July 11, 2025

Can We Please Put Back Some Common Sense in Component Purchasing? The semiconductor industry faces renewed volatility as Samsung plans to halt DDR4 production by end-2025, sparking panic buying and distorted demand. Legacy tech is vanishing faster, urging companies to build strong partnerships and plan smarter for supply security. EE Times

Sponsor Unlock the Potential of Salvaged Devices Component harvesting is a reliable method of electronic component reclamation, reducing e-waste and ensuring economic reuse for automated assembly. BEST Inc.

Foldable smartphone market awaits Apple's entry as growth stalls Samsung and Vivo's new foldable smartphones have reignited interest in the market, but supply chain insiders see them as precursors to Apple's expected 2026 entry, which they believe will spark real competition and broader consumer adoption. Digitimes

Optimizing BGA Rework: Challenges, Techniques and Quality Control The complexity of BGA packages introduces challenges during rework requiring innovative methods and inspection practices to ensure performance and reliability. This paper outlines best practices for removing and replacing BGAs. Technical Paper

Gartner Forecasts Worldwide End-User Spending on GenAI Models to Total $14.2 Billion in 2025 Global end-user spending on generative AI is set to hit $14.2 billion in 2025, with $1.1 billion going to specialized domain-specific models. Gartner forecasts over half of enterprise GenAI use will be domain-specific by 2027. Gartner

Sponsor Reflow Solderable TIM1 Thermal Grease AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering. AI Technology

Samsung seeks to roll out tri-fold phone by year-end, smartphone head says Samsung plans to launch a tri-fold smartphone by year-end, expanding its innovative form factors to enhance AI experiences. The company also defended using its in-house Exynos 2500 chip in the new Flip 7 globally. The Korea Times

Technical Papers ■ Understanding Solder Dross: Causes and Control Strategies ■ Optimizing BGA Rework: Challenges, Techniques and Quality Control ■ Maintenance: The Basics of Cleaning Series Part 4 ■ The Economics of Electronic Component Salvage and Reuse ■ Cutting Without Contact: How Laser Depanelling Redefines PCB Manufacturing ■ The "Fried Egg" Effect in Soldering ■ Flux Technology Development for Solder Paste Compatible with Formic Acid Reflow Ovens for Power Devices ■ Innovative Power Module Assembly Solutions ■ Unlocking the Potential of Nanoscale Conformal Coatings ■ Recycling vs Circularity: Minimising E-Waste in Manufacturing MORE TECHNICAL PAPERS

Sponsor REL61: Cost-Effective Soldering, Elevated Performance Many low/no-silver alternatives save money but fall short in performance. REL61 is different, offering both lower costs and better performance. AIM Solder

Here's When the New Apple iPhone 17 and MacBooks Are Being Released Apple plans to launch new iPhones, iPads, MacBook Airs, and a home device in early 2026. The home device, about the size of two iPhones, will serve as a smart command center, controlling locks, lights, sprinklers, and other appliances. Entrepreneur

Trump hosts Jensen Huang at White House as Nvidia tops $4 trillion market cap Nvidia CEO Jensen Huang met President Trump at the White House as Nvidia became the first company to close with a $4 trillion market cap. The meeting likely addressed U.S. export controls on Nvidia's AI chips to China, impacting $8 billion in sales. CNBC

Sponsor Vapor Phase Profiling Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more. ECD

Next-gen Apple Pencil might finally work with your iPhone Apple's new patent reveals a next-gen Apple Pencil that can draw on non-touch surfaces like iPhones or tabletops using advanced optical sensors. This tech could explain why Apple hasn't yet enabled Pencil support on the Vision Pro headset. BGR

Adapt or Fade — What Growing Companies Need to Know About Staying Relevant Growth today depends less on expansion and more on staying relevant. Businesses thrive by listening to customers, adapting quickly, and operating flexibly—turning development into a natural result of responsiveness rather than a standalone objective. Entrepreneur

Sponsor In-House Assembly? We Make It Easy We match you with the right equipment, install it, train your team, run your first jobs, and back it with strong warranties plus expert remote and on-site support. Manncorp Inc.

Amazon warehouse workers lose jobs after Trump's immigration crackdown: 'We have done everything legally' After the Trump administration revoked key humanitarian immigration programs, Amazon fired Haitian worker Daphnee Poteau and others lacking renewed work permits. Now facing legal uncertainty, they fear deportation despite contributing to U.S. communities and the workforce. CNBC

Windows 11 is now the most-used desktop operating system Windows 11 has overtaken Windows 10 as the most-used desktop OS, now holding 52% of the market. After years of slow growth, stricter hardware requirements, and user hesitation, Microsoft's AI-driven push is accelerating Windows 11 adoption. Quartz

Sponsor Plasma Etch PE-Avenger The PE-Avenger is an ultra low-cost entry level plasma cleaning system allowing more labs to utilize plasma. It's a low frequency plasma cleaner designed for surface activation and organics removal. Plasma Etch

Mark Cuban says AI could create the first trillionaire – "just one dude in the basement" Billionaire Mark Cuban predicts AI will create the world's first trillionaire—likely an unknown innovator, not an established mogul. Praising AI's vast potential, he compares its impact to the internet, despite ethical, economic, and environmental concerns. TechSpot

Tenstorrent Acquires Blue Cheetah, Opens Chiplet Spec Tenstorrent acquired analog IP firm Blue Cheetah and opened its Open Chiplet Architecture (OCA) to accelerate chiplet adoption. The move strengthens in-house die-to-die capabilities and fosters a scalable, collaborative ecosystem for next-gen silicon diversity. EE Times

Challenges of Ultra-Fine Feature Printing Optimization of Pb-Free Solder Paste Advanced semiconductor manufacturing techniques like flip chip, PoP, and SiP demand precise soldering through 50–100 μm stencil apertures, requiring solder pastes formulated with IPC Type 6 or finer powder sizes for reliable miniature solder joints. Circuit Insight - Materials Tech

Sponsor Trailblazing Process News for Conformal Coating Say goodbye to clogged nozzles and hello to flawless conformal coating with the ASYMTEK Select Coat SL-1040 Ultrasonic Cleaning Station. Nordson Electronics Solutions

Space industry warns of satellite collision risks as US funding faces deep cuts A fierce battle is brewing over U.S. space safety as the White House proposes slashing funding for the Office of Space Commerce, risking its TraCSS program. Industry leaders warn this move endangers satellites and weakens U.S. leadership in orbit. TechSpot

Pick-and-Place Feeder density within SMT and Electronics Assembly To keep up, P&P machine suppliers must increase feeder density in traditional ways or new creative innovations to better serve the end user. Circuit Insight - Production Floor

Memory Safety Will Be Key to Tackle Fundamental Cyber Security The U.K.'s Digital Security by Design initiative showcased CHERI, a memory-safe hardware technology, in London. Experts praised its cybersecurity potential but noted adoption challenges. With 160+ companies involved, standardizing memory safety remains a key priority. EE Times