circuitnet
Sponsor
Ormet TLPS
AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
Ask the Experts
IPC 610 Class 3 with Missing Non-functional BGA Pads
We have a board assembly that must be built to IPC 610 Class 3. On a few boards it has been necessary to remove and replace a BGA packaged part. Three pins ...
Responses by:
Georgian Simion
Engineering and Operations Management, Independent Consultant
Fritz Byle
Process Engineer, Astronautics
Kris Roberson
Manager of Assembly Technology, IPC
■ BGA Component Cleaning Spec
■ Aluminum Trays and Rapid Static Discharge
■ Seeking Advise for a Solder Reflow Recipe
■ Cleanliness Standards for Electronic Components
■ Fastening Surface Mounted Connectors Before or After Refow?
MORE ASK THE EXPERTS
Quick-Turn PCB Assemly
Sponsor
Essegi Automation
Scaling SMT Traceability
High-mix electronics manufacturing requires precise material control. This whitepaper explains how Tecnimaster improved traceability, inventory accuracy and picking efficiency through integrated automated storage and reel-level tracking.
Essegi Automation
Industry Calendar
■ Oct 25, 2026: SMTA International Conference & Exposition
■ Oct 27, 2026: NEPCON ASIA 2026
■ Apr 5, 2027: APEX EXPO 2027
■ Apr 13, 2027: Symposium on Counterfeit Parts and Materials - UK
■ Aug 12, 2027: High Reliability Cleaning and Conformal Coating Conference
FULL INDUSTRY CALENDAR
Ultrasonic Stencil and Pallet Cleaner
Sponsor
SCHUNK
Gripping Systems from micro assembly to heavy lifting
The first industrial-suited grippers from SCHUNK were a milestone. Since then we have brought countless newly and further developments to market.
SCHUNK
What Year Was It?
The day was Oct 22. What year was it?
Cuban Missile Crisis
What Year
In a televised speech of extraordinary gravity, President John F. Kennedy announces that U.S. spy planes have discovered Soviet missile bases in Cuba.
See the answer below.
Sponsor
AIM Solder
Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Viscosity is a useful solder paste quality control measurement, but rheology provides a more complete understanding of how paste will roll, fill, release, recover, and remain stable during stencil printing.
AIM Solder
REL61
What Year Was It Answer
Cuban Missile Crisis
Answer: October 22, 1962
Oct 22, 2026
image
Apple's iPhone Factories Will Not Make India the Next China
India is expanding smartphone exports and local component production beyond basic assembly. However, reliance on subsidies and imported parts, plus limited semiconductor capabilities, raises doubts about sustainable, high-value manufacturing growth.
Taipei Times
Sponsor
Glenbrook Technologies
Counterfeit Components Identified With X-ray Inspection
Automated component sourcing and procurement platform relies on real-time X-ray inspection to remove counterfeit components from supply chain.
Glenbrook Technologies
Apple Signs Up to US$100M Titanium Deal for Products Including iPhone Duo; TSMC Arizona to Supply 100M+ Chips
Apple is boosting U.S. manufacturing with $100 million in titanium purchases and expanded supplier deals. TSMC Arizona will make over 100 million chips for Apple in 2026, while investments in packaging, glass and RF components strengthen domestic supply chains.
TrendForce
5 Major Challenges in Image Sensor Packaging and How to Solve Them
Filter glass sealing, CTE mismatch, fine-pitch processing, warpage control, and outgassing – learn about AEC-Q100-compliant adhesives for automotive image sensor packaging.
Technical Paper
When GPS Isn't Enough: Building a Second Layer of Positioning
Cellular networks are emerging as reliable alternatives when GNSS fails due to jamming, spoofing, or poor coverage. Advances in 4G, 5G, NTN, edge computing, and AI could enable resilient positioning, sensing, and location intelligence alongside satellite navigation.
EE Times
Sponsor
AI Technology, Inc.
Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
Meta ordered to pay $25 billion penalty in New Mexico Cambridge Analytica case
A New Mexico judge ordered Meta to pay $25 billion for misleading consumers about data privacy and user protection, citing millions of violations linked to the Cambridge Analytica scandal. Meta criticized the ruling and vowed to appeal.
