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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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Storage Solutions – Free Online Demo
Our online demos give our clients a deep insight into our solutions, allowing them to interact with an expert and have their questions answered throughout. Discover our technology wherever you are.
Essegi Automation
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Ask the Experts Member |
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Robert Culpepper
Sr. Manufacturing Engineer
TransCore Amtech Technology Center
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Mr. Culpepper has over 20 years in electronic manufacturing, primarily focusing on PWA assembly.
Robert Culpepper has submitted responses to the following questions.
Unusual Solder Appearance
It'shard to say based on the photo. I see what appears to be two possible things occurring, Stress lines in ...
Component Shift During Reflow
Several factors can cause component shifting during the reflow process. When dealing solely with the SMT process, contributing factors to ...
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Reinforce Critical Components on PCBs
Low modulus wire tacking & ruggedizing adhesives hold vital BGAs & VGAs in place, enhancing shock & vibration resistance of electronic assemblies.
Dymax
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