris Chang, the foundry model powers firms like Nvidia and widens the gap with Samsung Electronics and Intel. EE Times

Copper-Tin Intermetallics: Their Importance, Growth Rate and Nature This paper will review the formation of copper-tin intermetallics, their growth rate, their effect on thermal cycle life, and drop shock performance. Technical Paper

Technical Papers ■ Scaling SMT Traceability ■ The Drawbacks of Internal Recycling Systems for Solder Dross ■ Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics ■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible ■ PCB Rework Evolves, With X-ray a Constant Support ■ How pH Cleaning Agents Affect Production Performance ■ A Universal AI-Powered Segmentation Model for PCBA & Semiconductor ■ RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG ■ High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin ■ Understanding Solder Dross: Causes and Control Strategies MORE TECHNICAL PAPERS

Sponsor Trailblazing Process News for Conformal Coating Say goodbye to clogged nozzles and hello to flawless conformal coating with the ASYMTEK Select Coat SL-1040 Ultrasonic Cleaning Station. Nordson Electronics Solutions

If You Think Laptops Are Expensive In 2026, You Won't Believe What They Cost In The '80s Modern laptops may seem pricey, but early machines cost far more. The 1982 GRiD Compass 1101 launched at $8,150, while models like Macintosh Portable neared $6,500—yet even today's $230 Asus Vivobook Go Slim easily outperforms them. BGR

Oracle prepares new round of layoffs while doubling down on AI infrastructure OpenAI CEO Sam Altman met lawmakers in Washington after the company's deal with the Department of Defense. Sen. Mark Kelly raised concerns about AI in warfare, urging guardrails and legislation as tensions with rival Anthropic spotlight surveillance risks. TechSpot

Reliability of Isothermally Aged Doped Low Creep Lead-Free Solder Paste The primary goal of this study was to find a manufacturable solder paste material that would reduce the effects of aging on the solder joints. Technical Paper

Sponsor Vapor Phase Profiling Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more. ECD

Sam Altman faced 'serious questions' in meeting with lawmakers about OpenAI's defense work OpenAI CEO Sam Altman met lawmakers in Washington after the company's deal with the Department of Defense. Sen. Mark Kelly raised concerns about AI in warfare, urging guardrails and legislation as tensions with rival Anthropic spotlight surveillance risks. CNBC

Beyond Bandwidth: The Industry is Striving for Custom Memory (Part 2) Chipmakers are racing to design custom memory that pushes AI performance beyond standard HBM4E. Marvell, Samsung, Micron, SK Hynix and partners are developing new architectures that increase bandwidth, efficiency and capacity for next-generation AI accelerators. EE Times

Insulation Between Overhanging Component Lead and Circuit Conductor We have a long lead SMT component overhanging the pad. Can solder mask provide insulation between the overhanging component and the circuit conductor? Board Talk

Sponsor Safe and Effective Cleaning with 440-R VOC-free stencil cleaning chemistry! Cleans any solder paste from any fine-pitch stencil when used as part of the Smart Sonic stencil cleaning process. Learn more. Smart Sonic

7 Annoying EV Myths That Just Refuse To Die Electric vehicle adoption has surged to over 25% of global new car sales, yet misinformation persists. Experts counter myths about emissions, cost, and range, showing EVs produce far lower lifetime emissions, cost less to run, and now offer significantly improved driving range. BGR

AI Was Supposed to Make Work Easier. A New Study Shows It’s Doing the Opposite. An analysis of 164,000 workers shows AI is intensifying work rather than easing it. Email, messaging & management software surged, while focused work time fell. Researchers warn that AI-driven efficiency may increase cognitive overload, burnout & declines in work quality. Entrepreneur

Sponsor Catch Defects Before They Cost You 3D AOI analyzes true solder height, contour, and volume to expose defects 2D systems miss—reducing false calls, rework, and escapes on ultra-compact components. Manncorp Inc.

40 Years of Wireless Evolution Leads to a Smart, Sensing Network 6G will move connectivity beyond faster speeds to create a universal data fabric linking digital and physical worlds. As millions of intelligent agents collaborate across devices and networks, the technology will transform applications and enable system-wide intelligence. IEEE Spectrum

Stencil Quality & Technology on Solder Paste Printing Performance We evaluate the impact of stencil quality by comparing the printing performance of 0.35mm pitch and 01005 pads from different stencil suppliers. Technical Paper

Outdated Systems and Data Silos Create a $1 Trillion Barrier to Manufacturing Digital Transformation Manufacturers push to adopt AI and Industrial IoT, but legacy systems and data silos slow digital transformation. Rockwell Automation's Michael Masser says cross-functional teams and unified data platforms can improve visibility, speed decisions, and boost ROI on technology investments. Design News

Honor flagship phone to launch in Taiwan by 2Q26, shaking up market Honor plans to enter the Taiwanese smartphone market in 2026 by opening retail stores and selling phones and accessories. Its flagship Honor Magic8 Pro has received certification from Taiwan's National Communications Commission and could launch as early as the second quarter. Digitimes

Sponsor AIT ORMET® TLPS for Thermal Conductivity AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C Ormet TLPS

Pegatron Eyes 10-fold AI Server Growth Pegatron Corp said it plans to grow AI server revenue more than tenfold this year, driven by demand for Nvidia GB300 server platform systems and cloud clients. Shipments are expected to rise quarterly, though near-term margins may face pressure from infrastructure investments. Taipei Times