circuitnet
Sponsor
Schunk

Gripping Systems from micro assembly to heavy lifting
The first industrial-suited grippers from SCHUNK were a milestone. Since then we have brought countless newly and further developments to market.
SCHUNK
Ask the Experts
Question About IPC-6013 Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
Can anyone explain why there is no Space and Military addendum for IPC-6013, as available for IPC-6012 and IPC-6018, considering that flex and flex-rigid ...
Responses by:
Manfred Maehl
President, SMT North America, Inc.
Coils Rotated After Reflow
Stencil Pattern for Thermal Pads on QFNs
Component Shifting
What Is Causing Connectors to Bow?
Cleaning No-Clean Solder Paste
Solder Paste Alloy Check
Challenge Wetting Solder to Brass Pins
MORE ASK THE EXPERTS
Nordson-ASYMTEK
Sponsor
Air-Vac-Engineering

Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
Industry Calendar
Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA
Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMTA
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
Oct 1, 2026
Long Island Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Advanced-Interconnections
Sponsor
Plasma-Etch

High power atmospheric plasma system
Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength!
Plasma Etch
What Year Was It?
Atom Bomb Successfully Tested
What Year
The Manhattan Project comes to an explosive end as the first atom bomb is successfully tested in Alamogordo, New Mexico.
See the answer below.
Sponsor
EOS-ESDA-Association

Reimagined EOS/ESD Symposium 2026
Experience the enhanced EOS/ESD Symposium with expanded learning, collaboration, and industry connections. Join experts exploring challenges and solutions in EOS/ESD control. September 28-30.
EOS/ESD Association
ECD
What Year Was It Answer
Atom Bomb Successfully Tested
Answer: July 16, 1945
July 16, 2026
image
Probabilistic Computing Is Already Here; Here Is How It Works
Probabilistic computing advances beyond classical methods by processing uncertainty in hardware. Boeing and Bosch use the technology to accelerate simulations, reduce energy use and enable faster real-time AI while avoiding Monte Carlo computations.
EE Times
Sponsor
BEST-Inc.

Salvaging Electronic Components: Ensuring Economic Reuse
Component salvaging provides a reliable and consistent method of harvesting electronic components, reducing electronic waste, minimizing fabrication of new components, and ensuring economic reuse for automated assembly.
BEST Inc.
From Prototype to Product: Why E-Textile Standards Matter
Standards experts are uniting textiles and electronics to improve e-textile reliability. New testing frameworks for conductive yarns, sensors and smart wearables help manufacturers create safer medical, defense and products while scaling output.
Global Electronics Association
Flux-Free, Reliable, Efficient: Soldering with Formic Acid
Whitepaper shows formic-acid-assisted, flux-free soldering enables reliable, nearly void-free joints for power semiconductors. The technology improves thermal performance and lifespan, offering strong potential for electromobility, renewable energy, and high-frequency electronics.
Technical Paper
How Nidec Is Rethinking Gear Design for Humanoid and Mobile Robots
Nidec Drive Technology showcased precision gearing for humanoid and mobile robots at Automate 2026, featuring strain-wave, cycloidal and planetary systems. It highlighted lightweight, zero-backlash, shock-resistant actuators built to scale with robotics manufacturing.
EE Times
Sponsor
Summit-Interconnect

The Battle for Space Superiority Has Begun
The next conflict may begin in orbit. Learn why resilient space systems and advanced manufacturing matter more than ever.
Summit Interconnect
When Career Risks Are Worth Taking
Software engineers face job changes, making risk unavoidable. The author urges professionals to take calculated risks by joining stronger teams, learning in-demand technologies, and exploring emerging trends to build adaptable skills and growth.
IEEE Spectrum
Issues With SMT Component Alignment
During automatic optical inspection our chip components are shifting. This is not limited to single components and changes daily.
Board Talk
Technical Papers
Flux-Free, Reliable, Efficient: Soldering with Formic Acid
Redesigning Material Logistics for High-Mix EMS Production
Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education
Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse
Digital Warehouse Automation in High-Mix PCB Assembly
Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses
Scaling SMT Traceability
The Drawbacks of Internal Recycling Systems for Solder Dross
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
MORE TECHNICAL PAPERS
Sponsor
Master-Bond

