Paul J. Koep
Global Product Manager
Mr. Koep is responsible for product planning and technical marketing for the Preform Products at Alpha. He is the co-author of several patents in the areas of soldering applications focusing on reflow and alternative methods.
Paul J. Koep has submitted responses to the following questions.
MSD Components Baked Too Long
I really don't see an issue here. Moisture sensitive product can be baked out more than once, so the accumulated ...
Trouble Soldering a PC104 Connector
Alpha is a soldermaterials supplier and we offer solder preforms. We have worked withPC104 connectors and have successfully helped customers ...
Lifted Leads on QFP
The lifted leads may very well be a lack of perfect planarity of the leads, in that all the leads ...
Solder Fillet Peaks
It is possible that the robotic soldering device is focusing the heat in a very localized point. Since solder tends ...
The cause of this defect is inadequate contact surface area of the component metalized pads in the solder paste.
Pin-In-Paste Hole Fill
There are numerous tradeoffs to consider when pin in paste hole fill is the goal. First, overprinting can be problematic ...