circuitnet
Sponsor
Intraratio-Corporation

Discover Real Operational Strategies from Proven Global Leaders
In this 4-part series we asked three experienced global leaders for their insights on the biggest challenges faced by manufacturing operations today. No Registration required.
Intraratio
Ask the Experts
PCBA Transport Between Facilities
We need to transport PCB assemblies between separate facilities for testing and added processing. The facilities are approx 10 miles apart so trucks are used ...
Responses by:
Hartmut Berndt
President, B.E.STAT group
Jerry Karp
President, JSK Associates
James DiBurro
President, Round Rock Consulting
SOT (Small Outline Transistor) Body Cracks
Shielding Techniques When Removing Components Using Hot Air
Partially Visible or Hidden Solder Connections
Shelf Life Limit for Soldering Old Components
Trays for MLS Baking
Controlling Creep Corrosion
Design Considerations and Impact on Assembly
MORE ASK THE EXPERTS
AI-Technology-Inc
Sponsor
Zestron

Defluxing Ultra-Fine Pitch CoW Devices? Read This.
DI water falls short on copper pillar packages. Get proven cleaning parameters for CoW devices with <25μm pitch in our white paper.
ZESTRON Americas
Industry Calendar
Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA
Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMTA
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
Oct 1, 2026
Long Island Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Heller-Industries-Inc
Sponsor
Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
What Year Was It?
U.S. Air Force Reports on Roswell
What Year
U.S. Air Force officials release a 231-page report dismissing claims of an alien spacecraft crash in Roswell, New Mexico, almost exactly 50 years earlier.
See the answer below.
Sponsor
Schunk

Gripping Systems from micro assembly to heavy lifting
The first industrial-suited grippers from SCHUNK were a milestone. Since then we have brought countless newly and further developments to market.
SCHUNK
Circuit-Technology-Center
What Year Was It Answer
U.S. Air Force Reports on Roswell
Answer: June 24, 1997
June 24, 2026
image
Global Electronics Association Releases IPC-1401B ESG Management System Standard
The Global Electronics Association launched IPC-1401B, an updated ESG standard that helps manufacturers embed sustainability, manage supply chain risks, meet rising regulatory demands, and demonstrate measurable ESG performance to customers and investors.
Global Electronics Association
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
PCB industry posts record Q1 production value with rosy outlook
Taiwan's PCB industry boosts production value 19.6% year-on-year to a record NT$245.6 billion in Q1, driven by strong AI server demand for high-end boards, while TPCA forecasts continued growth despite material shortages, cost pressures and global uncertainties.
Taipei Times
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for PCBAs and semiconductors, further improving accuracy, speed and consistency - streamlining inspection processes.
Technical Paper
Meta debuts new, cheaper smart glasses under its own brand
Meta launched Meta Glasses starting at $299 with EssilorLuxottica, expanding its wearables push. The screenless smart glasses feature cameras, speakers, and Meta AI, offer multiple styles, strong battery life, live translation, and upcoming walking navigation.
TechCrunch
Sponsor
Glenbrook-Technologies

Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
Glenbrook Technologies
Why the U.S. Uses Only Half of Its Grid Capacity
Utilize Coalition, backed by Google, Tesla and Carrier, says the U.S. can meet rising electricity demand from data centers and manufacturing by better using existing grid capacity through new technologies and policy reforms, reducing reliance on building new power infrastructure.
IEEE Spectrum
Reflow Oven Zone Separation Challenges
Some of the zones or our oven profiler are competing to get to the correct temperature. How do I prevent the oven from having competing zones? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk
Technical Papers
Redesigning Material Logistics for High-Mix EMS Production
Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education
Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse
Digital Warehouse Automation in High-Mix PCB Assembly
Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses
Scaling SMT Traceability
The Drawbacks of Internal Recycling Systems for Solder Dross
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible
MORE TECHNICAL PAPERS
Sponsor
Manncorp

