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Robert Culpepper


Sr. Manufacturing Engineer
TransCore Amtech Technology Center

Mr. Culpepper has over 20 years in electronic manufacturing, primarily focusing on PWA assembly.

Robert Culpepper has submitted responses to the following questions.
Unusual Solder Appearance
It'shard to say based on the photo. I see what appears to be two possible things occurring, Stress lines in ...
Component Shift During Reflow
Several factors can cause component shifting during the reflow process. When dealing solely with the SMT process, contributing factors to ...
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Zestron

Is your PCB surface finish surviving the wash?
Aqueous cleaning can stain or strip ImSn, ImAg & ENIG finishes. Get test data on protecting surface finish integrity post-reflow.
ZESTRON Americas
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