circuitnet
Sponsor
Schunk

Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK
Ask the Experts
Pre-bake in a Vacuum
Can the time for pre-baking of components and bare PCBs to eliminate moisture be reduced by using a vacuum oven? What percent of bake time reduction 
Responses by:
Richard D. Stadem
Advanced Engineer/Scientist, General Dynamics
Paul Austen
Senior Project Engineer, Electronic Controls Design Inc
Richard D. Stadem
Advanced Engineer/Scientist, General Dynamics
Mark Finstad
Senior Applications Engineer, Flexible Circuit Technologies
Bhanu Sood
Laboratory Director, CALCE, University of Maryland
Fritz Byle
Process Engineer, Astronautics
Georgian Simion
Engineering and Operations Management, Independent Consultant
Considering Plasma Cleaning
Critical Part Fixture During Reflow
Causes of Annular Ring Dewetting
Class 2 vs. Class 3
Challenges Placing RF Shields During SMT Assembly
3D AOI Solder Joint Qualification Parameters
Solder Contamination Sources
MORE ASK THE EXPERTS
Circuit-Technology-Center
Sponsor
Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Industry Calendar
Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA
Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMT
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
Oct 1, 2026
Long Island Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Master-Bond
Sponsor
SEHO

Wave Soldering Processes Rethought
As a pioneer in the development of automated soldering technologies, SEHO is setting global standards today more than ever with outstanding features. Find out more.
SEHO Systems GmbH
What Year Was It?
Pony Express Debuts
What Year
The first Pony Express mail, traveling by horse and rider relay teams, simultaneously leaves St. Joseph, Missouri, and Sacramento, California.
See the answer below.
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
Viscom-SE
What Year Was It Answer
Pony Express Debuts
Answer: April 3, 1860
April 3, 2026
image
Quantum Computers Might cCrack Today's Encryption Far Sooner Than We Thought
New research reveals quantum computers could crack RSA and ECC encryption much sooner and with fewer qubits than anticipated. Scientists warn that current cryptography, including blockchain, faces immediate threats, spurring a rapid push toward post-quantum security standards.
TechSpot
Sponsor
Alltemated

Seeking Alternatives for Dispensed Adhesives?
No more dispensing, no more curing. PLACE-N-BOND™ Underfilm is pre-formed adhe-sive for automated placement. Learn more.
Alltemated, Inc.
From Zero-Carbon Factories to Reporting Environmental Impact: Sustainability Takeaways from APEX EXPO 2026
At APEX EXPO 2026, the electronics industry showcased sustainability in action, from Panasonic's zero-carbon factory plan to Jabil's early emission reductions. Companies use data, AI, and smarter processes to cut waste, improve efficiency, and gain a competitive edge.
Global Electronics Association
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Technical Paper
Foxconn rotates CEO to Michael Chiang to tighten profit discipline and governance
Foxconn completed its rotating CEO transition on April 1, appointing Michael Chiang as the new chief executive effective immediately. Kathy Yang stepped down after finishing her term, marking a smooth leadership handover at the electronics manufacturing giant.
Digitimes
Sponsor
Plasmatreat-GmbH

Low Pressure Plasma for Electronics
Expand your knowledge of plasma technology. Register now for the new PlasmaTalk webinar to learn how low-pressure plasma can advance your production.
Plasmatreat
Humanity returns to the Moon, but Outlook still doesn't work
NASA's Artemis II astronauts faced a surprisingly familiar hurdle on their historic lunar mission: Microsoft Outlook wouldn't start. Livestream clips showed duplicate windows and minor glitches, highlighting Windows 11 quirks amid humanity's first journey beyond Earth in 50+ years.
TechSpot
Combined Alloy and Flux Approach Cost-Effective Reliable Solder Joints
This paper shows alloy and flux properties as well as temperature cycle test results comparing SAC305 and Innolot® solder pastes.
Technical Paper
Technical Papers
Scaling SMT Traceability
The Drawbacks of Internal Recycling Systems for Solder Dross
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible
PCB Rework Evolves, With X-ray a Constant Support
How pH Cleaning Agents Affect Production Performance
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin
Understanding Solder Dross: Causes and Control Strategies
MORE TECHNICAL PAPERS
Sponsor
SEIKA-America

