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Paul J. Koep
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Global Product Manager
Alpha
Mr. Koep is responsible for product planning and technical marketing for the Preform Products at Alpha. He is the co-author of several patents in the areas of soldering applications focusing on reflow and alternative methods.

Paul J. Koep has submitted responses to the following questions.
MSD Components Baked Too Long
I really don't see an issue here. Moisture sensitive product can be baked out more than once, so the accumulated ...
Pick Performance for SMT Placement Machines
There a number of factors involved in pick performance, which is basically the success rate of picking a part out ...
Through Hole Connector Solder Joint Hole Fill
An x-ray can be used to periodically ensure hole fill. If top side hole fill is used, then there is ...
Trouble Soldering a PC104 Connector
Alpha is a solder materials supplier and we offer solder preforms.  We have worked with PC104 connectors and have successfully ...
Insufficient Barrel Fill on Through-hole Components
I am sure you will get plenty of practical advise from wave soldering experts. One thing I would like to ...
Can Solder Joint Geometry Change Resistance?
If the solder joint is in the thermal path of the device, and the solder joint thickness varies by a ...
Insufficient Plated Hole Fill with Electrolytic Capacitors
The challenging part about wave soldering electrolytic capacitors is that this cap type is a power supply filter, so the ...
Problems With Wave Solder Lead Bridging
There is a growing trend to reflow solder through hole devices using solder paste and, if additional solder volume is ...
Lifted Leads on QFP
The lifted leads may very well be a lack of perfect planarity of the leads, in that all the leads ...
Solder Fillet Peaks
It is possible that the robotic soldering device is focusing the heat in a very localized point. Since solder tends ...
Recommendation for PCB Surface Finish
Conversion to OSP should not be a problem for the existing SnPb process due to the superior wetting of Pb ...
Problems with Insufficient Barrel Fill
There are a number of factors that often combine to cause this problem. First, there is usually a significant temperature ...
Most Difficult Components to Hand Solder
Multi-row connectors with long pins, i.e. PC-104. ...
Tombstoning Dilemma
The cause of this defect is inadequate contact surface area of the component metalized pads in the solder paste. This ...
Pin-In-Paste Hole Fill
There are numerous tradeoffs to consider when pin in paste hole fill is the goal. First, overprinting can be problematic ...
Reworked BGA Component Bridging at the Corners
Alpha has introduced a product to mitigate corner ball shorting on BGA devices. It is a TrueHeightTM Spacer, which is ...