circuitnet
Sponsor
Circuit Technology Center
40+ Years of PCB Repair Expertise
CircuitMedic provides circuit board repair kits, tools and materials developed from decades of hands-on PCB repair experience. Find the right solution for your repair needs.
Circuit Technology Center
Ask the Experts
Reduce Glare During Assembly
We have a problem with excessive glare during hand assembly operations, particularly when placing components by hand, and inserting and soldering wires ...
Responses by:
Rodney Miller
Capital Equipment Operations Manager, Specialty Coating Systems
Robert "Bob" Lazzara
President, Circuit Connect, Inc.
Fritz Byle
Process Engineer, Astronautics
How To Rework SMT Connector with Center Ground Strip
Two Year Component Date Code Mandate
IPC SOIC Defect Question
OA Flux Turning Blue
Conformal Coating Over No-Clean Flux
MORE ASK THE EXPERTS
SMTA Mexico October 8
Sponsor
Circuit Technology Center
Salvage Valuable Electronic Components
Our component salvage and reclaim services can recover valuable BGAs, QFPs, connectors, through controlled removal, cleaning, reballing, and inspection.
Circuit Technology Center
Industry Calendar
Oct 1, 2026: Long Island Expo & Tech Forum
Oct 7, 2026: Guadalajara Expo & Tech Forum
Oct 25, 2026: SMTA International Conference & Exposition
Oct 27, 2026: NEPCON ASIA 2026
Apr 5, 2027: APEX EXPO 2027
FULL INDUSTRY CALENDAR
EOS/ESD Symposium
Sponsor
SEHO Systems GmbH
SEHO makes production lines smarter
Improve your work flow and reduce manufacturing costs with creative ideas and innovative solutions for automation, board handling and material management.
SEHO Systems GmbH
What Year Was It?
The day was Sep 14. What year was it?
McKinley Dies From Gunshot Wounds
What Year
U.S. President William McKinley dies after being shot by a deranged anarchist during the Pan-American Exposition in Buffalo, New York.
See the answer below.
Sponsor
EOS/ESD Association
Reimagined EOS/ESD Symposium 2026
Experience the enhanced EOS/ESD Symposium with expanded learning, collaboration, and industry connections. Join experts exploring challenges and solutions in EOS/ESD control. September 28-30.
EOS/ESD Association
Counterfeit Detection blue
What Year Was It Answer
McKinley Dies From Gunshot Wounds
Answer: September 14, 1901
Sep 14, 2026
image
Anthropic CEO Amodei Calls for AI Slowdown
Anthropic CEO Dario Amodei urged AI companies to slow development of advanced systems, citing growing safety risks. OpenAI's Sam Altman and Elon Musk supported his call as researchers warn that increasingly autonomous AI agents could cause widespread harm.
Taipei Times
Sponsor
Ormet TLPS
AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
OpenAI will not go public this year: CEO Sam Altman
OpenAI CEO Sam Altman ruled out an IPO in 2026, saying AI safety concerns require greater attention. He warned that even a small extinction risk demands action from companies and governments, prioritizing safety and alignment over profits.
Taipei Times
The Drawbacks of Internal Recycling Systems for Solder Dross
This paper examines the risks and hidden costs of in-house solder dross recycling, highlighting contamination, compliance, quality, safety, and economic challenges that often outweigh perceived savings.
Technical Paper
Tech companies must be primarily responsible for AI safety, Mike Johnson says
House Speaker Mike Johnson backed discussions with AI leaders but opposed a development moratorium, citing competition with China. Lawmakers remain divided as tech executives and researchers warn of serious risks, while Democrats demand stronger government oversight.
Politico
Sponsor
Viscom
Discover the power of vAI ProVision from Viscom
Create and optimize 3D AOI and AXI programs in minutes. vAI ProVision boosts inspection depth, quality, and speed. Viscom develops & produces premium inspection systems.
Viscom
The iPhone Duo's best feature isn't the fold, it's the software built around it
Apple's iPhone Duo redefines foldable smartphones through highly refined software, optimized apps, and thoughtful design details. Despite being slightly heavier and pricier than Samsung's Z Fold 8, its minimal crease and polished experience could accelerate foldable adoption.
