Oct 20, 2026 High Density Packaging User Group Announce New Copper Profile Test Method The HDP User Group and Global Electronics Association released IPC-TM-650-2.2.23, a new test method for measuring copper foil profiles. The method supports high-speed, high-performance applications requiring smoother copper surfaces and data-driven standards. Global Electronics Association

Sponsor Drop-in SAC305 Alternative: Try REL61™ lead-free alloy Upgrade your alloy without the downtime. REL61 requires no pot cleaning and your SAC305 scrap value often covers the cost of the changeover. Optimize your process today. AIM Solder

Gartner Says AI Risk is Rising Faster Than AI Value Gartner urges CIOs to align AI value, risk, safety, and governance as risks outpace benefits. Although 58% of leaders report positive AI value, limited governance capabilities threaten enterprise-wide adoption and responsible scaling of agentic AI. Gartner

UHDI Fabrication for IC Substrates: SAP and mSAP Processes Approach described includes adhesion promotion, direct plating, electroless copper, blind-via filling, trench filling, and solder-resist metallization technologies. Precise control of surface preparation, activation, and copper thickness uniformity improves. Technical Paper

The First New US Lithium Plant In 50 Years Is Using An Unexpected Metal Source The U.S. Dept. of Energy and Oak Ridge National Laboratory partnered with Element3 to extract battery-grade lithium from oilfield wastewater, potentially producing 3,000 tons annually while reducing pollution, strengthening domestic supply chains, and improving energy independence. BGR

Sponsor Oxide Reduction for Reliable Electronics Manufacturing As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper. Plasmatreat GmbH

Precision Timing Special Report Electronic systems rely on precise timing as rising data rates, harsh environments, and power constraints increase design demands. Engineers must evaluate timing devices for performance, reliability, environmental suitability, availability, and long-term lifecycle support. EE Times

What Causes Chip Blow Off During Reflow? What can cause a 0603 passive component to blow off the circuit board during reflow as if a firecracker was put underneath? Board Talk

Technical Papers ■ 5 Major Challenges in Image Sensor Packaging and How to Solve Them ■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible ■ Oxide Reduction for Reliable Electronics Manufacturing ■ UHDI Fabrication for IC Substrates: SAP and mSAP Processes ■ Flux-Free, Reliable, Efficient: Soldering with Formic Acid ■ Redesigning Material Logistics for High-Mix EMS Production ■ Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education ■ Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You MORE TECHNICAL PAPERS

Sponsor Vapor Phase Profiling Thermal profiling the vapor phase soldering process — especially those with vacuum — is challenging. ECD's M-VP™ sealed barrier can take it. Learn more. ECD

Pennsylvania town spurns US$10,000 data center checks Pennsylvania residents are resisting data center projects over concerns about noise, pollution, forest destruction and falling property values. Despite developers offering millions in community benefits and household payments, opposition continues, uniting residents across political lines. Taipei Times

Shipments of AI servers expected to grow: TrendForce TrendForce forecasts global AI server shipments will grow 32.2% to 2.82 million units this year, while market value could reach $920 billion next year as major cloud providers increase spending and component shortages drive costs higher. Taipei Times

Hybrid Conformal Coatings Used for Mitigating Whisker Growth In this work, we have synthesized a conformal polyurethane coating consisting of hard (hexamethylene di-isocyanate) and soft (polyol) segments. Technical Paper

Sponsor Introducing our new Board to Board Connectors These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling. Advanced Interconnections Corp

Anthropic wants AI models blocked only if they threaten over $1 billion in damage or more than 50 deaths or serious injuries Anthropic proposed an AI safety bill allowing the US government to block models posing risks of $1 billion in damage or at least 50 casualties. The proposal requires independent evaluations and judicial approval before restricting model releases. TechSpot

Before You Hand Franchising Over to AI, Put These Guardrails in Place AI can streamline franchise operations, analyze markets and improve efficiency, but overreliance risks data security and brand identity. Franchise leaders should establish clear guidelines, train employees and preserve human judgment, expertise and relationships in decision-making. Entrepreneur

Counterfeit Electronic Components Identification: A Case Study This paper provides a brief introduction to counterfeit prevention and detection standards, particularly as they relate to the Aerospace and Defense sectors. Technical Paper

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From Macro to Micro, and Back This year's Nobel prizes highlight how small components shape complex systems, inspiring AI-driven chip design that bridges abstraction layers. By predicting system-wide effects and identifying optimal low-level choices, AI could improve chip performance, and design verification. EE Times

Hawaii Is Finding A Clever Solution To Recycle Ocean Plastic Hawaii researchers are testing recycled marine plastics, including discarded fishing nets, in asphalt to boost road durability and cut emissions. Early results show improved rutting resistance without added plastic shedding, but long-term performance and environmental risks remain. BGR

Sponsor You need clear soldering results? The SEHO PowerVision AOI system is for fast, automated optical inspection. Designed for THT processes & focusses on 2 points: Continuous quality assurance & cost-efficient production processes. SEHO Systems GmbH

Musk, Anthropic outline dueling approaches to AI-era philanthropy Anthropic plans to allocate 5% of its shares to a public-good fund, while Elon Musk promises SpaceX shares to every American child. Their contrasting approaches highlight growing debates over distributing AI-generated wealth and addressing public concerns. Reuters

Dynamic Warpage on the Solder Joints of Large Plastic Ball-Grid Arrays The dynamic warpage of large BGA packages enhances the risk of assembly solder joint defects when the assembly is subjected to temperature incursions during reflow, testing, or service. Technical Paper

I thought working in AI would put me ahead of the curve. Two years in, I've never felt more behind and tired of the topic. A former lawyer transitioned into AI to future-proof their career, joining a legal tech company through ChatGPT. However, rapid model advancements soon created pressure as newer tools outpaced learned skills and rendered weeks of work obsolete. Business Insider

Eiliko robot maker Energize Lab left its entire fleet of 68,000 robots open to a remote takeover A security researcher exposed 13 million conversations from 68,000 Energize Lab robot toys, including children's profiles, and remotely manipulated devices to deliver false claims and explicit commands, highlighting serious privacy and cybersecurity risks in AI-powered companions. TechSpot

Sponsor pH Employment in Electronic Cleaning The pH of a cleaning agent affects the entire cleaning process and must be considered when determining the appropriate chemistry and process parameters for success. Download now. KYZEN

Foxconn pays $727M for half of Mitsubishi Electric's car parts unit in EV push Foxconn will pay $727 million for a 50% stake in Mitsubishi Electric Mobility, targeting Japanese EV platforms. The deal adds automotive electronics and powertrain expertise but leaves Foxconn facing questions about growth and its EV ambitions. Electrek