Circuitnet Ask the Experts

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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

Sponsor

Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Ask the Experts Index

■	EMI Shield Reflow Soldering Techniques
■	Part Movement During Reflow
■	BGA re-balled with lead free spheres
■	Testing Hand Soldering Skills
■	How Many Fiducials Per Solder Paste Stencil?
■	Solder Alloy Investigation
■	Reliability Concerns When Converting to Lead-free
■	Contamination Using Solvent Dispensers
■	Mixed Process Solder Joint Appearance, Smooth or Grainy?
■	What Caused SMT Pads to Oxidize After Reflow
■	Viscosity of Solder Paste Before Printing
■	Solder Splashing During Wave Soldering
■	ENIG Solderability Issues
■	Solder Paste Mixing
■	Recommended Solder Paste Aperture Configuration
■	Polyurethane Conformal and Acrylic Coating on the Same PCB
■	Conformal Coating in Nitrogen Environment
■	Double Sided Reflow for Micro BGA Components
■	Baking After Cleaning Hand Placed Parts
■	Question About IPC-6013 Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
■	Coils Rotated After Reflow
■	Stencil Pattern for Thermal Pads on QFNs
■	Component Shifting
■	What Is Causing Connectors to Bow?
■	Cleaning No-Clean Solder Paste
■	Solder Paste Alloy Check
■	Challenge Wetting Solder to Brass Pins
■	Class 3 Cleaning Requirements
■	Mixing Different SAC305 Solders
■	Rework of Underfilled Array Packages
■	What Causes Solder Balls During Rework?
■	Advise and suggestions for assembly using 01005 capacitors.
■	Selective Printing for BGA Components
■	PCBA Transport Between Facilities
■	SOT (Small Outline Transistor) Body Cracks
■	Shielding Techniques When Removing Components Using Hot Air
■	Partially Visible or Hidden Solder Connections
■	Shelf Life Limit for Soldering Old Components
■	Trays for MLS Baking
■	Controlling Creep Corrosion
■	Design Considerations and Impact on Assembly
■	BGA Placement Paste or Only Flux
■	BGA BAll Sheer Testing
■	Hand Soldering at Low Temperature
■	Spotting After DI Water Cleaning
■	Cause of Green/Blue Oxide Buildup
■	Floor Life of MSD Parts
■	Reflow Oven Calibration Schedule
■	Trichloroethylene Alternative
■	Is Solder Mask Considered an Insulator

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura