circuitnet
Sponsor
AI-Technology-Inc

Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
Ask the Experts
Rework of Underfilled Array Packages
What is the best method for removing a SMT array package that has been underfilled and cured? Mechanically, thermally, chemically? A combination of methods? Is there ...
Responses by:
Richard D. Stadem
Advanced Engineer/Scientist, General Dynamics
Bob LePage
Sales Engineer, Circuit Technology Center
Neil O'Brien
Sales Director, Finetech
Neil Poole
Senior Applications Chemist, Henkel Electronics
Bhanu Sood
Laboratory Director, CALCE, University of Maryland
Dr. Brian Toleno
Application Engineering, Henkel Electronics
What Causes Solder Balls During Rework?
Advise and suggestions for assembly using 01005 capacitors.
Selective Printing for BGA Components
PCBA Transport Between Facilities
SOT (Small Outline Transistor) Body Cracks
Shielding Techniques When Removing Components Using Hot Air
Partially Visible or Hidden Solder Connections
MORE ASK THE EXPERTS
Essegi-Automation
Sponsor
Plasmatreat-GmbH

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
Industry Calendar
Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA
Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMTA
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
Oct 1, 2026
Long Island Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
ECD
Sponsor
Manncorp

SMT Line Builder Tool – Fast & Easy
Skip the guesswork. Our SMT Line Builder gives you instant, expert-recommended setups based on your budget and output. Or send us your BOM—we'll handle it.
Manncorp Inc.
What Year Was It?
Gone With the Wind Published
What Year
Margaret Mitchell's Gone with the Wind, one of the best-selling novels of all time and the basis for a blockbuster 1939 movie, is published.
See the answer below.
Sponsor
Circuit-Technology-Center

Implement Engineering Changes Without Production Delays
Design revisions are a normal part of manufacturing, but they don’t have to disrupt production. Circuit Technology Center delivers fast PCB rework services.
Circuit Technology Center
kyzen
What Year Was It Answer
Gone With the Wind Published
Answer: June 30, 1936
June 30, 2026
image
The Lab Mistake That Might Revolutionize Computing
Researchers have discovered that ordinary CMOS transistors can function as artificial neurons and synapses, offering a scalable neuromorphic computing approach that could dramatically reduce AI’s energy consumption, lower data-center power demands, and narrow the efficiency gap with the human brain.
IEEE Spectrum
Sponsor
Heller-Industries-Inc

Eliminate Voids for High-Reliability Applications
Voids compromise reliability. Achieve near zero-voiding with our vacuum reflow for automotive, micro-bumping, and advanced electronics. Send your boards to see the results.
Heller Industries
Apple accuses India of ‘copy-pasting’ rivals’ claims in antitrust investigation
Apple urged India's antitrust watchdog to dismiss findings that it abused App Store dominance, accusing investigators of copying rivals’ claims without independent analysis. The company warned penalties could disrupt its business model, deter investment, and undermine India’s growing iPhone manufacturing ecosystem.
Taipei Times
Flux-Free, Reliable, Efficient: Soldering with Formic Acid
Whitepaper shows formic-acid-assisted, flux-free soldering enables reliable, nearly void-free joints for power semiconductors. The technology improves thermal performance and lifespan, offering strong potential for electromobility, renewable energy, and high-frequency electronics.
Technical Paper
Europe’s Path to Defense Resilience Lies in Technological Independence
Europe can strengthen defense resilience by reducing reliance on foreign technology ecosystems and investing in sovereign semiconductors, AI, cloud infrastructure, and secure supply chains. Building domestic innovation and trusted partnerships will improve security, competitiveness, and long-term strategic autonomy.
EE Times
Sponsor
Advanced-Interconnections

