Ask the Experts
February 20, 2013
Unusual Solder Appearance
We are observing an odd surface texture on solder joints after reflow. The reflow oven that we are using isa BT300NCP (MannCorp) and the solder is indium 3.2 SAC305 Type4.
We havetried multiple types of profiles to attempt to alleviate but with no success.Do you know what could cause this effect?
Expert Panel Responses
Surface effects with lead-free SAC305 can be normal. SAC305 isprone to micro-fissuring during cool down. Joints could look at times more reflective to dull, some frosty,some not. Often surface conditions are purely cosmetic and can be causedby several factors listed below.
Although the solder surface looks frosty, dull or has shrinkageeffects it may not necessarily indicate a reliability issue. The solder joint may be good with excellent intermetallicbonding. If in doubt pull/shear testing can be done and cross-sectional studiesto examine the bond layers.
- Thermalprofile used especially TAL, peak temperature and cool down rate.
- Metalfinishes of the parts that were soldered, some dissolution occurs which canimpart color and frosty surfaces to the joints.
- Reflowatmosphere if air or nitrogen, will impact the cosmetics of the solder surface.
- Physical/chemicalproperties of the flux itself. Some fluxes react more with the solder surfacethan others.
- Flowproperties of the flux during the reflow process, some fluxes flow away morerapidly than others, giving a longer exposure to oxygen.
- Excessiveoxidation of the parts to be soldered may impact the surface also.
- PowderType, oxidation of the powder, shelf life of the paste, how the paste washandled prior to use, all may impact solder surface.
Senior Market Development Engineer
Mr. Biocca was a chemist with many years experience in soldering technologies. He presented around the world in matters relating to process optimization and assembly. He was the author of many technical papers delivered globally. Mr. Biocca was a respected mentor in the electronics industry. He passed away in November, 2014.
The appearanceof the solder joint is dependent upon many variables, therefore many questionsneed to be asked relative to the appearance of that particular solder joint.
My firstthought is the solderability of the solder paste. Has this been conducted? Secondly
As can bededuced I'm leaning towards a thermal issue. The reflow time is too short andpoor reflow occurred, the molten time is too long, so alloy separation occurredwith the molten metal.
Thirdly, myinvestigation would revolve around the plating on the board and contaminationor compatibility would be looked at, and then I would also look at the componentplating and its compatibility with the solder paste alloy. Sometimes it is notas simple as it looks and more complex than anticipated.
- Doall the joints have this appearance?
- Dosome of the joints have this appearance?
- Isthere additional conductors tied to this particular connection causing a heatsinking effect?
- Isthere any large components in the vicinity of this component which could impactthe air flow to the solder joint?
- Ifthe thermal profile consistent across the entire board?
- Isthis condition on the first side of the board to be soldered?
- Isthis condition on the second side of the board to be soldered?
Vice President, Technical Director
At EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee.
It'shard to say based on the photo. I see what appears to be two possible thingsoccurring, Stress lines in the joint and component finish dissolution. I'lladdress the stress lines first.
There are several things to check/compare. You can rule out the variables tohone in on the problem. Some process questions I'd pursue are:Does this only occur withone assembly, one joint / component finish or one paste type? Is this common to only oneboard finish? Are there any surfacecontaminates on the board prior to pasting / reflow? Is this a No Clean flux lefton the joint? If so try removing the flux and inspect the joint finish.You may find that the joint is actually acceptable.
Someother possibilities are that you may be above lliquidous too long, cooling toofast or there may be board movement during the reflow process, while the jointis cooling. All of these can contribute to joint appearance and integrity.
You mayhave a poor finish on your component termination. In some cases componentterminations may either have minimal metalization needed to form a joint. Oftenthe metal that is present will leach into the rest of the solder joint. Thislooks like what may be the case based on the color difference on the top ofyour component where there is less solder.
To ;rule out component finish problems you canstart with solderability tests. In some cases the termination may disappearleaving only the ceramic, if this is a chip. If the part passes solderabilitytests then the part is probably not the problem.
If suspect then you can havethe termination / plating evaluated at a lab which will tell you if there areproblems with the base metal, contamination, composition etc.Once all variables have been ruled out you should be able to pinpoint theproblem.
Sr. Manufacturing Engineer
TransCore Amtech Technology Center
Mr. Culpepper has over 20 years in electronic manufacturing, primarily focusing on PWA assembly.