June 18, 2026

Built-In Memory. Built-In Confidence. Memory shortages and rising DRAM prices are creating new challenges for edge AI, increasing costs and delaying deployments. NVIDIA positions its Jetson platform as a solution, combining LPDDR5 memory & optimized software to reduce supply-chain risks & speed development. EE Times

Sponsor vCONNECT: Your Next Level of Digital Connectivity Discover vCONNECT: Analyze inspection data, monitor machine performance, predict maintenance needs, store data securely and access AI tools and the latest Viscom News. Viscom SE

Amazon AI exec predicts first 'commercially useful' quantum computers in 5-7 years Amazon predicts commercially useful quantum computers will arrive in 5–7 years, first solving complex chemistry and materials science problems, then rapidly scaling capability. It expects progress to accelerate like Moore's Law in semiconductors. CNBC

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education KYZEN Corporation and the Rochester Institute of Technology (RIT) have established an academic-industry collaboration to integrate real-world electronics manufacturing challenges directly into engineering education. Technical Paper

Beyond Chiplets, CMOS 2.0 Moves Scaling into the Circuit Imec's CMOS 2.0 roadmap redefines chip scaling by splitting circuits at the transistor level and reconnecting them in dense 3D architectures. The design tackles AI bottlenecks, boosting bandwidth, cutting energy use, and tightly integrating logic, memory, and I/O. EE Times

Sponsor See How Proven Leaders Make Operational Success Happen 4-part series addressing head-on the challenges faced by manufacturing operations in today's highly complex and hyper-competitive environment. No registration required. Intraratio

Reliable Machine Vision Starts at the Circuit Level Passive components such as capacitors, inductors, resistors, magnetics, and protection devices strengthen machine vision in industrial automation by stabilizing power, reducing noise, protecting signals, and improving uptime long-term reliability. EE Times

Soldering Relays Intrusively in Lead Free Process We use intrusive reflow soldering on relays using a lead process. We are challenged to solder relays intrusively in a lead-free process. Board Talk

Technical Papers ■ Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education ■ Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You ■ Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse ■ Digital Warehouse Automation in High-Mix PCB Assembly ■ Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses ■ Scaling SMT Traceability ■ The Drawbacks of Internal Recycling Systems for Solder Dross ■ Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics ■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible ■ PCB Rework Evolves, With X-ray a Constant Support MORE TECHNICAL PAPERS

Sponsor Micro Dispensing Technology Leader DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries. DL Technology

AI Is Exposing Major Gaps in Traditional Data Backup Strategies. Here's How to Protect Your Business. Organizations rushing AI adoption risk creating backup blind spots. Traditional 3-2-1 backups fail to protect AI assets like embeddings, prompt chains, agent logic, and learned behaviors, driving demand for AI-aware backup and recovery frameworks. Entrepreneur

Gartner Announces 2026 Rankings of the Global Supply Chain Top 25 Gartner's 2026 Supply Chain Top 25 highlights a shift toward AI-driven, autonomous operations. Schneider Electric retained the top spot, while NVIDIA ranked second. Leading companies are redesigning work, strengthening resilient networks, and expanding supply chain orchestration. Gartner

Impact of Stencil Manufacturing Technology of Multi-level/ Step Stencils In this paper, we evaluate and compare the print performance of four different step technologies: Chemically etched, Laser weld, Milled, and Electroform. Technical Paper

Sponsor Defluxing Ultra-Fine Pitch CoW Devices? Read This. DI water falls short on copper pillar packages. Get proven cleaning parameters for CoW devices with <25μm pitch in our white paper. ZESTRON Americas

AI in Business: How Companies Are Deploying AI in 2026 Businesses have largely embraced AI, but few achieve meaningful profit gains because they struggle to move beyond pilot projects. Leaders like Maersk and JPMorgan succeed by prioritizing data infrastructure, cost controls & organizational transformation before scaling AI deployments. AI Insider

"The retail SSD market has almost disappeared," Silicon Motion says, as OEMs take what's left AI data center demand is redirecting NAND and DRAM away from consumers, pushing SSD and memory prices higher. As retail shortages deepen, supply shifts toward PC makers, making pre-built systems cheaper than parts, with constraints lasting to 2028. TechSpot

Electrical Plus Functional Testing in Designing Electronics for Harsh Conditions This paper proposes a test method and vehicle to characterize soldering materials, assembly process steps, and conformal coating to determine reliability. Technical Paper

Sponsor TIM1 for EV Battery Thermal Management AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs. AI Technology, Inc.

The Secret to Marathon-Winning Humanoid Robots Honor's Lightning humanoid runs a half-marathon in 50:26 using speed-optimized motor gearing, lightweight structure, and liquid cooling that prevents overheating. The feat showcases engineering tradeoffs favoring endurance and speed over versatility. IEEE Spectrum

This New Scientific Breakthrough Could Lead To Magnets Without Any Rare Earth Metals Scientists at Ames Laboratory develop a physics-informed AI that accelerates discovery of rare-earth-free permanent magnets by combining scientific modeling with cost and supply data, reducing critical mineral reliance and supporting tech sectors. BGR

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AI Isn't the Real Bottleneck in Autonomy; Wireless Is Autonomous drones and robots operate in interference-prone environments, driving demand for resilient multi-channel radios, edge AI, real-time spectrum awareness, and secure semiconductor supply chains to ensure safe, mission-critical communications. EE Times

Intermetallic Compounds in Solder Alloys: The Common Misconception This paper describes the IMCs that occur typically in eutectic, Sn63Pb37, near-eutectic SAC305, and high-performance tin-based Pb-free solder alloys. Technical Paper

China pushes for AI safety as G7 summit wraps up without Beijing China escalates its push for open global AI cooperation, urging nations to join a new AI organization and embrace governance. Criticizes restrictive tech policies, promotes affordable AI access, and expands ties with developing countries globally. CNBC

India's PC market jumps in 1Q26 as notebook demand surges India's PC market posted strong growth in Q1 2026, driven by robust notebook sales. Rising component costs also influenced purchasing decisions, highlighting India's growing importance in the global PC industry and supply chain. Digitimes

Sponsor Openair-Plasma for Semiconductor Manufacturing Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here. Plasmatreat GmbH

Apple's First 1.4nm Chipset, The A22 Pro, Could Be Powering iPhones In Just A Couple of Years Apple is reportedly preparing its first 1.4nm chipset, the A22 Pro, for a 2028 debut following its 20th-anniversary iPhone. Built on TSMC's advanced process, the chip could deliver up to 15% higher performance or 30% lower power consumption than current 2nm technology. wccftech