Need Improved Solder Joint Visibility?
Solder Peel-A-Wayš Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
A hollow-core fiber cable just carried 51.3 Tb/s across 200 km
YOFC, working with China Telecom and Dekoli, set a world record by transmitting 51.3 Tb/s over 206.5 km of hollow-core fiber without signal regeneration. The live commercial trial demonstrated lower latency, higher speeds, and advanced wavelength optimization for long-haul networks.
TechSpot
Impact of Pb-free Solder Alloy Mixing on Solder Joint Integrity Using BGAs
An investigation was conducted to assess the solder joint integrity (acceptable/nonacceptable) for three different solder alloys on ball grid arrays (BGAs) in a mixed metallurgy configuration as compared to a baseline SAC305 system. Thermal cycle testing using a -55 to +125 ºC range in accordance with the IPC-9701 specification was used.
Technical Paper
Technical Papers
Flux-Free, Reliable, Efficient: Soldering with Formic Acid
Redesigning Material Logistics for High-Mix EMS Production
Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education
Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse
Digital Warehouse Automation in High-Mix PCB Assembly
Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses
Scaling SMT Traceability
The Drawbacks of Internal Recycling Systems for Solder Dross
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
MORE TECHNICAL PAPERS
Sponsor
Schunk

Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK
This Unexpected Tech Founder Is Now Richer Than Mark Zuckerberg, Larry Ellison and Jensen Huang
Michael Dell’s net worth has surged to $212 billion, making him the world’s fifth-richest person as Dell Technologies rides the AI boom. Strong server sales, rising revenue and a 225% stock rally fueled his $71.9 billion wealth gain this year.
Entrepreneur
U.S. Eyes China’s Expanding Role in Latin America
A Gartner report says expanding U.S. scrutiny of Chinese firms in Latin America reflects a broader national security strategy targeting ownership, technology and supply chain dependencies. Companies must map entire business ecosystems as regulators intensify oversight ahead of the 2026 USMCA review.
EE Times
How to Cost a Board
My boss has asked me to provide a cost matrix so we can quickly quote labor machine time component for the SMT board assembly.
Board Talk
Sponsor
Smart-Sonic

Safe and Effective Cleaning with 440-R
Not consumed during the stencil cleaning process so there is no need to monitor concentration. Simply replace with fresh solution every 4-6 weeks. Learn more.
Smart Sonic
SEMI Projects 300mm Memory Equipment Investment to Surpass $50 Billion in 2026
AI-driven demand will push global 300mm memory fab equipment investment to a record $52 billion in 2026, up 29%, before reaching $57 billion in 2027, as chipmakers expand DRAM and 3D NAND capacity to support AI infrastructure and advanced computing.
PR Newswire
Key facts on South Korea's three chip and AI 'mega projects'
South Korea unveiled three mega projects focused on semiconductors, physical AI and AI data centres. Samsung Electronics plans massive domestic investments through 2040, expanding semiconductor clusters, advanced HBM fabs and new facilities to strengthen the country's technology leadership and future growth.
Reuters
Increased Reliability of Quad Flat No Lead Wettable Flank Connections
The focus of this study is to investigate the reliability of the immersion tin layers plated by a tailored immersion tin process for QFN flank plating.
Technical Paper
Sponsor
Aim-Solder

Cut SAC305 Costs with REL61TM Lead–Free Alloy
Silver prices have tripled. While silver is 2/3 of SAC305's cost, it's only 1/4 of REL61. Save hundreds of thousands annually with this proven, drop-in alternative.
AIM Solder
Indium Tin Oxide Sputtering Target Market to Reach US$1.3 Billion by 2031, Driven by 11.3% CAGR and Rising Display & Semiconductor Demand
The global Indium Tin Oxide sputtering target market is projected to reach US$1.3 billion by 2031, growing at an 11.3% CAGR, driven by rising demand for transparent conductive films in displays, touchscreens, smart devices, semiconductor applications, and advanced optoelectronic technologies.
Industry Today
Korea plans to double memory output in five years
South Korea unveiled a $1.4 trillion semiconductor expansion plan, with Samsung and SK Group doubling memory chip production within five years. The initiative includes new fabs, packaging facilities and NAND plant expansions to strengthen regional development and global chip leadership.
Electronics Weekly
Sponsor
Intraratio-Corporation

