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Sponsor
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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Competing Reflow Oven Zones
We have an 8 zone reflow oven in our SMT production line. We recently purchased an oven profiler and I'm having some issues with our tin lead process. There is a fairly ...
Responses by:
Richard D. Stadem
Advanced Engineer/Scientist, General Dynamics
Fred Dimock
Manager, Process Technology, BTU International
Carlos Bouras
General Manager, Nordson SELECT
Tim O'Neill
Director of Product Management, AIM
Bjorn Dahle
President, inspīre solutions LLC
Tony Lentz
Field Applications, FCT Assembly
Georgian Simion
Engineering and Operations Management, Independent Consultant
Richard Burke
National Sales Manager, Datapaq
Rick Kompelien
Principal Product Engineer, Benchmark Electronics, Inc.
Mark Waterman
M.O.L.E. Line Product Manager, Electronic Controls Design, Inc. (ECD)
Paul Austen
Senior Project Engineer, Electronic Controls Design Inc
Kevin Pigeon
Senior Applications Manager, AIM Solder
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Sponsor
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Simply Double the Production Volume
SEHO SelectLine features the award-winning Synchro and SmartSplit production modes that allow to halve cycle times in batch production and mixed operation. Find out more.
SEHO Systems GmbH
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Sponsor
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EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
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What Year Was It?
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The day was Oct 29. What year was it?
John Glenn Returns to Space
Nearly four decades after he became the first American to orbit the Earth, Senator John Hershel Glenn, Jr., is launched into space again as a payload specialist aboard the space shuttle Discovery.
See the answer below.
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Sponsor
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iX7059 SMT Edition: Next-Gen 3D X-ray
Experience high-precision inline 3D X-ray inspection by Viscom with AI-powered defect detection, exceptional image quality, and reliable performance for complex SMT assemblies.
Viscom SE
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What Year Was It Answer
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John Glenn Returns to Space
Answer: October 29, 1998 |
Excess Electronic Components Could be Someone Else's Supply
AI-driven demand is tightening component supplies, extending lead times and raising prices. Analysts urge procurement teams to tap surplus inventory from cancelled orders, revised forecasts & obsolete designs to secure parts & ease shortages across electronics manufacturing.
Sourceability
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Sponsor
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Optically Clear Nanosilica Filled Epoxy
Master Bond EP4NS-80 is a low viscosity epoxy for bonding and sealing that possesses excellent dimensional stability, low CTE and minimal shrinkage upon curing.
Master Bond
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Intel Wants a Quantum Business, Classiq Could Help Build One
Intel plans to acquire Classiq to bring its quantum computing research to market, combining quantum hardware, control electronics and software with enterprise algorithm design. The deal positions Intel to pursue commercial opportunities across diverse quantum platforms.
EE Times
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North American EMS Orders Climb Despite Lower September Shipments
The Global Electronics Association reports a 1.68 EMS book-to-bill ratio for September 2026, as bookings rose 41.7% year over year while shipments fell 10.8%. Year-to-date bookings climbed 19.3%, signaling strong demand and longer lead times.
Global Electronics Association
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Sponsor
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3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch
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Sponsor
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Professional BGA Component Reballing
Need to restore a BGA component? Our controlled reballing process includes solder ball removal, precision reballing, custom fixtures, and rigorous inspection for reliable results.
Circuit Technology Center
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Systems Thinking Is Vital in the Age of AI
AI is reshaping engineering by helping professionals explore designs, analyze research, and test solutions. Engineers must combine AI capabilities with human judgment, specialist expertise, systems thinking, and adaptability to ensure safe, and practical, responsible outcomes.
IEEE Spectrum
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iPhone Duo vs. Pixel 11 Pro Fold: Which Foldable Is Right For You?
Apple's iPhone Duo emphasizes widescreen entertainment, compact design and refined software, while Google's Pixel 11 Pro Fold delivers camera versatility and multitasking. Both cost about $1,900 but target different preferences in the growing foldable-phone market.
BGR
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New growth drivers, policy push raise industrial profits
China's industrial profits rose 15.5% to 6.03 trillion yuan in the first three quarters of 2026, driven by booming electronics and high-tech manufacturing. Officials urged stronger domestic demand & continued technological upgrades to sustain growth & address sectoral weaknesses.
China Daily
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Sponsor
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Sponsor
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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process — especially those with vacuum — is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
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Test Your Knowledge
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List the date of these inventions in chronological order: Nylon, Stainless Steel, Plastics
See answer below.
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| Industry Press |
Rehm Thermal Systems Introduces Vision RCC
Rehm Thermal Systems has launched the new Vision RCC, an innovative reflow soldering system specifically developed to meet the requirements of heavy and complex ...
Rehm Thermal Systems GmbH
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TRI Receives the 2026 Global Technology Award for AI Verify Host
Test Research, Inc. announces that the company's AI-Powered Repair Station, AI Verify Host, received a 2026 Global Technology Award in the Software Process ...
Test Research, Inc.
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KYZEN's MICRONOX® MX2123 Earns Global Technology Award for Cleaning Materials
KYZEN is proud to announce that its MICRONOX® MX2123 was honored with a 2026 Global Technology Award in the Cleaning Materials category. The award was ...
Kyzen Corporation
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AI is splitting the PCB industry in two
The printed circuit board industry closed 2025 at about $88 billion in revenue, and a conservative forecast puts it at $140 billion by 2031, following an 8.1% CAGR. ...
YOLE Group
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BW Packaging expands Hayssen portfolio with new X650 long-dwell flow wrapper
BW Packaging, Barry-Wehmiller's packaging machinery business, has unveiled the Hayssen X650, a long-dwell, bottom-fed flow wrapper engineered to help manufacturers ...
BW Packaging
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Essemtec Opens New U.S. Headquarters and Advanced Demo Center in Greater Boston
Essemtec is proud to announce the official opening of its new U.S. Headquarters and Customer Demonstration Center in Woburn, Massachusetts. The milestone was ...
Essemtec AG
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MORE INDUSTRY PRESS
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Quote of the Day
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Following a precedent is an easy substitute for thinking.
Anonymous
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| Cartoon of the Day
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"You've been losing market share for years, profits and stock values have plummeted, and you've lost your way. What this company needs now is a good old fashioned Capitalist Pig!"
Copyright © Randy Glasbergen
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Sponsor
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Boost Reballing with EZReball Preforms
EZReball reballing preforms provide fast, clean, and accurate reballing of complex BGA packages while eliminating traditional complexities and the need for operator dexterity.
BEST Inc
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Test Your Knowledge Answer
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List the date of these inventions in chronological order: Nylon, Stainless Steel, Plastics Answer:
Plastics 1868, Stainless Steel 1913, Nylon 1938 |
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