Sawa Ecobrid Fully Automatic Stencil Cleaner
This cleaner has 2 ultrasonic cleaning head panels for cleaning the front & back sides together. Ultrasonic energy is applied directly to the stencil.
Seika
Artemis II crew clears Earth orbit, heads for the moon
Artemis II astronauts executed a critical trans-lunar injection burn, accelerating Orion to escape Earth's gravity and begin a moon-bound trajectory. The mission tests spacecraft systems and procedures, paving the way for future lunar landings and sustained human presence.
CBS News
From MOUs to Markets: Transatlantic Deals Face Reality Test
Transatlantic tech partnerships are moving from symbolic deals to execution-driven markets, forcing companies to align engineering, policy, and capital to turn MOUs into real programs as funding, procurement, and interoperability dictate success in space and electronics.
EE Times
What Causes Solder Balls During Hand Soldering?
To many operators believe the old myth that flux is your friend and you can never have to much flux. That is not true as to much flux will outgas at the end of the hand soldering process creating solder balls around the connection. This is one possible explanation as others have stated other causes as well.
Board Talk
Sponsor
AI-Technology-Inc

Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
Young Professional's AI Tool Spots Mental Health Conditions
Abhishek Appaji advances accessible healthcare by combining AI, biomedical engineering, and neuroscience, developing retinal scanners and smart beds that improve care for underserved communities, earning the IEEE Theodore W. Hissey Outstanding Young Professional Award.
IEEE Spectrum
Astronauts begin NASA mission to pass by the moon
Four astronauts launched aboard a NASA rocket, beginning the first crewed lunar flyby in over 50 years. The team entered Earth orbit, tested spacecraft systems, and reported minor issues, while officials celebrated the mission as a major step toward returning humans to the moon.
Taipei Times
Fine Pitch Solder Joint Fuze Electronics Under Mechanical Shock Loads
The survivability of 0.4mm pitch and 0.5mm pitch parts at acceleration levels upto 50,000g have been studied for bare test boards.
Technical Paper
Sponsor
Smart-Sonic

Eliminate Worry of Cross Contamination
While Models 529 and 1550 are similar semi-automatic cleaners with single wash and rinse tanks, the Model 2003 includes 2 wash tanks for cleaning multiple applications in one machine.
Smart Sonic
Apple reportedly has four new products ready to launch, pending one thing
Apple has several products ready for launch, but delays to its upgraded Siri are holding them back. The postponed AI features, now expected with iOS 27, have pushed back devices like Apple TV 4K and HomePod mini 2.
9 To 5 Mac
Wi-Fi That Can Withstand a Nuclear Reactor
Researchers engineered a radiation-hardened Wi-Fi receiver that withstands up to 500 kGy, enabling wireless control of decommissioning robots inside nuclear reactors. The breakthrough cuts human exposure and boosts efficiency in dismantling aging nuclear facilities.
IEEE Spectrum
Sponsor
Intraratio-Corporation

See How Proven Leaders Make Operational Success Happen
4-part series addressing head-on the challenges faced by manufacturing operations in today's highly complex and hyper-competitive environment. No registration required.
Intraratio
There's Something on the Moon That Earth Desperately Needs — And It Could Be Worth Trillions
NASA's Artemis II mission propels lunar colonization plans, eyeing helium-3 for fusion energy. Scientists and companies target water ice extraction and off-world industries, aiming to reduce Earth's energy strain while igniting a new, sustainable space economy.
Entrepreneur
Atomristors: Non-Volatile Resistance Switching in 2D Monolayers
Researchers discovered the first two-dimensional material, graphene, which consists of only a single layer of atoms13.
Technical Paper
Can Global Memory Chip Shortage Drive Applied Materials' Growth?
Applied Materials surges on AI chip demand, capitalizing on memory shortages and premium process pricing. Strategic R&D partnerships and a diverse portfolio drive growth, even as weak consumer electronics and rising competition challenge the company through 2026.
Quartz
Bell Called Watson; Today, We Call AI
From Alexander Graham Bell’s first call to today's AI era, telecom operators invest heavily in 5G yet face weak returns. Industry leaders at Mobile World Congress 2026 say AI-driven services and enterprise solutions now offer a clearer path to monetization.
EE Times
Sponsor
ECD

Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD
Energy Is Becoming the Defining Bottleneck of the AI Era. Here's What That Means for Entrepreneurs.
The AI boom is driving massive electricity demand, straining power grids beyond capacity. As data centers expand rapidly, energy costs rise and infrastructure lags, making power—not algorithms—the key constraint shaping AI's future & a critical risk for unprepared entrepreneurs.
Entrepreneur
Today's Sponsor
BEST-Inc.
Sponsor
BEST-Inc.

Unlock the Potential of Salvaged Devices
Component harvesting is a reliable method of electronic component reclamation, reducing e-waste and ensuring economic reuse for automated assembly.
BEST Inc.
Test Your Knowledge
In which country was the wheelbarrow invented?
See answer below.
Industry Press
KYZEN to Highlight Post Process Cleaning Chemistry KYZEN LX314 at RAPID+TCT
KYZEN will exhibit at RAPID + TCT 2026, scheduled to take place April 14-16, in Boston, MA. The KYZEN Clean Team will be on-site at Booth #2337 discuss their safe ...
KYZEN
Kurtz Ersa Discusses Smarter Flexible Soldering Solutions at 3 SMTA Expos
Kurtz Ersa Inc. will exhibit at three upcoming SMTA regional events this April, connecting with electronics manufacturers across North America to share its latest ...
Kurtz Ersa Inc.
Leonard Polte Named Solder Chemistry Field Sales Manager
Solder Chemistry announced the appointment of Leonard Polte as Field Sales Manager. In this role, he will be responsible for developing and managing strategic customer ...
Solder Chemistry
Eastek International Corp. Appoints David Strabel as VP of Manufacturing
Eastek International Corporation announces the appointment of David A. Strabel as Vice President of Manufacturing. In this role, Strabel will lead global ...
Eastek International Corporation
Hanwha Semitech Americas Appoints Process Automation & Tool
Hanwha Semitech Americas is pleased to announce the appointment of Process Automation & Tool, LLC to serve customers across Georgia, Alabama, Mississippi, ...
Hanwha Semitech Americas
Seika Machinery Unveils Slot-Die Coater by infinityPV
Seika Machinery, Inc. is pleased to introduce the Slot-die Coater by infinityPV, a compact, state-of-the-art system designed for precise and consistent thin-film ...
Seika Machinery, Inc.
Rehm Thermal Systems to Attend All Major SMTA Expos in Mexico Again in 2026
Strong presence in a dynamically growing electronics market: Rehm will accompany the most important SMTA Expos 2026 in Monterrey, Ciudad Juárez, Querétaro, ...
Rehm Thermal Systems
MORE INDUSTRY PRESS
kyzen
Sponsor
Manncorp

Built to Scale. Proven in Production.
Microsystems World CNC boosted throughput and automation by trading up to a complete inline SMT solution—powered by Manncorp and designed for long-term growth.
Manncorp Inc.
Quote of the Day
To me, old age is always 15 years older than I am.
Bernard M. Baruch
Sponsor
DL-Technology

EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
Air-Vac-Engineering
Cartoon of the Day
Cartoon
"My calender is way overbooked and I'm three months behind in my work -- I don't have time to attend a time management seminar!"
Copyright © Randy Glasbergen
Sponsor
Indium-Corporation

Your Award-Winning Cored Wire
Our industry-leading, award-winning range of flux-cored wire solder solutions meet the diverse needs of both manual soldering, and rework and robotic soldering applications.
Indium Corporation
Glenbrook-Technologies
Test Your Knowledge Answer
In which country was the wheelbarrow invented?
Answer: China. The wheelbarrow was invented by the prime minister of Shu Han, Zhuge Liang, in 231 A.D.