What Would You Ask Proven Global Manufacturing Leaders?
In this 4-part series we asked about: Key Drivers of Success, Scaling Operations Effectively, AI in Manufacturing, and Tools to Empower Operations. No registration Required.
Intraratio
Jewar set to be electronics and semicon hub: Vaishnaw
Union Minister Ashwini Vaishnaw said Jewar will become a major electronics and semiconductor manufacturing hub, backed by Noida International Airport and improved connectivity. He said new investments and domestic production will strengthen Uttar Pradesh’s role in India’s growing high-tech manufacturing sector.
The New Indian Express
Breakthrough Technology to Improve X-Ray results
The paper contains comparison data from Nano Focus tube, plus data from reliability and stability tests using a real-life system and not test rigs.
Technical Paper
South Korean president to unveil massive AI and chip investment drive
South Korea will unveil three mega-projects, including a massive southwest semiconductor hub, to boost AI, chip production and regional growth. The plan could attract over 1,000 trillion won in investments, with Samsung and SK expected to lead while expanding infrastructure and workforce support.
The Standard
Will A New Google Pixel Phone Actually Last 7 Years?
Google’s seven-year Pixel support boosts long-term software updates and resale value, but aging hardware, battery degradation, and limited access to newer AI features reduce its practical lifespan. For most users, frequent upgrades mean the extended support promise offers more reassurance than real-world benefit.
BGR
Sponsor
Plasma-Etch

High power atmospheric plasma system
Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength!
Plasma Etch
Cellular IoT connections to reach 5.9 billion by 2035
Omdia forecasts global cellular IoT connections will grow from 4.3 billion in 2026 to 5.9 billion by 2035, driven by NB-IoT, mMTC, and eRedCap. Automotive, smart infrastructure investments, and expanding 5G Standalone networks will accelerate adoption worldwide.
Telecoms
Today's Sponsor
Zestron
Sponsor
Zestron

Defluxing Ultra-Fine Pitch CoW Devices? Read This.
DI water falls short on copper pillar packages. Get proven cleaning parameters for CoW devices with <25μm pitch in our white paper.
ZESTRON Americas
Test Your Knowledge
What piece of technology did IBM develop in 1973 that they nicknamed Winchester?
See answer below.
Industry Press
YINCAE to Showcase Advanced Materials at IICIE 2026
YINCAE will showcase its latest innovations in advanced materials and packaging technologies at the International Integrated Circuit Innovation Expo (IICIE) 2026 ...
YINCAE Advanced Materials
Assembled Product Specialists Offers Complete Facility Solutions
Assembled Product Specialists is is highlighting its comprehensive approach to facility design, product sourcing, installation, and operational support. While many organizations know ...
Assembled Product Specialists
I.C.T Delivers SMT Line for Drone Manufacturing in Europe
I.C.T has successfully delivered a complete SMT production line to a customer in Europe, supporting their drone manufacturing business. In March 2026, I.C.T dispatched ...
Dongguan ICT Technology Co.,Ltd.
SmartController offers interfaces for controlling demanding tests
In the automotive sector, individual components—such as vehicle seats—often need to be tested or demonstrated independently of the overall configuration ...
GOEPEL Electronic
ITW EAE appoints Alfa SMT as Distributor for MPM & Camalot Products
ITW EAE is pleased to announce the appointment of Alfa SMT as the authorized distributor of MPM Printer and Camalot Dispenser products for the Balkan territory, ...
ITW EAE
Global Electronics Association Releases IPC-1401B
The Global Electronics Association has released IPC-1401B, Environmental, Social and Governance (ESG) Management System Standard, an updated industry standard ...
Global Electronics Association
MicroCare Appoints Doug Kay as Dir. of Market and New Business Development
MicroCare, LLC announced the appointment of Doug Kay as Director of Market and New Business Development. In this newly created role, Kay will focus on finding ...
MicroCare, LLC
MORE INDUSTRY PRESS
Summit-Interconnect
Sponsor
Ormet-TLPS

Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Quote of the Day
"Success is simply a matter of luck. Ask any failure."
Earl Wilson
Sponsor
Viscom-SE

vCONNECT: Your Next Level of Digital Connectivity
Discover vCONNECT: Analyze inspection data, monitor machine performance, predict maintenance needs, store data securely and access AI tools and the latest Viscom News.
Viscom SE
Uyemura
Cartoon of the Day
Cartoon
"Any chance you could learn PowerPoint before you next presentation, Jim?"
Copyright © Randy Glasbergen
Sponsor
Glenbrook-Technologies

Counterfeit Components Identified With X-ray Inspection
Automated component sourcing and procurement platform relies on real-time X-ray inspection to remove counterfeit components from supply chain.
Glenbrook Technologies
Air-Vac-Engineering
Test Your Knowledge Answer
What piece of technology did IBM develop in 1973 that they nicknamed Winchester?
Answer: A disk drive