New Jet Dispenser: Faster Changeovers. No Stencils Required.
Add jet dispensing to any new Manncorp pick & place machine for lower setup costs, greater production flexibility and up to 640 dpm. Upgraded 3-year warranty through 2026.
Manncorp Inc.
A New Physical AI Platform Provides a 'Street-Smart' View of the World
Niantic Spatial and Spexi Geospatial teamed up to combine on-demand drone imagery with physical AI and photorealistic 3D Gaussian splats. The platform delivers accurate, frequently updated city-scale models for construction, planning, design, and mapping applications.
Design News
AI memory startup focused on cutting token costs raises $98 million
Engram raised $98 million to expand its AI memory technology, which helps companies cut costs by recalling organization-specific workflows and delivering smarter responses with far fewer tokens. The startup already serves clients including Microsoft as demand for efficient AI grows.
CNBC
How the Right Cored Wire Can Optimize Automated Soldering
This study investigates the impact cored wire flux activity and flux core percentage has on soldering performance and speed. Additionally, this research aims to identify optimal soldering parameters by varying preheat time, feed rate, tip temperature, dwell time.
Technical Paper
Sponsor
Air-Vac-Engineering

Removal/Milling of Underfilled Parts: AVX1000M
High precision milling with zero adjacent clearance. Auto laser height measurement of board and component. Learn more.
Air-Vac Engineering
How Spain Built a Quantum Ecosystem Without Calling It One
Spain has rapidly built a leading quantum ecosystem in Europe through coordinated public investment research and industry. It now operates diverse quantum systems across multiple regions and launches a €808 million strategy to advance computing communications and sensing.
EE Times
Google's online dominance is showing signs of cracking in AI era
Google faces mounting pressure as users increasingly split between AI chatbots and non-AI search tools. While Google still dominates search and posts strong growth, rising competition, AI backlash, and talent departures are exposing vulnerabilities in its core business.
CNBC
Pressure-Less Silver Sintering Pastes for Low Porosity Joint and Large Die
Under pressure-less sintering conditions silver sintering pastes for different sized die attachment to form robust silver joints have been developed.
Technical Paper
Sponsor
ECD

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
The Forgotten Element in AI Development: Sound
Treble is bringing realistic sound to AI with wave-based acoustic simulation that generates high-fidelity training data for robots and voice systems. The platform boosts speech recognition accuracy and speeds audio AI development.
Design News
AI Is Learning to Read the Room
Human-context AI is gaining momentum as researchers and companies combine behavioral, personal, and situational data to better interpret emotions. The approach could enhance workplace, healthcare, and education interactions, but it also intensifies concerns over privacy.
IEEE Spectrum
Sponsor
Master-Bond

Low Thermal Resistance Epoxy
Master Bond EP53TC is a thermally conductive, electrically insulating adhesive that combines good physical properties and the ability to transfer heat rapidly and effectively.
Master Bond
Oracle sheds 21,000 roles over the past year amid wave of AI layoffs from tech giants
Oracle cut 21,000 jobs, nearly 13% of its workforce, over the past year as AI adoption reshaped operations. The company spent $1.8 billion on restructuring and warned that workforce changes could hurt productivity, morale and institutional knowledge.
CNBC
The Importance of Having a Clean Slate in the SMT Assembly Process
The paper covers an experiment to improve upon the defect ratio of their PCB assembly process by utilizing a bare board cleaner before the paste printer.
Technical Paper
Tech rout intensifies as sell-off grips global stocks
Global stocks tumbled as a tech-led selloff hit Asian, European and U.S. markets, hammering semiconductor shares and Magnificent Seven stocks. Analysts downplayed catastrophe risks, arguing strong earnings and AI-driven growth make the downturn a buying opportunity.
CNBC
SK hynix beats Samsung Electronics in market cap to become most valuable company
SK hynix overtook Samsung Electronics as South Korea's most valuable listed company after strong stock gains driven by AI-fueled semiconductor demand. Its dominance in high-bandwidth memory chips helped it outpace Samsung's more diversified business.
The Korea Times
Sponsor
Summit-Interconnect

