circuitnet
Sponsor
AI-Technology-Inc

Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
Ask the Experts
Solder Paste Alloy Check
We have a production line that runs mainly leaded paste. We accidentally assembled boards using lead-free paste and they went through a leaded profile during reflow. ...
Responses by:
Linda Woody
SME Production Technical Excellence Staff, Lockheed Martin
Renee Michalkiewicz
General Manager, Trace Laboratories
Fritz Byle
Process Engineer, Astronautics
Brian Smith
General Manager - Electronic Assembly Americas, DEK International
James DiBurro
President, Round Rock Consulting
Peter Biocca
Senior Market Development Engineer, Kester
Leo Lambert
Vice President, Technical Director, EPTAC Corporation
Challenge Wetting Solder to Brass Pins
Class 3 Cleaning Requirements
Mixing Different SAC305 Solders
Rework of Underfilled Array Packages
What Causes Solder Balls During Rework?
Advise and suggestions for assembly using 01005 capacitors.
Selective Printing for BGA Components
MORE ASK THE EXPERTS
Viscom-SE
Sponsor
Viscom

iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom
Industry Calendar
Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA
Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMTA
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
Oct 1, 2026
Long Island Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Nordson-ASYMTEK
Sponsor
Advanced-Interconnections

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
What Year Was It?
Paris Celebrates 2,000th Birthday
What Year
Paris, the capital city of France, celebrates turning 2,000 years old. In fact, a few more candles would've technically been required on the birthday cake, as the City of Lights was most likely founded around 250 B.C.
See the answer below.
Sponsor
ECD

Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD
Plasma-Etch
What Year Was It Answer
Paris Celebrates 2,000th Birthday
Answer: July 8, 1951
July 8, 2026
image
Global robotaxi market set to hit US$1t by 2040 as China tech costs plummet
Morgan Stanley forecasts the global robotaxi market will reach US$1 trillion by 2040, driven by lower Chinese manufacturing costs, AI advances and supportive regulations. Chinese firms and US leaders Tesla and Waymo are expected to lead large-scale commercial deployment.
South China Morning Post
Sponsor
Glenbrook-Technologies

Probe Card Manufacturer 'Sees the Unseen' With X-ray
Probe card manufacturer relies on mobile real-time x-ray inspection to verify the quality of its aligned probes at different stages along the assembly line.
Glenbrook Technologies
Canada’s AI Ecosystem Needs More Urgency
Canada has built a strong AI research foundation, but experts say the country must act faster to expand domestic computing infrastructure, develop sovereign AI hardware, and commercialize innovation to remain globally competitive in the rapidly evolving AI market.
EE Times
Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses
Intentional contamination of PWBs offers a practical and controlled approach for evaluating cleanliness analysis techniques and for developing meaningful and effective cleanliness guidelines.
Technical Paper
A Circuit Board Problem Just Delayed Nvidia’s Next AI System to 2028 And Chip Stocks Are Already Feeling the Fallout
SemiAnalysis claims printed circuit board challenges have delayed NVIDIA’s Kyber NVL144 rack-scale AI system from 2027 to 2028. NVIDIA rejects the report, insisting its AI hardware roadmap remains on schedule despite the research firm’s delay prediction.
Investing
Sponsor
Schunk

Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK
Krispy Kreme’s Doughnut-Decorating Robots Were a ‘Supermessy’ Disaster. Now It’s Hiring Humans.
Krispy Kreme is hiring human decorators after robots failed to create intricate specialty doughnut designs. The move supports its turnaround strategy as the company cuts costs, expands retail distribution and capitalizes on strong demand for limited-edition and seasonal collections.
Entrepreneur
A.I. Deployment in Verification Tool for Inspection Equipment
AI has been deployed in the verification tool with studies conducted to compare the effectiveness and efficiency of the tool versus human operation.
Technical Paper
Technical Papers
Flux-Free, Reliable, Efficient: Soldering with Formic Acid
Redesigning Material Logistics for High-Mix EMS Production
Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education
Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse
Digital Warehouse Automation in High-Mix PCB Assembly
Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses
Scaling SMT Traceability
The Drawbacks of Internal Recycling Systems for Solder Dross
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
MORE TECHNICAL PAPERS
Sponsor
DL-Technology

EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
Optimizing Electromechanical Hardware for Extreme Defense Environments
Defense engineers are adopting advanced materials such as hybrid fiber-reinforced polymers and ceramic-matrix composites to build lighter, stronger hardware that withstands extreme combat conditions. These materials improve durability, thermal protection and reliability, enabling mission-critical systems to survive harsh operational environments.
EE Times
India must move beyond assembly to build global electronics champions, says Nothing’s Himanshu Tandon
CMF by Nothing's Himanshu Tandon says India's smartphone manufacturing has advanced rapidly, with nearly all phones now produced locally. He credits Make in India and PLI schemes but urges greater component manufacturing, value addition, and quality improvements to build globally competitive Indian brands.
The Economic Times
Isothermal Aging of BGA Packages Using Doped Lead Free Solder Alloys
This paper evaluates the long term aging effect of various doped lead free solders built using Megtron6 substrate under other, different aging conditions.
Technical Paper
Sponsor
EOS-ESDA-Association

Reimagined EOS/ESD Symposium 2026
Experience the enhanced EOS/ESD Symposium with expanded learning, collaboration, and industry connections. Join experts exploring challenges and solutions in EOS/ESD control. September 28-30.
EOS/ESD Association
The FBI and Google just took down a botnet that hijacked 2 million smart TVs
The FBI and Google disrupted the NetNut residential proxy network after it hijacked more than two million consumer devices for cybercrime. Authorities seized domains, disabled command infrastructure, and pushed security updates, significantly weakening the botnet's global operations and criminal misuse.
TechSpot
Manufacturing Expands in June Amid Global Unrest
U.S. manufacturing expanded for a sixth straight month in June, though growth slowed as the ISM PMI slipped to 53.3%. Strong orders and improving hiring offset weaker GDP growth, while tariffs and the Iran conflict kept raw material costs and supply chain pressures elevated.
EE Times
The Effect of Fine Mesh Solder Powder on Flux Residue Removal
There is a drive to miniaturize solder paste deposits. A key element to success is the incorporation of smaller solder particles in the solder paste.
Technical Paper
Sponsor
Summit-Interconnect

The Battle for Space Superiority Has Begun
The next conflict may begin in orbit. Learn why resilient space systems and advanced manufacturing matter more than ever.
Summit Interconnect
Consumers Embrace Driverless Delivery, But Infrastructure Lags
Autonomous vehicles are increasingly arriving at malls, restaurants and retail sites, exposing infrastructure gaps for pickups and deliveries. Autolane is expanding its coordination platform to manage autonomous traffic as retailers prepare for rapid growth in last-mile autonomous commerce.
Forbes
The Brains of the Train: How India Became a Global Exporter of Railway Electronics
India is transforming railway manufacturing by making electronics nearly 40% of modern train costs, exporting advanced rail systems globally, expanding domestic component production, and investing heavily in PCBs and semiconductors to boost jobs, reduce imports, and strengthen indigenous engineering.
The First Global Telugu Newspaper
Sponsor
Master-Bond

Thixotropic, Dual Cure Adhesive
Master Bond UV23FLDC-80TK is a dual curing adhesive that withstands rigorous thermal cycling and is suitable for applications where low stress is critical. View full specs.
Master Bond
Power electronics at a turning point, says Yole
Yole Group forecasts the global power device market will grow at a 7.1% CAGR to $41.3 billion by 2031 as the power electronics industry shifts from rapid expansion to cost optimisation, consolidation, and profitability, while Chinese firms intensify global competition.
Compound Semiconductor
Should We Measure Solder Paste Thickness?
On average, how many locations should we measure our PCBs to confirm our solder paste thickness? Our PCBs are approximately 10" by 10".
Board Talk
When the market has "priced in perfection" in advance, even Samsung Electronics' strong earnings are not enough.
Samsung Electronics posted record quarterly profit as AI-driven memory demand lifted earnings above expectations, but investors dumped the stock after pricing in near-perfect results. Concerns over cash flow, shareholder returns and slowing AI spending triggered a broad semiconductor sector sell-off.
Odaily
Users And Manufacturers Disagree On How Long Wireless Keyboards Should Last - Here's Why
Wireless keyboards typically last between two and 15 years, depending on build quality, switch type and usage. Mechanical keyboards outlast membrane models, while actual lifespan varies with keystroke volume, maintenance and component durability rather than brand alone.
BGR
Sponsor
BEST-Inc.

