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Keshava Murthy
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Process Engineer
Bosch Automotive Electronics India Ltd.
Keshava Murthy is a Process Engineer in the PCB assembly industry working in Bangalore, India.

Keshava Murthy has submitted responses to the following questions.
Mixed Technology - Which First
First should be SMT, then we have to go for THT using Selective Soldering or Wave Soldering. There are a ...
3D Solder Paste Inspection
I have 5 years of experience in using 3D SPI, there are two Possible methods of 3D SPI Installation 3D- Inline: ...
Unusual Component Lead Contamination
There are two strong influceces for this type of defects, Incoming material qualitly: Check the component terminal in flurosence X-Ray ...
Cold Solder Joints on 0603 Components
Yes, We call it as Solder Paste Management, its an very important factor for Solder joints. ...
ESD Protection
I need some more inputs : non-grounded racks are metal? Do you have the ESD Floor? If your answer is ...
BGA Pad Lifting
My Opinion: I suggest on preventing the Pad lift not the repair ...
Stencil Tension
Yes it is good to have a tension meter in the SMT Assembly area to check the stencil in good ...