Nov 2, 2026 Why Shrinking Component Geometries Force a Rethink of BGA Rework Heating Methods High-density PCB designs and shrinking BGA pitches create new thermal challenges for rework. Engineers must adopt precision heating systems, advanced thermal profiling, and tighter process controls to prevent component damage, solder defects, and assembly failures. EE Times

Sponsor iX7059 SMT Edition: Next-Gen 3D X-ray Experience high-precision inline 3D X-ray inspection by Viscom with AI-powered defect detection, exceptional image quality, and reliable performance for complex SMT assemblies. Viscom SE

Foxconn hopes to own 50% of the global AI server market within a couple years Foxconn aims to increase its global AI server market share from 40% to 50% while expanding U.S. manufacturing. Chairman Young Liu expects AI infrastructure to generate 60–65% of revenue within five years, while carefully managing investments. CNBC

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse Component salvaging provides a reliable and consistent method of harvesting electronic components, reducing electronic waste, minimizing fabrication of new components, and ensuring economic reuse for automated assembly. Technical Paper

How Small Electronics Manufacturers Prevent Component Shortages Electronics manufacturers Poweronics, FarSounder, and Exacta Technologies reduced component shortages by adopting ERP software that connects inventory, purchasing, BOMs, and production planning. The improvements enabled fewer production delays and business growth. EE Times

Sponsor Start Micro Dispensing Today The DL Micro Valve is specifically designed for dispensing micro volumes of material in precise, repeatable patterns. Learn more about the DL Micro Valve. DL Technology

Designing for the Long Haul: Building Obsolescence-Resilient Product Lifecycles AI-driven demand is accelerating DDR3 and DDR4 obsolescence, threatening legacy systems. Engineers must plan component lifecycles, evaluate replacements, secure authorized supplies and work with specialists to ensure long-term memory availability and system reliability. EE Times

Why is Our Selective Soldering Causing Blisters? Infrequently we see blisters on a board around certain components after selective soldering. What could be the root cause of our problem? Board Talk

Technical Papers ■ 5 Major Challenges in Image Sensor Packaging and How to Solve Them ■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible ■ Oxide Reduction for Reliable Electronics Manufacturing ■ UHDI Fabrication for IC Substrates: SAP and mSAP Processes ■ Flux-Free, Reliable, Efficient: Soldering with Formic Acid ■ Redesigning Material Logistics for High-Mix EMS Production ■ Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education ■ Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You MORE TECHNICAL PAPERS

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

Companies promised AI gains — here's how the payoff showed up in earnings Companies are moving beyond AI hype as Santander, Novartis and Standard Chartered report measurable gains in revenue, productivity and efficiency. Meta and Google also demonstrate financial returns, signaling that AI investments are delivering tangible business results. CNBC

How is the US-China tech war going? Ask AI AI-powered analysis of corporate earnings calls reveals how US-China tech restrictions, sanctions and tariffs create unintended economic winners and losers. The research shows investors can use language models to identify geopolitical risks, supply-chain shifts and emerging opportunities. Taipei Times

Tools and Techniques for Material Assessment in Advanced Technologies Paper identifies limitations in the methods used for evaluating solders, circuit board materials and surface finishes. Technical Paper

Sponsor Electronic Assembly Cleaning Basics Monitoring & effectively controlling chemistry concentration when cleaning electronic assemblies is crucial for maintaining optimal cleanliness results & preventing costly consequences. KYZEN

Humans are still doing the work behind some AI agents AI agents struggle with complex tasks such as calls, bookings and scheduling, prompting startups to combine automation with human oversight. Companies like Dazzle AI and Duckbill use human judgment to improve reliability, resolve problems and protect customer trust. CNBC

The AI hardware crunch has reached the humble circuit board AI server demand is tightening PCB supplies as manufacturers prioritize high-value orders, driving up laminate costs, extending lead times and raising labor expenses. Shortages threaten PC production, increase prices and disrupt industries, including medical equipment. TechSpot

Evaluation of 13 Solder Pastes for High Rel The authors undertook this project to choose the most robust solder paste to support the manufacture of complex high reliability products assembled at a of locations. Technical Paper

Sponsor Reliable drying of UV materials Rehm Thermal Systems launches the RDS UV dryer to meet faster hardening demands, enabling efficient, eco-friendly UV coating for electronics and various industries. Rehm Thermal Systems

Google: Agentic AI Will Drive New Demands on Data Center CPUs Google Cloud says agentic AI will increase demand for CPUs, storage, memory and networking as autonomous agents handle complex, bursty workloads. The company is developing microVMs, faster storage and orchestration to improve security, performance and infrastructure efficiency. EE Times

Hon Hai expects revenue growth in double digits Hon Hai forecasts double-digit revenue growth next year as AI data center demand accelerates. Chairman Young Liu cited Texas manufacturing investments, potential OpenAI collaboration, Nvidia partnerships and continued expansion of its electric vehicle platforms. Taipei Times

Sponsor Need Improved Solder Joint Visibility? Solder Peel-A-Way® Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action. Advanced Interconnections Corp.

Intel's Q3 Results Show Supply Chain Disruptions and PC Plunge Intel reported a 21% revenue increase to $16.5 billion in Q3 2026, driven by strong AI server demand. However, manufacturing bottlenecks, rising memory prices, and declining PC sales pressured production, margins, and future cash flow. EE Times

Printing of Solder Paste - A Quality Assurance Methodology This paper describes a method to ensure quality secured data from both solder paste printers and inspection machines in electronic assembly manufacturing. Technical Paper

Nobody Has a Bloody Clue Where AI Is Going. And That's the Opportunity. AI's rapid growth creates new entrepreneurial opportunities. Rather than wait for technology to mature, innovators can identify overlooked problems, use accessible AI tools and build businesses that deliver practical solutions and commercial value. Entrepreneur

The big questions remaining after Anthropic's blockbuster IPO prospectus Anthropic's S-1 filing reveals strong revenue growth and 85% gross margins, but raises questions about slowing growth, rising computing costs, infrastructure capacity, founder voting control and its undisclosed IPO valuation, potentially estimated between $1 trillion and $2 trillion. CNBC

Sponsor Your Domestic PCB Solution Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on. Summit Interconnect

Apple Debuts First Touchscreen OLED MacBook Pro; TSMC, Foxconn, Samsung in Supply Chain Spotlight Apple's new OLED touchscreen MacBook Pro, M6 MacBook Pro, and iPad mini could boost Taiwanese suppliers' orders and shipments. The launches introduce 2nm chips, advanced displays, and premium pricing, while rising memory costs challenge broader PC demand. TrendForce