Principal Product Engineer
Benchmark Electronics, Inc.
27 years experience working with electronic and electro-mechanical manufacturing and design (medical, automotive, military, computer, and industrial controls). Military veteran - served as a Combat Engineer with the United States Marine Corps.
Rick Kompelien has submitted responses to the following questions.
Competing Reflow Oven Zones
You will want to start by getting the recommended thermal profile for the solder paste you have selected. You should ...
Exposed Copper Defect
That would depend on where the copper is exposed. Some component types normally have exposed copper where the packages are ...
BGA reballing question
In my opinion, the additional thermal cycle would have much more negative impact to the BGA than would the residual ...