July 9, 2026

India's PCB exports to China a rare success story India's printed circuit board exports surged more than 20-fold to $1.9 billion in FY26, driven by a 40-fold jump in shipments to China. The increase reflects India's expanding PCB manufacturing capacity as China increasingly sources lower-value electronic assemblies from Indian suppliers. Rediff

Sponsor Built to Scale. Proven in Production. Microsystems World CNC boosted throughput and automation by trading up to a complete inline SMT solution—powered by Manncorp and designed for long-term growth. Manncorp Inc.

White House Executive Order Brings New Urgency to Post-Quantum Cryptography A new White House executive order accelerates the shift to post-quantum cryptography, pushing government agencies and contractors to modernize encryption sooner. The move increases pressure on organizations to inventory cryptographic assets and prepare for quantum-resistant security. EE Times

Digital Warehouse Automation in High-Mix PCB Assembly High mix SMT production demands full material visibility. This white paper shows how ASTER improved traceability, inventory accuracy and FIFO control through integrated automation and reel-level tracking across warehouse operations. Technical Paper

A China shock is shaking Silicon Valley Chinese open-weight AI models are rapidly challenging U.S. leaders by offering lower costs, greater flexibility, and strong performance. The commentary urges Silicon Valley to strengthen open AI ecosystems, invest in research, and compete through innovation rather than restrictions. Taipei Times

Sponsor AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives 240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity. AI Technology, Inc.

This former Apple executive is betting on Shenzhen, not Silicon Valley, to create the ‘next Apple’ Even Realities CEO Will Wang argues Shenzhen—not Silicon Valley—offers the best environment to build the next Apple. He cites China's unmatched hardware talent, manufacturing ecosystem, and faster investment climate as key advantages for consumer electronics startups. CNBC

Complex Board Design Induced Solder Separation Failure The study elaborates the parameters with the solder separation failure per board design configuration, and also provides the potential solution to mitigate the failure. An in-depth analysis on the solder joint microstructure utilizing Electron-backscattered diffraction (EBSD) supports the test results leading to the mechanism associated with the solder separation failure. Technical Paper

Technical Papers ■ Flux-Free, Reliable, Efficient: Soldering with Formic Acid ■ Redesigning Material Logistics for High-Mix EMS Production ■ Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education ■ Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You ■ Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse ■ Digital Warehouse Automation in High-Mix PCB Assembly ■ Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses ■ Scaling SMT Traceability ■ The Drawbacks of Internal Recycling Systems for Solder Dross ■ Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics MORE TECHNICAL PAPERS

Sponsor Is My PCB Wash Concentration in Check Evaluating wash concentration levels through varying testing methods can potentially save process time, reduce overall process costs, and increase cleaning efficacy on PBCs. Read more. KYZEN

The Ultimate Guide to PCI Express: Specs, Features, Use Cases and PCIe 7.0 PCI Express continues to power high-speed computing by delivering scalable, backward-compatible connectivity for processors, GPUs, storage, and networking. The guide explains PCIe 7.0’s doubled bandwidth, key technologies, and growing role in AI, cloud, HPC, and data-intensive applications. Semiconductor Engineering

What was the first consumer device powered by a Li-ion battery? Sony's CCD-TR1 Handycam became the first consumer device powered by a lithium-ion battery, marking a breakthrough in portable electronics. Sony's innovation delivered lighter, longer-lasting batteries, paving the way for lithium-ion technology to transform smartphones, laptops, electric vehicles, and other mobile devices. TechSpot

Vapor Phase and Backward Compatibility We use lead-free solder paste with a melting point of 217 degrees C, along with 230 degree C Galden. We have a new project that uses tin-lead solder. The Assembly Brothers, Phil Zarrow and Jim Hall, offer their suggestions. Board Talk

Sponsor Optically Clear Nanosilica Filled Epoxy Master Bond EP4NS-80 is a low viscosity epoxy for bonding and sealing that possesses excellent dimensional stability, low CTE and minimal shrinkage upon curing. Master Bond

Worker shortage endangers US chip production plans A severe US shortage of skilled semiconductor workers could delay billions of dollars in chip plant investments and limit future production. A new report urges continued government funding, industry collaboration and stronger engineering education to close a projected 157,000-worker gap by 2030. Taipei Times

Rise of the AI Data Center – Why Infrastructure Strategy Is Now a Board-Level Issue The white paper explains how AI-driven data centers can overcome power, scalability and infrastructure challenges through resilient power architectures, modular deployment and microgrid strategies. It helps organizations improve compute reliability, reduce total ownership costs and accelerate AI infrastructure expansion. EE Times

The Next Generation of Si-Interposers This paper explores the next generation of silicon interposers, focusing on the technical advantages of using thicker interposers[1] with larger TSVs, specifically 50μm in diameter and 300μm in length. These larger TSVs offer several benefits, including enhanced electrical interconnectivity. Technical Paper

Sponsor Achieve Reliable BGA Rework with Expert Reballing Methods BGA reballing requires precision, process control, and proven techniques. Manufacturers improve rework quality and maximize BGA reliability with proven reballing practices. Circuit Technology Center

Automotive, healthcare, consumer electronics to drive CEM market The electronics manufacturing services market is expected to grow from $648.5 billion in 2025 to $853.1 billion by 2030 at a 5.6% CAGR, driven by rising demand for advanced electronics, automotive electrification, smart manufacturing, and Asia Pacific's expanding role as a global production hub. EP&T

Road to higher vehicle automation accelerates Berg Insight forecasts rapid growth in advanced driver assistance, with L2-equipped vehicles rising from 35.6% of new car sales in 2025 to 57.3% by 2031. Chinese automakers lead L2+ adoption, while manufacturers prioritise scalable automation over higher-level autonomy. Computer Weekly

Sponsor Your Domestic PCB Solution Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on. Summit Interconnect

Precision electronics manufacturer’s commitment to UK production earns Made in Britain accreditation Camtronics has joined Made in Britain, strengthening its commitment to UK manufacturing and engineering excellence. The Welsh electronics manufacturer will use the trademark to showcase its high-reliability production, enhance customer confidence, and reinforce its reputation for quality, traceability, and dependable delivery. News From Wales

Solid-State Diffusion between Rolled Cu and Electroplated Matte-Sn System This study focusses on the IMC phase growth in rolled Cu- electroplated Sn system during the temperature range from 398K to 473K. Technical Paper

This former Apple executive is betting on Shenzhen, not Silicon Valley, to create the ‘next Apple’ Even Realities CEO Will Wang says Shenzhen offers the engineering talent and supply chain strength needed to build next-generation consumer electronics. The AI smart-glasses startup secured unicorn status with a $150 million funding round and plans global expansion while targeting the fast-growing AI wearables market. CNBC

Growth, competition and change in power devices Power electronics companies are shifting from rapid expansion to profitability and cost optimization as overcapacity and geopolitical tensions reshape the market. Meanwhile, Chinese manufacturers are gaining share, while growing demand from AI, data centres, EVs and wide-bandgap technologies supports long-term industry growth. Electronics Weekly

Sponsor 3 Ways to Increase Plasma Uniformity Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more. Plasma Etch

Chip analysis providers report record-high sales MA-tek and Msscorps posted record second-quarter revenue as booming demand for AI chips, silicon photonics and failure analysis services accelerated growth. Both companies are expanding capacity and investing in optical chip analysis to support next-generation AI data centers and copackaged optics. Taipei Times