Want High-Quality BGA Reballing?
BGA rework and reballing solutions for commercial, military and aerospace perfected over 20-plus years of reliable, repeatable and proven success.
BEST Inc.
Gartner Predicts 60% of Organizations Will Adopt Smaller Software Engineering Teams by 2029
Gartner predicts 60% of organizations will adopt AI-powered tiny software engineering teams by 2029, up from 15% in 2026. AI will automate routine tasks, enabling smaller, agile teams while increasing demand for skilled engineers and preserving junior hiring to sustain talent pipelines.
Gartner
Today's Sponsor
Circuit-Technology-Center
Sponsor
Circuit-Technology-Center

Recover Valuable Components and Reduce Electronics Costs
Don't let usable components go to waste. Learn component recovery methods that reduce material costs, extend inventory value, and support sustainable manufacturing.
Circuit Technology Center
Test Your Knowledge
What color on black produces the most visible combination?
See answer below.
Industry Press
Orbit Tech accelerates growth with Europlacer iineo placement machine
Orbit Technologies Ltd has reported significant operational and business improvements following its investment in Europlacer surface-mount technology (SMT) equipment, ...
Europlacer
PARMI Expands Mid-Atlantic Sales Coverage with Cope Assembly Products
PARMI partnered with COPE Assembly to expand access to advanced 3D inspection systems, helping electronics manufacturers improve defect detection, product quality, and production efficiency.
PARMI
Bio-based Multi-purpose Adhesive With Excellent Adhesion
DELO introduced a bio-based adhesive containing 62% renewable materials, providing strong, durable bonding and moisture resistance for automotive, electronics, glass, metal, and plastic applications.
DELO
Scalable desktop test platform for modern automotive control units
The Magic Compact Plus combines depaneling and routing in one compact system, delivering precise, low-stress PCB separation and flexible processing for diverse electronics manufacturing needs.
GÖPEL electronic
CalcuQuote Introduces Product Change Notifications to Help EMS Companies
CalcuQuote's Product Change Notifications alert EMS companies to component changes, obsolescence, compliance updates, and supplier risks, helping teams make faster sourcing and quoting decisions.
CalcuQuote
Seika Machinery to Host SMI Webinar on PCB Slicing-Low-Stress Separation
Seika Machinery's SMI 2026 Webinar Series continues with a session on PCB slicing, low-stress depaneling, and automation techniques that improve board quality, protect components, and boost yields.
Seika Machinery, Inc.
CE3S Brings Back Free ANSI/ESD S20.20 Training Series with Desco Industries
Cumberland Electronics Strategic Supply Solutions (CE3S) in partnership with Desco Industries Inc., will host its next free ANSI/ESD S20.20 training series throughout ...
Cumberland Electronics Strategic Supply Solutions
MORE INDUSTRY PRESS
Uyemura
Sponsor
Air-Vac-Engineering

Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
Quote of the Day
Tolerance is the positive and cordial effort to understand another's beliefs, practices, and habits without necessarily sharing or accepting them.
Joshua Loth Liebman
Sponsor
Circuit-Technology-Center

Eliminate Lead Tinning Issues Before They Become Reliability Failures
Learn lead tinning methods, causes of tinning defects, and solutions from the experts at Circuit Technology Center to help ensure dependable solder connections.
Circuit Technology Center
Ormet-TLPS
Cartoon of the Day
Cartoon
"At this company we celebrate innovation, we celebrate our pioneering spirit, we celebrate excellence and idealism - any excuse to party!"
Copyright © Randy Glasbergen
Sponsor
kyzen

Let our contract cleaning services help
If you have a technical cleaning question, or if you are facing process challenges or performance challenges, use this technical hotlist form to get help from a KYZEN Technical Care Expert.
KYZEN
Zestron
Test Your Knowledge Answer
What color on black produces the most visible combination?
Answer: Yellow