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Mitch Holtzer
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Global Director of Customer Technical Support
Alpha Assembly Solutions
As the Global Director of Customer Technical Service (CTS) for Alpha, Mitch sets direction and provides coordination for the Alpha CTS group in a global capacity. A major focus of this position is to provide strategic support to OEM, CEM and Automotive customers and target accounts. Mitch joined Alpha in 1998 and has progressed through positions of increasing responsibilities in Marketing, Product Management and R&D. He is a graduate of Purdue University with a degree in Chemistry and holds an MBA from Temple University.

Mitch Holtzer has submitted responses to the following questions.
Using Solder Paste Beyond the Expiration Date
Good question. When solder paste ages beyond its useful life it it usually due to a viscosity increase that makes ...
Concerns With Silver Finish Component Leads
The silver will quickly alloy with the tin in the lead free alloy, but you will not have the same ...
Selective Solder System Purchased At Auction
Drain or ladle as much of the tin lead solder as you can from the machine. Fill it with chunks ...
Solder Splashes During Wave Soldering
From the information given, two potential causes need to be ruled out. If there is residual liquid flux (alcohol or ...
Solder Paste Mixing
Mixing solder paste in a centrifuge can cause flux and other ingredients to separate from powder particles and is not ...
Reusing recovered solder paste
It is not advisable to re-use solder paste once it is removed from the stencil. The paste can be stored ...
Dust contamination after selective soldering
Are you using a dross recycling system? Our testing shows that the alloy produced from an in house dross recovery ...
Mixed Process Solder Joint Appearance, Smooth or Grainy?
The ROHS compliant finish on your component leads is most likely tin.  The relative amount of tin that becomes part ...
Environment Impact on Assembly, Printing and Reflow
If you have an open tray of paste or flux, used for a package on package application, particle build up ...
0201 Pick & Place Nozzle Plugging
It's quite possible that the .004" thick (100 micron) will have higher print transfer efficiency and leave as much or ...
Viscosity of Solder Paste Before Printing
Viscosity is a complicated issue with regards to solder paste.  Solder paste is usually a shear thinning material, meaning the ...
QFN Test Failures Caused by Flux
The first question is whether or not the failure is a bridge between two adjacent I.O. s, or an open ...