Toughened, Non-Drip Epoxy
Master Bond Supreme 121AOND is a toughened, heat curing adhesive for bonding and sealing applications that offers chemical resistance and a high glass transition temperature.
Master Bond
IBM's stock just had its worst day since 1968
IBM warned investors that AI-driven spending shifts weakened second-quarter results as customers delayed mainframe purchases in favor of GPUs, memory and storage. Despite 1% revenue growth to $17.2 billion, infrastructure sales fell, triggering a record 25% drop in stock.
TechSpot
Taiwan and US to jointly produce drone, source says
Taiwan and the US plan to jointly produce NCSIST's Mighty Hornet I attack drone pending approvals, boosting defense ties and exports. The deal advances Taiwan’s asymmetric warfare strategy and expands defense manufacturing through unmanned systems.
Taipei Times
Industry 4.0 for Inspection in the Electronics Industry
This paper investigates how the connected at-line x-ray system can improve production yield and lower costs when connected to the production line.
Technical Paper
Sponsor
DL-Technology

EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
Samsung introduces Flex Titanium, a new foldable screen tech with reduced creasing
Samsung unveiled Flex Titanium display technology for its next Galaxy foldables, combining ultra-thin titanium components to boost durability, improve flexibility, and reduce screen creases. The innovation will debut at the Galaxy Unpacked event, strengthening foldable smartphone appeal.
TechSpot
India bets billions on breaking China's grip on smartphone manufacturing
India launched $19.8 billion in new smartphone and semiconductor incentives to deepen local manufacturing, boost research, and reduce reliance on China. The five-year plan aims to strengthen supply chains, create jobs, and increase India's role in global electronics production.
TechCrunch
Conductive Cu Paste as a Via Filling Material for Through Glass Via (TGV)
We developed a Cu paste that can be used as a filling material for a through-glass via (TGV). A TGV substrate can be filled with Cu paste without voids.
Technical Paper
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
Who Owns QLED Technology?
Samsung pioneered cadmium-free QLED technology, patented it in 2016, and shared it with Hisense and TCL through the QLED Alliance. The partnership expanded QLED adoption while reinforcing Samsung's leadership in advanced TV displays & global technology influence.
BGR
Taiwan manufacturers adopt AI to speed up server production
Taiwanese manufacturers use AI to accelerate server production as Foxconn and Wistron automate assembly, improve efficiency and detect defects. The adoption fuels Taiwan's AI server boom, driving ICT equipment exports up 83.8% year on year.
Taiwan News
Sponsor
Viscom-SE

Viscom at SMTA Michigan & Ohio
Join Viscom at SMTA Michigan (8/18/26) and Ohio (8/20/26) to discover the latest advancements in AOI and AXI inspection technology, including our powerful AI solutions.
Viscom SE
Gartner Predicts At Least 15% of Nations in Volatile Geopolitical Zones Will Establish Data Embassy Agreements by 2029
By 2029, Gartner predicts nations in volatile regions will adopt data embassies, hosting critical infrastructure abroad to boost cyber resilience, reduce concentration risks and keep services running while preserving legal sovereignty over data.
Gartner
Pad-to-Pad Electrical Field Effects on Surface Insulation Resistance
In this paper, we examine the effect that various design factors of SIR test patterns has on the electric field on the surface of the PCB.
Technical Paper
AI computing demand lifts fiber prices and volume
AI-driven data center growth accelerates demand for high-speed optical interconnects, pushing Chinese fiber makers to expand capacity. Rising fiber prices since late 2025 reflect demand, strengthening growth as AI infrastructure spending surges.
Digitimes
Your Biggest AI Cost Isn't the Technology — It's the Hidden Debt Quietly Draining Your Budget
AI technical debt cuts enterprise returns as old infrastructure, poor data, fragmented tools and weak governance raise costs. Experts urge firms to audit systems, remove AI projects and modernize foundations before scaling investments to improve ROI.
Entrepreneur
Sponsor
AI-Technology-Inc

TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology, Inc.
Bananas Might Be The Key To New, Sustainable Textiles
Researchers are turning banana waste into textile fibers that could replace resource-intensive cotton. Fibers from discarded pseudostems reduce waste while creating breathable fabrics, helping fashion brands cut emissions, water use and pollution.
BGR
Today's Sponsor
Glenbrook-Technologies
Sponsor
Glenbrook-Technologies

X-Ray Inspection Verifies Quality of Complex PCBs
A Netherlands-based PCB supplier relies on real-time X-ray inspection to ensure the quality of HDI, hybrid, multi- layer, flex-rigid & other complex boards.
Glenbrook Technologies
Test Your Knowledge
There were 1,000 Internet devices in 1984, 1 million in 1992, by 2025 how many Internet devices are there? 100+ million, 5+ billion, 40+ billion, or over 1 trillion
See answer below.
Industry Press
KYZEN's Chelsea Jewell Named to SMTA Next Gen 10 List of Emerging Leaders
KYZEN is proud to announce that Chelsea Jewell, who serves as Manager of the KYZEN Applications Laboratory in Nashville, TN, has been recognized as an emerging ...
KYZEN
YINCAE Introduces UF 66UV UV/Thermal Dual-Cure Optical Underfill
YINCAE Advanced Materials is pleased to announce the launch of UF 66UV, a next-generation UV and thermal dual-cure underfill designed for advanced optoelectronic ...
YINCAE Advanced Materials, LLC
Yamaha Robotics to focus on assembly & Inspection innovations at EFX 2026
Visit Yamaha Robotics at EFX 2026, Booth 9B50, Hall 9, October 6-8. Yamaha Robotics will show visitors to EFX 2026, the Expo for Electronics Manufacturing, in Stuttgart ...
Yamaha Robotics
ESD Reports Electronic System Design Industry Posts $5.7 Billion in Revenue
Electronic System Design (ESD) industry revenue increased 12.7% to $5,747.8 million in the first quarter of 2026 from the $5,098.3 million registered in the firstquarter ...
SEMI
Littelfuse Launches FlatSuppressX™ TP5.0SMD-FL & TP1KSMB-FL TVS Diodes
Littelfuse, Inc. announced the TP5.0SMD-FL (5 kW) and TP1KSMB-FL (1 kW) Series FlatSuppressX™ TVS Diodes, designed to protect 48 V automotive electronics from ...
Littelfuse
Federal Electronics Expands Advanced Manufacturing Capabilities
Federal Electronics has expanded its cable assembly and wire harness manufacturing capabilities and production capacity to support the growing needs of military, defense ...
Federal Electronics
Kurtz Ersa Returns to SMTA Querétaro - Solutions for Production Challenges
Kurtz Ersa Inc. will exhibit at the SMTA Querétaro Expo & Tech Forum on July 16 in Querétaro, Mexico. Visitors are invited to stop by the Kurtz Ersa booth to learn more ...
Kurtz Ersa Inc.
MORE INDUSTRY PRESS
Viscom
Sponsor
kyzen

Electronic Assembly Cleaning Basics
Monitoring & effectively controlling chemistry concentration when cleaning electronic assemblies is crucial for maintaining optimal cleanliness results & preventing costly consequences.
KYZEN
Quote of the Day
"Opportunity is missed by most people because it is dressed in overalls and looks like work."
Thomas Edison
Sponsor
Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Zestron
Cartoon of the Day
Cartoon
"Don't think of me as a 54 year old applicant. Think of it as getting two 27 year olds for the price of one!"
Copyright © Randy Glasbergen
Sponsor
Circuitnet

"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC
Circuit-Technology-Center
Test Your Knowledge Answer
There were 1,000 Internet devices in 1984, 1 million in 1992, by 2025 how many Internet devices are there? 100+ million, 5+ billion, 40+ billion, or over 1 trillion
Answer: In 2025, the number of connected devices has skyrocketed beyond 40 billion.