TechSpot
Solder Pallets With Titanium Inserts - Yes/No?
Our pallet manufacturer recommends titanium inserts to allow larger apertures near closely spaced surface mount components. Are they worth it?
Board Talk
Technical Papers

Oxide Reduction for Reliable Electronics Manufacturing
UHDI Fabrication for IC Substrates: SAP and mSAP Processes
Flux-Free, Reliable, Efficient: Soldering with Formic Acid
Redesigning Material Logistics for High-Mix EMS Production
Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education
Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse
Digital Warehouse Automation in High-Mix PCB Assembly
MORE TECHNICAL PAPERS
Sponsor
Summit Interconnect
Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect
OpenAI rules out IPO this year as Altman, Musk & Amodei warn AI is moving too fast
OpenAI CEO Sam Altman says the company will delay its IPO until at least 2027, citing AI safety concerns. Anthropic's Dario Amodei urged slower development, winning support from Altman and Elon Musk as regulatory pressure intensifies.
CNBC
Why data centers could be the next big market for catastrophe bonds
The rapid expansion of hyperscale data centers is creating massive insurance exposures that traditional markets may struggle to absorb. Catastrophe bonds could transfer natural disaster risks to investors, with dedicated data center deals potentially emerging within 12 to 18 months.
CNBC
Cross-Sectioning of SMT and PCB Related Architectures
Techniques in performing precision and analytical micro-sections, which fuse the techniques common in preparation of silicon wafers and bulk materials are discussed.
Technical Paper
Sponsor
AIM Solder
Reduce Significantly your Silver Costs Now!
REL61TM lead-free alloy is a proven alloy that slashes silver costs. Get better thermal stability and lower overhead with AIM's local technical support.
AIM Solder
Worldwide External Enterprise Storage Systems Market Grows 33.6% in the Second Quarter of 2026, Extending Its Strongest Growth Run in Years, according to IDC
Enterprise storage revenue hit $10.3B in 2Q26, up 33.6% year over year as AI deployments, deferred refreshes and pre-buying drove demand. All-flash arrays led growth, while high-end systems surged 90.6% amid tight NAND and DRAM supply costs.
IDC
iOS 27 Review: AI Finally Takes Over The iPhone
Apple's iOS 27 delivers a polished Liquid Glass design, faster app performance, improved reliability, and major Siri AI upgrades. The update enhances productivity, translation, scheduling, and app compatibility while supporting Apple's new foldable iPhone Duo.
BGR
Applying Lean Philosophies to Supply Chain Management in EMS
A mid-tier EMS company's look at their use of technology, philosophy and partnerships to optimize its systems and facilitate growth.
Technical Paper
Sponsor
BEST Inc.
Salvaging Electronic Components: Ensuring Economic Reuse
Component salvaging provides a reliable and consistent method of harvesting electronic components, reducing electronic waste, minimizing fabrication of new components, and ensuring economic reuse for automated assembly.
BEST Inc.
You are never too old to learn new things
Retirees can overcome technology fears by embracing AI and smart-home tools through hands-on learning. Starting small, accepting mistakes and receiving guidance builds confidence, independence and convenience, proving that willingness to learn matters more than age.
Taipei Times
Should Standards Trump Innovation?
Impinj's Gen2X extensions push RAIN RFID beyond Gen2, boosting range, efficiency, accuracy and reliability while maintaining compatibility. Growing adoption shows Standards+ innovations can expand RFID applications and shape future standards.
EE Times
Sponsor
Ormet TLPS
AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
Trump dismisses AI extinction risks as more than a dozen OpenAI, Anthropic insiders call for a slowdown
Trump dismissed fears that AI could cause human extinction, prioritizing U.S. dominance over China. His remarks followed warnings from Anthropic and OpenAI researchers about rapid AI advances, recursive self-improvement risks, and growing calls for stronger safety oversight.
CNBC
Effect of Encapsulation Materials on Tensile Stress
In this paper FEA modeling was performed to observe stress-strain behavior of solder joints during thermal expansion for various potting materials.
Technical Paper
Maybe You're Not Supposed to Reach Your Full Potential. Here's What You Should Ask Instead.
