May 19, 2026

New Power, Memory, Interconnect, and Thermal Architectures for AI Infrastructure AI infrastructure is pivoting from training to inference, driving companies to redesign data centers around power efficiency, SRAM-centric architectures, advanced cooling, and faster interconnects to overcome thermal, memory, and scaling bottlenecks. EE Times

Sponsor Elevate Your Electronics Expertise Explore ZESTRON whitepapers written by experts on cleaning, coating, and improving PCB reliability. Download now. ZESTRON Europe

Five Years Into Remote Work, Here's What Actually Works for Businesses Five years after the shift to remote work, companies continue to redefine workplace models, with some returning to offices, others embracing remote setups, and many testing hybrid approaches, as they struggle to implement systems that balance performance and employee needs. Entrepreneur

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics Electrostatic discharge (ESD) threatens IoT and high-reliability electronics as components shrink and densify. This paper details design protections, assembly controls, and validation methods to help engineers and OEMs enhance device resilience and ensure long-term performance. Technical Paper

Intel CEO says foundry business is gaining momentum as customer interest grows Intel CEO Lip-Bu Tan says the company's foundry business is gaining traction, with improving 18A yields, rising customer interest, and potential major deals. He frames it as central to Intel's turnaround and U.S. semiconductor reshoring efforts. CNBC

Sponsor The Industry Standard Solder Paste Looking to Avoid the Void® and enhance SIR performance? Indium8.9HF is your proven, versatile and stable, no-clean, halogen-free, Pb-free solder paste solution. Indium Corporation

Dell makes its strongest case yet for keeping AI out of the cloud Dell argues cloud-only AI is losing ground as enterprises adopt hybrid architectures spanning on-prem, cloud, and workstation compute. At Dell Technologies World, it showcased AI Factory upgrades, growing customer adoption, and services aimed at moving AI from pilots to production. TechSpot

Supercooled Solder Pastes in Low-Temperature Attach Applications This paper presents progress-to-date using supercooled solder pastes of core-shell bismuth-tin (BiSn) particles to accomplish solder interconnects below the melting point of the alloy. Comparisons between supercooled BiSn solder pastes and traditional BiSn pastes are discussed. Technical Paper

Technical Papers ■ Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses ■ Scaling SMT Traceability ■ The Drawbacks of Internal Recycling Systems for Solder Dross ■ Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics ■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible ■ PCB Rework Evolves, With X-ray a Constant Support ■ How pH Cleaning Agents Affect Production Performance ■ A Universal AI-Powered Segmentation Model for PCBA & Semiconductor ■ RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG ■ High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin MORE TECHNICAL PAPERS

Sponsor What are your economic depaneling needs? Our depaneling machines are high-performance machines for single circuit boards with electronic components. The cutting principles are fast, the best quality. SCHUNK

Canada Spins Off Photonics Lab Canada will spin off the Canadian Photonics Fabrication Center into a commercial entity to attract investment, expand compound semiconductor production, and boost sovereign AI, defense, and telecom capabilities as the NRC shifts the facility toward industry-led growth. EE Times

4 Roles Most Likely to Survive AI — and How to Position Yourself For Them AI is rapidly reshaping hiring as companies prioritize leaders in AI governance, data strategy, product management, and HR transformation. Experts who blend judgment, cross-functional leadership, and measurable business impact remain hardest to replace. Entrepreneur

QFN I/O Pad Solder Paste Overprint on Thermal Pad Void Reduction QFN SMT components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performance and reliability. Technical Paper

Sponsor Probe Card Manufacturer 'Sees the Unseen' With X-ray Probe card manufacturer relies on mobile real-time x-ray inspection to verify the quality of its aligned probes at different stages along the assembly line. Glenbrook Technologies

What Makes a Job Dull, Dirty, or Dangerous? Researchers challenged robotics' long-used "dull, dirty, and dangerous" model, arguing job classifications reflect cultural views. Their study urges roboticists to use worker insights and data to target automation that genuinely improves safety. IEEE Spectrum

Meta layoffs starting this week stress harsh AI reality inside Zuckerberg’s company Meta is accelerating layoffs and AI spending as Mark Zuckerberg pushes efficiency and automation over past overhiring. Employees report rising anxiety over job cuts, AI-driven workplace shifts, and controversial monitoring tools tied to Meta's aggressive AI strategy. CNBC

How To Rework Warped PCBAs? From a large lot, 20 populated boards with components of varied heights on both sides are warped. What methods can they use to flatten them? Board Talk

Sponsor Silver Filled Electrically Conductive Epoxy Master Bond EP3HTSDA-2Med is a silver filled adhesive system with high electrical and thermal conductivity that passes ISO 10993-5 for cytotoxicity. Master Bond

How Melbourne's AI and Data Center Flywheel Is Accelerating Research Innovation Melbourne is evolving from a global events capital into an AI powerhouse, expanding sovereign compute capacity, hyperscale data centers, and global partnerships. Monash University's MAVERIC supercomputer boosts AI research across medicine, engineering, and science. IEEE Spectrum

Gartner Says Chief Supply Chain Officers Must Shift to an Autonomous Business Mindset Gartner urges chief supply chain officers to prepare for autonomous business models blending human and machine decision-making as adaptive technologies reshape operations, forcing firms to redesign strategies, manage risk, and coordinate networks. Gartner

Sponsor ASYMTEK Select Coat SL-1040 The SL-1040 Conformal Coating System upgrades the SL-940 and added significant system-level advancements to elevate automation, control, precision & preventative maintenance for better yield. Nordson Electronics Solutions

High energy prices could derail Europe's AI race with U.S. and China Europe's AI ambitions face rising pressure as soaring energy costs threaten data center expansion. Experts warn expensive electricity, slow infrastructure growth, and surging power demand could shift major AI investment to the U.S. and China. CNBC

Optimizing Throughput and Cost with Manufacturing Simulation This paper describes the design and implementation of several manufacturing simulation use-cases at an electronics assembly factory in Nanjing, China. Technical Paper

Thermal Paste vs Pad: Which Is Better For Your PC? Thermal paste continues to outperform thermal pads in cooling tests, despite newer pad technologies narrowing the temperature gap. Paste spreads into microscopic gaps more effectively, while pads offer easier application, and cleaner installation for beginner PC builders. BGR

Electric Cars Were Invented Much Earlier Than You Think Electric vehicles trace their origins nearly 200 years back, starting with Robert Anderson's crude prototype and later advancing through innovators like William Morrison and Studebaker. By the early 1900s EVs made up over one-third of vehicles roads. BGR

Sponsor SEHO makes production lines smarter Improve your work flow and reduce manufacturing costs with creative ideas and innovative solutions for automation, board handling and material management. SEHO Systems GmbH

Samsung Plans To Transform Your Smartphone & Tablet Into On-Device AI Powerhouses With High-Bandwidth Memory Chips Using Complex Packaging Samsung develops advanced HBM packaging for smartphones and tablets to boost on-device AI performance with faster bandwidth and better heat control. Its FOWLP and VCS innovations aim to deliver server-grade memory speeds to future mobile chips. wccftech