circuitnet
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DL-Technology

EZ-FLO High Precision Ceramic Dispense Tips
The ceramic molding process allows for smaller more precise inner diameters with a glass-like finish, giving you the ultimate control. Learn more.
DL Technology
Ask the Experts
Gold Plating and Embrittlement
What is your opinion regarding gold plating removal to improve soldering? I believe in the past gold plating was thick enough (>50 micro inches) to cause gold ...
Responses by:
Karl Seelig
, Deck Street Consultants
Kay Parker
Technical Support Engineer, Indium Corporation
KN Murli
Head-Quality, Astra Microwave Products, Hyderabad, AP India
Richard D. Stadem
Advanced Engineer/Scientist, General Dynamics
Dr. Craig D. Hillman
CEO & Managing Partner, DfR Solutions
Fritz Byle
Process Engineer, Astronautics
Leo Lambert
Vice President, Technical Director, EPTAC Corporation
Brien Bush
Manufacturing Applications Specialist, Cirtronics Corp.
Gerard O'Brien
President, S T and S Testing and Analysis
OA Flux Turning Blue
Pad Missing ENIG Plating
Competing Reflow Oven Zones
Specific Solder To Control Dendritic Growth
Viscosity of Solder Paste Before Printing
Floor Life of MSD Parts
Insufficient Plated Hole Fill with Electrolytic Capacitors
MORE ASK THE EXPERTS
Viscom
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Circuitnet

Circuitnet Advertising Delivers Results!
Introduce your technology, new products or services in our daily e-mail newsletter & website to see how a digital advertising campaign can deliver results. Reach over 200,000 professionals.
Circuitnet LLC
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Nov 13, 2025
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SMTA
Nov 11, 2025
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Nov 4, 2025
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SMTA
FULL INDUSTRY CALENDAR
SEIKA-America
Sponsor
kyzen

The "Fried Egg" Effect in Soldering
Burnt-on flux residue that is visible on the solder mask of PCBs after improper reflow settings produces significant challenges to the reliability of finished boards.
KYZEN
What Year Was It?
Burr Slays Hamilton in Duel
What Year
In a duel held in Weehawken, New Jersey, Vice President Aaron Burr fatally shoots his long-time political antagonist Alexander Hamilton.
See the answer below.
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
Circuit-Technology-Center
What Year Was It Answer
Burr Slays Hamilton in Duel
Answer: July 11, 1804
July 11, 2025
image
Can We Please Put Back Some Common Sense in Component Purchasing?
The semiconductor industry faces renewed volatility as Samsung plans to halt DDR4 production by end-2025, sparking panic buying and distorted demand. Legacy tech is vanishing faster, urging companies to build strong partnerships and plan smarter for supply security.
EE Times
Sponsor
BEST-Inc.

Unlock the Potential of Salvaged Devices
Component harvesting is a reliable method of electronic component reclamation, reducing e-waste and ensuring economic reuse for automated assembly.
BEST Inc.
Foldable smartphone market awaits Apple's entry as growth stalls
Samsung and Vivo's new foldable smartphones have reignited interest in the market, but supply chain insiders see them as precursors to Apple's expected 2026 entry, which they believe will spark real competition and broader consumer adoption.
Digitimes
Optimizing BGA Rework: Challenges, Techniques and Quality Control
The complexity of BGA packages introduces challenges during rework requiring innovative methods and inspection practices to ensure performance and reliability. This paper outlines best practices for removing and replacing BGAs.
Technical Paper
Gartner Forecasts Worldwide End-User Spending on GenAI Models to Total $14.2 Billion in 2025
Global end-user spending on generative AI is set to hit $14.2 billion in 2025, with $1.1 billion going to specialized domain-specific models. Gartner forecasts over half of enterprise GenAI use will be domain-specific by 2027.
Gartner
Sponsor
AI-Technology-Inc

Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology
Samsung seeks to roll out tri-fold phone by year-end, smartphone head says
Samsung plans to launch a tri-fold smartphone by year-end, expanding its innovative form factors to enhance AI experiences. The company also defended using its in-house Exynos 2500 chip in the new Flip 7 globally.
The Korea Times
Technical Papers
Understanding Solder Dross: Causes and Control Strategies
Optimizing BGA Rework: Challenges, Techniques and Quality Control
Maintenance: The Basics of Cleaning Series Part 4
The Economics of Electronic Component Salvage and Reuse
Cutting Without Contact: How Laser Depanelling Redefines PCB Manufacturing
The "Fried Egg" Effect in Soldering
Flux Technology Development for Solder Paste Compatible with Formic Acid Reflow Ovens for Power Devices
Innovative Power Module Assembly Solutions
Unlocking the Potential of Nanoscale Conformal Coatings
Recycling vs Circularity: Minimising E-Waste in Manufacturing
MORE TECHNICAL PAPERS
Sponsor
Aim-Solder

REL61: Cost-Effective Soldering, Elevated Performance
Many low/no-silver alternatives save money but fall short in performance. REL61 is different, offering both lower costs and better performance.
AIM Solder
Here's When the New Apple iPhone 17 and MacBooks Are Being Released
Apple plans to launch new iPhones, iPads, MacBook Airs, and a home device in early 2026. The home device, about the size of two iPhones, will serve as a smart command center, controlling locks, lights, sprinklers, and other appliances.
Entrepreneur
Trump hosts Jensen Huang at White House as Nvidia tops $4 trillion market cap
Nvidia CEO Jensen Huang met President Trump at the White House as Nvidia became the first company to close with a $4 trillion market cap. The meeting likely addressed U.S. export controls on Nvidia's AI chips to China, impacting $8 billion in sales.
CNBC
Sponsor
ECD