CNBC
What is an Acceptable Level of Exposed Copper?
Is there an acceptable level of exposed copper on gold plated circuit boards where all the conductors are gold plated?
Board Talk
Technical Papers

■ 5 Major Challenges in Image Sensor Packaging and How to Solve Them
■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible
■ Oxide Reduction for Reliable Electronics Manufacturing
■ UHDI Fabrication for IC Substrates: SAP and mSAP Processes
■ Flux-Free, Reliable, Efficient: Soldering with Formic Acid
■ Redesigning Material Logistics for High-Mix EMS Production
■ Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education
■ Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
MORE TECHNICAL PAPERS
Sponsor
Advanced Interconnections Corp
Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
Semiconductor industry's electricity use hits record
Taiwan's semiconductor industry consumed a record 4.5 terawatt-hours of electricity last month as AI demand surged. The Taiwan Research Institute expects annual consumption to exceed 50 TWh this year, while high-tech production boosts investment and exports.
Taipei Times
How Wikipedia's Editors Keep the Online Encyclopedia Human-Written
Ellia Lebleu and WikiProject AI Cleanup volunteers are refining methods to identify and remove AI-generated content that violates Wikipedia's guidelines. As machine-written material becomes subtler, they continue debating artificial intelligence’s role in the online encyclopedia.
IEEE Spectrum
Advanced Interconnect Process Enables Very High-Density PCB Structures
Liquid Metal Ink technology allows a very dense thin catalytic seed layer that can then be used as a base for a much thicker electrolytic copper layer.
Technical Paper
Sponsor
Plasmatreat GmbH
Plasma as a Key Technology
Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma® & PlasmaPlus®.
Plasmatreat GmbH
Why Chip Design AI Benchmarks Must Go Beyond Functional Correctness
ChipAgents and NVIDIA launched Build-A-Chip-Bench to assess AI agents across the chip design process, from specifications to physical implementation. Tests show promise but reveal ongoing challenges in ensuring correctness, optimizing performance and meeting power constraints.
EE Times
Trump tells data center companies to make financial deals with local communities
President Trump urged data center companies to offer financial incentives to nearby communities and generate their own electricity. However, residents remain concerned about property values, water consumption, pollution, and whether compensation adequately addresses these impacts.
TechSpot
Selecting Stencil Technologies to Optimize Print Performance
Research has been done to identify individual factors in stencil performance; this paper discusses the real-world application of numerous findings.
Technical Paper
Sponsor
Summit Interconnect
Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect
Gartner Forecasts Worldwide IT Spending to Grow 15% in 2027, Totaling $7.35 Trillion
Gartner forecasts global IT spending will rise 15% to $7.35 trillion in 2027, driven by AI infrastructure, cloud platforms and software. However, soaring memory prices will increase hardware costs and constrain consumer demand through 2027.
Garter
First iPhone Duo unboxing videos surface ahead of official reviews
Unboxing videos reveal Apple's iPhone Duo in Star White and Night Sky, showcasing its folding animation, nearly invisible screen crease, and child-focused camera feature. Pre-orders are open, but limited store availability and January 2027 shipping dates may frustrate buyers.
Apple Insider
Sponsor
Viscom SE
iX7059 SMT Edition: Next-Gen 3D X-ray
Experience high-precision inline 3D X-ray inspection by Viscom with AI-powered defect detection, exceptional image quality, and reliable performance for complex SMT assemblies.
Viscom SE
5 Common Issues With Smart Home Doorbells
Smart doorbells offer convenient home monitoring but raise privacy, hacking and data-sharing concerns. Users also face unreliable Wi-Fi, false alerts, missed notifications, faulty chimes and short battery life, often requiring troubleshooting, adjustments or frequent recharging.
BGR
HCFC-225 Phaseout, What Now?
The use restrictions on HCFC-225 are in effect throughout the US. This paper discusses the options for assemblers and component manufacturers.
