March 10, 2026

AI, Consumer Electronics to Drive Sales Growth: Hon Hai Hon Hai Precision Industry aims for double-digit revenue growth in 2026, driven by AI server demand and steady consumer electronics sales. Chairman Young Liu highlighted deeper AI supply chain integration, Nvidia collaborations, and potential foldable smartphone launches. Taipei Times

Sponsor 6 Common Mistakes of BGA Rework BGA rework is one of the most challenging procedures you may need to master. Doing it right depends in large part on the skills and knowledge of the rework technician. Learn more ... Circuit Technology Center

VIEWPOINT 2026: Lukas Buske, CEO, Plasmatreat GmbH At the 2025 productronica and SEMICON Europa events, we presented our comprehensive electronics manufacturing product portfolio, which covers the entire process chain — from wafer cleaning and PCB assembly to surface pretreatment prior to conformal coating. A notable product is the REDOX®-Tool, ... Plasmatreat GmbH

Optimizing BGA Rework: Challenges, Techniques and Quality Control The complexity of BGA packages introduces challenges during rework requiring innovative methods and inspection practices to ensure performance and reliability. This paper outlines best practices for removing and replacing BGAs. Technical Paper

Is Your IoT Strategy Ready for the New Landscape? IoT's old connect-and-forget approach is fading as regulation, cyber threats, and rapid device growth reshape the market. With 31 billion devices expected by 2030, enterprises now prioritize resilience, security, and flexible connectivity over price. EE Times

Sponsor Start Micro Dispensing Today The DL Micro Valve is specifically designed for dispensing micro volumes of material in precise, repeatable patterns. Learn more about the DL Micro Valve. DL Technology

Samsung reveals first details of its AI smart glasses to CNBC Samsung is entering the smart glasses market with a camera-equipped, smartphone-connected device, executive Jay Kim revealed at Mobile World Congress. Built with Qualcomm and Google, the glasses aim to leverage AI and mixed reality, challenging Meta's Ray-Ban dominance. CNBC

Risk for Ceramic Component Cracking Dependent The paper discusses the differences of the alloy, based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses. Technical Paper

Technical Papers ■ The Drawbacks of Internal Recycling Systems for Solder Dross ■ Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics ■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible ■ PCB Rework Evolves, With X-ray a Constant Support ■ How pH Cleaning Agents Affect Production Performance ■ A Universal AI-Powered Segmentation Model for PCBA & Semiconductor ■ RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG ■ High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin ■ Understanding Solder Dross: Causes and Control Strategies ■ Optimizing BGA Rework: Challenges, Techniques and Quality Control MORE TECHNICAL PAPERS

Sponsor Chemically Resistant Epoxy Resin Master Bond EP62-1AO is a two component adhesive used in applications where high temperature resistance, thermal conductivity, and electrical insulation are required. Master Bond

Military AI Policy Needs Democratic Oversight The U.S. Department of Defense and Anthropic are clashing over AI use in the military. Anthropic resists enabling domestic surveillance and autonomous targeting, while the DOD seeks unrestricted access, escalating the dispute by labeling the company a "supply chain risk." IEEE Spectrum

Wall Street sees AI's 'creative destruction' coming Investors are nervously watching AI's rapid rise, fearing entire businesses—not just jobs—could be disrupted. While productivity gains promise long-term economic growth, sectors from back-office services to legal work face short-term risks, debt pressures & potential market corrections. Taipei Times

Room Temperature Fast Flow Reworkable Underfill for LGA With the miniaturization of electronics, Land Grid Array has been widely used in consumer electronics, leaving only 20-30 microns gap left between LGA and the substrate. Technical Paper

Sponsor Refurbished and Demo X-ray Inspection Systems 2024 Demo JewelBox-70T X-ray System and 2024 Demo JewelBox-100T X-ray System Refurbished & Demo Systems on sale with warranty. Learn more. Glenbrook Technologies

TSMC to hire 8,000 workers in 2026 Taiwan Semiconductor Manufacturing Co (TSMC) plans to hire 8,000 employees this year, offering master's degree engineers NT$2.2 million on average. The company seeks talent across multiple engineering fields to support AI, digital transformation, and big data initiatives. Taipei Times

Laser-Based 3D Printing Could Build Future Bases on the Moon NASA and global space agencies aim to build self-sufficient lunar bases near the Moon's South Pole-Aitken Basin. Researchers at The Ohio State University demonstrated laser-based 3D printing of lunar regolith, producing durable structures that could support long-term habitats. IEEE Spectrum

Solder Balls on Neighboring Components After Rework During the rework of SMT components on conformal coating boards we see solder balls occurring on neighboring components. How can this be eliminated? Board Talk

Sponsor Reduce Lead Time and Improve Supply Chain. If value-add lead times are causing delay in Supply Chain, contact Alltemated. Our quick-turn solutions provide an alternative source for value-add needs. Alltemated Inc.

How China is challenging the U.S. to become the next great space power China's space program is rapidly advancing, hitting milestones like over 90 orbital launches in 2025, a Mars rover landing, and completing its space station. Massive government and private investment aims to challenge U.S. dominance in satellites, rockets, and commercial space. CNBC

Apple's First Made-in-U.S. Chips Fall Short of Claim Apple's claim of producing 100 million U.S.-made chips in 2026 is misleading, as wafers from TSMC's Arizona facility still require advanced packaging in Taiwan. Full-scale domestic packaging won't arrive until 2028, keeping U.S. chip supply dependent on Asia. EE Times

Sponsor What are your economic depaneling needs? Our depaneling machines are high-performance machines for single circuit boards with electronic components. The cutting principles are fast, the best quality. SCHUNK Electronic Solutions

Most People Feel Guilty About Their Tech Habits — But Won't Change Them. Here's Why That's a Big Opportunity for Businesses. Many people quietly worry about their digital habits, knowing that streaming, cloud computing, and AI consume vast energy. Yet this diffuse guilt rarely sparks change, leaving individuals aware of the cost but continuing their energy-heavy tech use. Entrepreneur

Protocol Development for Testing Solder Reliability This paper updates progress in the development of methods for investigating solder joint reliability in a combined environment of vibration and thermal cycle testing. Technical Paper

AI Data Centers Are Doing More Harm Than Just Driving Up Utility Prices AI data centers are booming as nations invest billions to dominate artificial intelligence, but their relentless energy use drives up local electricity bills, inflates consumer prices, and harms the environment through noise, water demand, and pollution. BGR

The Tech Download: Data centers become military targets as Iran war rages on Iranian drone strikes hit AWS data centers in the UAE, disrupting banking, payments, and consumer services. Companies scrambled to migrate servers, restoring many apps, but the attacks highlight data centers' rising status as strategic, targeted infrastructure. CNBC

Sponsor SMT Line Builder Tool – Fast & Easy Skip the guesswork. Our SMT Line Builder gives you instant, expert-recommended setups based on your budget and output. Or send us your BOM—we'll handle it. Manncorp Inc.

India's PC Market Records Its Strongest-Ever Year, Shipping 15.9 Million Units India's traditional PC market hit a record 15.9M units in 2025, up 10.2% YoY, led by notebooks (+12.4%) and booming AI-enabled models (+129.3%). Enterprise demand drove growth, with HP, Lenovo, and Dell leading, while rising component costs may temper 2026 expansion. IDC