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
Next-gen Apple Pencil might finally work with your iPhone
Apple's new patent reveals a next-gen Apple Pencil that can draw on non-touch surfaces like iPhones or tabletops using advanced optical sensors. This tech could explain why Apple hasn't yet enabled Pencil support on the Vision Pro headset.
BGR
Adapt or Fade — What Growing Companies Need to Know About Staying Relevant
Growth today depends less on expansion and more on staying relevant. Businesses thrive by listening to customers, adapting quickly, and operating flexibly—turning development into a natural result of responsiveness rather than a standalone objective.
Entrepreneur
Sponsor
Manncorp

In-House Assembly? We Make It Easy
We match you with the right equipment, install it, train your team, run your first jobs, and back it with strong warranties plus expert remote and on-site support.
Manncorp Inc.
Amazon warehouse workers lose jobs after Trump's immigration crackdown: 'We have done everything legally'
After the Trump administration revoked key humanitarian immigration programs, Amazon fired Haitian worker Daphnee Poteau and others lacking renewed work permits. Now facing legal uncertainty, they fear deportation despite contributing to U.S. communities and the workforce.
CNBC
Windows 11 is now the most-used desktop operating system
Windows 11 has overtaken Windows 10 as the most-used desktop OS, now holding 52% of the market. After years of slow growth, stricter hardware requirements, and user hesitation, Microsoft's AI-driven push is accelerating Windows 11 adoption.
Quartz
Sponsor
Plasma-Etch

Plasma Etch PE-Avenger
The PE-Avenger is an ultra low-cost entry level plasma cleaning system allowing more labs to utilize plasma. It's a low frequency plasma cleaner designed for surface activation and organics removal.
Plasma Etch
Mark Cuban says AI could create the first trillionaire – "just one dude in the basement"
Billionaire Mark Cuban predicts AI will create the world's first trillionaire—likely an unknown innovator, not an established mogul. Praising AI's vast potential, he compares its impact to the internet, despite ethical, economic, and environmental concerns.
TechSpot
Tenstorrent Acquires Blue Cheetah, Opens Chiplet Spec
Tenstorrent acquired analog IP firm Blue Cheetah and opened its Open Chiplet Architecture (OCA) to accelerate chiplet adoption. The move strengthens in-house die-to-die capabilities and fosters a scalable, collaborative ecosystem for next-gen silicon diversity.
EE Times
Challenges of Ultra-Fine Feature Printing Optimization of Pb-Free Solder Paste
Advanced semiconductor manufacturing techniques like flip chip, PoP, and SiP demand precise soldering through 50–100 μm stencil apertures, requiring solder pastes formulated with IPC Type 6 or finer powder sizes for reliable miniature solder joints.
Circuit Insight - Materials Tech
Sponsor
Nordson-ASYMTEK

Trailblazing Process News for Conformal Coating
Say goodbye to clogged nozzles and hello to flawless conformal coating with the ASYMTEK Select Coat SL-1040 Ultrasonic Cleaning Station.
Nordson Electronics Solutions
Space industry warns of satellite collision risks as US funding faces deep cuts
A fierce battle is brewing over U.S. space safety as the White House proposes slashing funding for the Office of Space Commerce, risking its TraCSS program. Industry leaders warn this move endangers satellites and weakens U.S. leadership in orbit.
TechSpot
Pick-and-Place Feeder density within SMT and Electronics Assembly
To keep up, P&P machine suppliers must increase feeder density in traditional ways or new creative innovations to better serve the end user.
Circuit Insight - Production Floor
Memory Safety Will Be Key to Tackle Fundamental Cyber Security
The U.K.'s Digital Security by Design initiative showcased CHERI, a memory-safe hardware technology, in London. Experts praised its cybersecurity potential but noted adoption challenges. With 160+ companies involved, standardizing memory safety remains a key priority.
EE Times
Today's Sponsor
Master-Bond
Sponsor
Master-Bond

Electrically Conductive Die Attach Epoxy
Master Bond EP17HTS-DA is a silver filled, die attach adhesive that withstands high temperatures and passes MIL-STD-883J thermal stability requirements.
Master Bond
Test Your Knowledge
What date did man first land on the moon?
See answer below.
Industry Press
AIM Solder Appoints John Daniel Sawali as Sales Engineer in The Philippines
AIM Solder
KYZEN to Highlight Understencil and PCB Cleaners at SMTA Querétaro
KYZEN
Types of PCB Vias - a guide to the 8 different via types
San Francisco Circuits
Cetec ERP Expands into Larger Office to Support Continued Growth
Cetec ERP
SHENMAO Acquires PMTC and Announces Launch of New Low-Temp Solder Alloy
SHENMAO America, Inc.
MORE INDUSTRY PRESS
Infotech-Automation-Inc.
Sponsor
Uyemura

Advances in Final Finishes Push Past the Limits of Conventional Electrolytes
New article explores DIG, RAIG, EPIG, EPAG, and the competition-fueled evolution from mSAP to full semi-additive SAP. Read it here.
Uyemura
Quote of the Day
Silence is one great art of conversation.
Anonymous
Sponsor
Creative-Electron

Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
Summit-Interconnect
Cartoon of the Day
Cartoon
"It's not just you. We're all insecure in one way or another."
Copyright © Randy Glasbergen
Sponsor
Glenbrook-Technologies

Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
Glenbrook Technologies
ECD
Test Your Knowledge Answer
What date did man first land on the moon?
Answer: July 20, 1969