The word "potential" often carries heavy expectations, making people anxious about living up to others’ perceptions. Constant reminders about unrealized potential can create pressure, turning encouragement into a source of self-doubt rather than motivation.
Entrepreneur
Why fears of AI self-improvement are causing 'existential' concerns at Anthropic and OpenAI
Anthropic and OpenAI researchers warn that recursive self-improvement could rapidly accelerate AI capabilities, erode human control and increase catastrophic risks. Experts question whether alignment can keep increasingly autonomous systems safe.
CNBC
Sponsor
Advanced Interconnections Corp.
Need Improved Solder Joint Visibility?
Solder Peel-A-Way® Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
Apple's foldable arrives late to a supply chain already moving on
Apple's launch of the iPhone Duo marks its entry into foldable smartphones, potentially expanding the market and increasing component prices. However, Taiwanese suppliers now see foldables as a secondary growth opportunity rather than their primary focus.
Digitimes
Today's Sponsor
Sponsor
Sponsor
SCHUNK
What are your economic depaneling needs?
Our depaneling machines are high-performance machines for single circuit boards with electronic components. The cutting principles are fast, the best quality.
SCHUNK
Test Your Knowledge
Which US organisation's headquarters is situated in Langley, Virginia?
See answer below.
Industry Press
Indium Corporation Promotes Damian Santhanasamy to Global Accounts Manager
With its commitment to innovation and growth through employee development, Indium Corporation® is pleased to announce the promotion of Damian Santhanasamy ...
Indium Corporation
TM Soldering Solutions Announces New Configurable Options for the PHOENIX Selective Soldering Platform
TM Soldering Solutions (TMSS) announces the availability of several new configurable options for the Phoenix Selective Soldering platform. These new options include ...
TM Soldering Solutions
Seika Machinery Announces Limited-Time Inventory Sale
Seika Machinery, Inc. is offering special inventory-sale pricing on select SAWA ultrasonic stencil cleaners and McDry MCU-201A humidity-controlled storage cabinets. ...
Seika Machinery, Inc.
1CLICKSMT Highlights Hipri Stencil Printers & HiFlow Reflow Ovens for SMT Production
1CLICKSMT Technology Co., Ltd. is highlighting two key areas of its SMT equipment portfolio: the Hipri series of fully automatic stencil printers and the HiFlow ...
1 Click SMT Technology Co., ltd.
SolderKing Celebrates Eight Years of Growth
SolderKing is celebrating eight years as a manufacturer of soldering consumables this month. Established in Yorkshire in 2018, the company has grown into a King's Award ...
SolderKing
Coherix Sets New Standard for Safety-Critical Adhesive Dispensing
Coherix has developed an industry-first system that continuously inspects and automatically adjusts adhesive application during automotive windshield and battery ...
Coherix
Littelfuse Expands Omnipolar TMR Switch Family with Leaded TO-92 Package Option
Littelfuse, Inc. announced the TX00AT314AMA Omnipolar TMR Switch Sensor, the latest addition to the TX00 TMR Switch family. The TX00AT314AMA delivers the same ...
Littelfuse, Inc.
MORE INDUSTRY PRESS
10072 EP3HTS-LO
Sponsor
Air-Vac Engineering
Large Component SMT Rework & Repair
A Rework System developed to address the increasing size, complexity, and thermal demands of Advanced Electronic Assemblies.
Air-Vac Engineering
Quote of the Day
"We are currently not planning on conquering the world."
Sergey Brin, Google co-founder
Sponsor
Glenbrook Technologies
Counterfeit Components Identified With X-ray Inspection
Automated component sourcing and procurement platform relies on real-time X-ray inspection to remove counterfeit components from supply chain.
Glenbrook Technologies
Die Module Attach (static)
Cartoon of the Day
Cartoon
"If you can figure out the words in a text message, you can figure out the words in Chaucer."
Copyright © Randy Glasbergen
Sponsor
AI Technology, Inc.
AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives
240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity.
AI Technology, Inc.
How tough is your vapor phase profiling solution?
Test Your Knowledge Answer
Which US organisation's headquarters is situated in Langley, Virginia?
Answer: The CIA