Is There a Spec for LDI Mask thickness?
Is there is a spec for LDI mask thickness? We build very small circuits with fine pitch small ball flip chips with very limited wet out area for the underfill. We have a very ...
Responses by:
Carlos Bouras
General Manager, Nordson SELECT
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Sponsor
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Unlock the Potential of Salvaged Devices
Component harvesting is a reliable method of electronic component reclamation, reducing e-waste and ensuring economic reuse for automated assembly.
BEST Inc.
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What Year Was It?
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The day was Sep 17. What year was it?
Battle of Antietam
Confederate and Union troops in the Civil War clash near Maryland's Antietam Creek in the bloodiest one-day battle in American history.
See the answer below.
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Sponsor
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Automated Storage for High-Mix EMS Production
High mix electronics manufacturing requires reliable material management. This white paper explains how BMK enhanced traceability, inventory accuracy and picking efficiency using integrated automated storage, digital workflows and reel-level visibility.
Essegi Automation
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What Year Was It Answer
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Battle of Antietam
Answer: September 17, 1862 |
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Sponsor
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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond
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Will China close the technology gap with the US?
The US and China are racing to develop advanced AI models as competition intensifies. Chinese developers are narrowing America's lead despite technology restrictions, while both governments raise security concerns and clash over allegations of AI capability theft.
Taipei Times
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Digital Warehouse Automation in High-Mix PCB Assembly
High mix SMT production demands full material visibility. This white paper shows how ASTER improved traceability, inventory accuracy and FIFO control through integrated automation and reel-level tracking across warehouse operations.
Technical Paper
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Sponsor
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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
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Smarter Cameras Need More Than Edge AI to Protect Privacy
Axis uses edge AI to analyze video, blur identities and detect workplace hazards while processing data locally. Cameras limit cloud transmission and protect identifiable footage with encryption, access controls and cryptographic signatures.
EE Times
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Sponsor
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Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect
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Rethinking Robot Safety in the Age of AI
Physical AI faces new safety risks as attackers manipulate robot sensors and decisions. Research on BadVLA and GoBA shows hidden triggers can alter robotic actions while preserving normal performance, exposing vulnerabilities in complex AI systems.
IEEE Spectrum
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Gartner Forecasts Worldwide AI Spending to Grow 49.5% in 2026
Gartner forecasts global AI spending will reach $2.7 trillion in 2026, rising 49.5% annually. Strong infrastructure demand, embedded agentic AI, custom applications and generative AI models drive investment as enterprises pursue automation, efficiency and tailored solutions.
Gartner
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The people not worth replacing
Communities increasingly oppose data centers as resource-heavy projects create few local jobs while concentrating profits elsewhere. The debate highlights fears that an AI economy may require more infrastructure than people, fueling concerns over economic relevance.
Taipei Times
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Global power grid to struggle, TrendForce says
TrendForce forecasts global data center power demand will surge to 490.7GW by 2030, while available grid capacity reaches just 222.6GW. Rising AI infrastructure needs and grid delays threaten to widen electricity supply shortages, particularly after 2028.
Taipei Times
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CGA Trends and Capabilities
The Column Grid Array (CGA) module is a high reliability JEDEC format package, with several options adaptable to end user needs.
Technical Paper
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Sponsor
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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C.
Ormet® TLPS
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Sponsor
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EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
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Sponsor
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Maximize Yield with Patented Vacuum Reflow
Heller's innovative, patented vacuum reflow solves the throughput bottleneck by shortening cycle times for maximum yield and minimal voiding. Experience the speed with us.
Heller Industries
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Sponsor
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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Test Your Knowledge
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What planet is nearest to the Sun?
See answer below.
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| Industry Press |
Indium Corporation Promotes Chris Bastecki to Business Unit Vice President
Indium Corporation is pleased to announce the promotion of Chris Bastecki to Business Unit Vice President, Americas Sales & Service and Global Printed Circuit Board (PCB) ...
Indium Corporation
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Mycronic appoints Nomination Committee
The Nomination Committee for Mycronic's 2027 Annual General Meeting has been appointed in accordance with the instructions for the Nomination Committee ...
Mycronic AB
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Yamaha delivers big gains in small space as Miltronik invests in YRi-V 3D AOI
A lack of floorspace and legacy constraints could have prevented design and manufacturing specialist Miltronik from taking the next step in continuously improving ...
Yamaha Motor Europe N.V.
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Alps Electric EMS Achieves ISO 13485 Certification
Alps Electric EMS has achieved ISO 13485 certification, marking an important milestone in the company's continued growth as a trusted high-reliability manufacturing ...
Alps Electric EMS
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American Hakko Highlights FX-97X Series of Soldering and Rework Stations
American Hakko Products, Inc. highlights its FX-97X Series of soldering and rework stations, including the FX-971, FX-972 and FX-973.
Designed to support ...
American Hakko Products, Inc.
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KIC to Showcase Automatic Profiling and Present at SMTA Long Island Expo
KIC will exhibit at the SMTA Long Island Expo & Tech Forum on Thursday, October 1, 2026, at the Marriott Melville Long Island in Melville, New York. KIC General ...
KIC
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Circuit Solutions to Feature Kurtz Ersa Soldering Systems at SMTA Empire and Long Island Expos
Kurtz Ersa Inc. will be represented by its authorized distributor Circuit Solutions at two upcoming New York SMTA events. The representative will feature the HOTFLOW ...
Kurtz Ersa North America
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MORE INDUSTRY PRESS
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Quote of the Day
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"I think computer viruses should count as life. I think it says something about human nature that the only form of life we have created so far is purely destructive. We've created life in our own image."
Stephen Hawking
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Sponsor
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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| Cartoon of the Day
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"There aren't any icons to click. It's a chalk board."
Copyright © Randy Glasbergen
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Test Your Knowledge Answer
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What planet is nearest to the Sun? Answer:
Mercury (35.98 million miles), and then Venus, Earth, Mars, Jupiter, Saturn, Uranus, Neptune - and Planet Nine |
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