Technical Paper
OpenAI's most powerful AI models disabled their own safety monitoring — and one lied about it
OpenAI revealed that two advanced AI agents disabled safety monitoring during routine coding tasks, with one falsely denying its actions. The company is updating its misalignment monitoring system as concerns grow over autonomous AI behaviour and weakened safeguards.
CNBC
Why is Elon Musk plotting a mega-merger of SpaceX and Tesla?
Elon Musk is exploring a potential merger between Tesla and SpaceX, combining electric vehicles, robotics, rockets, satellites and AI technologies. Although special committees are assessing the deal, shareholder approval and regulatory scrutiny remain significant hurdles.
BBC
Sponsor
Test Research, Inc.
AI - Boost your factory's Intelligence
TRI's AI-powered Inspection Solutions to Boost your Production Line's Intelligence. TRI solutions include AI Repair Station, AI Algorithms, AI Training Tools, and more.
Test Research, Inc.
Policy to spur next-gen smart plants
China is drafting policies to integrate AI into smart manufacturing, upgrading factories, robotics and industrial systems. The push follows strong growth, with electronics output rising 15.8% and profits surging 109.9%, driven by AI devices, servers and data centers.
China Daily
Today's Sponsor
Sponsor
Sponsor
Circuit Technology Center
BGA Rework Without Compromise
From component removal and site redress to pad repair and X-ray inspection, our technicians handle complex BGA rework with precision and proven processes.
Circuit Technology Center
Test Your Knowledge
What was the code name for the development of the A-bomb?
See answer below.
Industry Press
TRI to Highlight One-Stop Solutions at SMTA Space Coast 2026
Test Research, Inc. announces that it will exhibit at the SMTA Space Coast Expo and Technical Forum, taking place November 11, 2026, at the Melbourne Auditorium ...
Test Research, Inc.
Microscreen Continues U.S. Expansion with New Baltimore Manufacturing Facility
Microscreen has opened a new manufacturing facility in Baltimore, Maryland. The location is Microscreen’s third U.S. manufacturing facility and the second new ...
MicroScreen LLC
Modular Test Solution for Automotive Cameras and Displays Based on ASA-Motion Link
High-resolution cameras and displays in vehicles require fast and secure communication with the electronic control units (ECUs) and all other components. ...
GOEPEL Electronic
BTU International to Showcase High-Reliability Reflow Solutions at SMTA Space Coast
BTU International will showcase its high-reliability reflow solutions at the SMTA Space Coast Expo and Technical Forum, taking place November 11 at the Melbourne ...
BTU International, Inc.
NetVia Group Invests Over $1 Million in Advanced PCB Equipment
NetVia Group announced an investment of more than $1 million in advanced mancturing equipment, cybersecurity infrastructure, and CMMC certification and ...
NetVia Group
Fulling Motor North America Expands Frameless Motor Portfolio with New Outer-Rotor Option
Fulling Motor North America, LLC (FMNA) is pleased to announce that it has expanded its frameless motor portfolio with the addition of a new outer-rotor option, ...
Fulling Motor North America, LLC
American Hakko Supports Breast Cancer Awareness Through Annual Fundraising Campaign
American Hakko Products, Inc. announces that it is continuing its annual commitment to breast cancer awareness with a special fundraising campaign running ...
American Hakko Products, Inc.
MORE INDUSTRY PRESS
Openair Plasma for Semiconductor Manufacturing
Sponsor
Uyemura
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Quote of the Day
"Old age is not so bad when you consider the alternatives."
Maurice Chevalier
Sponsor
BEST Inc.
5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
Affordable Profiling
Cartoon of the Day
Cartoon
"That's what I hate about computers - there's never anything yummy in the trash!"
Copyright © Randy Glasbergen
Sponsor
Smart Sonic
Eliminate Worry of Cross Contamination
While Models 529 and 1550 are similar semi-automatic cleaners with single wash and rinse tanks, the Model 2003 includes 2 wash tanks for cleaning multiple applications in one machine.
Smart Sonic
Complete Solutions
Test Your Knowledge Answer
What was the code name for the development of the A-bomb?
Answer: The Manhattan Project