The Battle for Space Superiority Has Begun
The next conflict may begin in orbit. Learn why resilient space systems and advanced manufacturing matter more than ever.
Summit Interconnect
Self-driving Cars Aren't the Challenge – Proving How They Think Is
The UK's autonomous vehicle sector is shifting into deployment mode as driverless taxi plans advance and regulations strengthen. Developers now face mounting pressure to prove that AVs make safe, compliant decisions in unpredictable real-world scenarios to secure trust & approval.
TechRadar
Today's Sponsor
Plasmatreat-GmbH
Sponsor
Plasmatreat-GmbH

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
Test Your Knowledge
Which of the following was not invented in China: paper, the mechanical clock, the saw, the magnetic compass?
See answer below.
Industry Press
ITW EAE appoints Alfa SMT as Distributor for MPM & Camalot Products
ITW EAE is pleased to announce the appointment of Alfa SMT as the authorized distributor of MPM Printer and Camalot Dispenser products for the Balkan territory, ...
ITW EAE
Global Electronics Association Releases IPC-1401B
The Global Electronics Association has released IPC-1401B, Environmental, Social and Governance (ESG) Management System Standard, an updated industry standard ...
Global Electronics Association
MicroCare Appoints Doug Kay as Dir. of Market and New Business Development
MicroCare, LLC announced the appointment of Doug Kay as Director of Market and New Business Development. In this newly created role, Kay will focus on finding ...
MicroCare, LLC
ELANTAS Heads to SMTA Querétaro with Proven Protection Solutions
ELANTAS will exhibit at the SMTA Querétaro Expo & Tech Forum, taking place Thursday, July 16, 2026 in Querétaro, Mexico. The event brings together electronics ...
ELANTAS
Seika Machinery to Kick Off SMI 2026 Webinar Series
Seika Machinery, Inc. will kick off its SMI 2026 Webinar Series with Session 1, "Solder Paste… Automating Preparation Practices," focusing on the early-stage ...
Seika Machinery, Inc.
Horizon Sales, Circuit Technology Host IPC Training to Address Skills Gap
Horizon Sales will host its next series of Circuit Technology Training Inc. (CTTI) IPC certification classes at its Brighton, Michigan facility, offering hands-on training ...
Horizon Sales
New High Throughput X-ray Inspection System
Test Research, Inc. (TRI) proudly announces the launch of the TR7600 SV Series. The newly released line scan 3D AXI delivers up to a 20% performance improvement ...
Test Research, Inc.
MORE INDUSTRY PRESS
Viscom-SE
Sponsor
DL-Technology

EZ-FLO High Precision Ceramic Dispense Tips
The ceramic molding process allows for smaller more precise inner diameters with a glass-like finish, giving you the ultimate control. Learn more.
DL Technology
Quote of the Day
"Once you become predictabe, no one's interested anymore."
Chet Atkins
Sponsor
Essegi-Automation

From Slave to Master: flexible ISM integrations
ESSEGI AUTOMATION's ISM software integrates with 250+ brands, connecting ERP, MES, WMS, Pick & Place and X-Ray systems. Flexible logic allows it to operate as master or slave in any production flow.
Essegi Automation
Smart-Sonic
Cartoon of the Day
Cartoon
"Thank you for calling Customer Service. To begin an endless and futile series of button pushing, press 1."
Copyright © Randy Glasbergen
Sponsor
Aim-Solder

Beat Rising Silver Prices with AIM REL61TM lead-free alloy
With silver at historic levels, there's never been a better time to switch. Reduce material costs significantly while maintaining the reliability your applications demand.
AIM Solder
kyzen
Test Your Knowledge Answer
Which of the following was not invented in China: paper, the mechanical clock, the saw, the magnetic compass?
Answer: The saw (Egypt, 4000 B.C.). Paper (100 BC), Mechanical clock (723 A.D), Magnetic compass (206 BC)