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One Component, Fast Curing Epoxy
Master Bond EP4EN-80 is a NASA low outgassing approved adhesive for potting and encapsulation. It cures at 80°C and features thermal conductivity and electrical insulation.
Master Bond
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Ask the Experts Member |
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Robert Culpepper
Sr. Manufacturing Engineer
TransCore Amtech Technology Center
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Mr. Culpepper has over 20 years in electronic manufacturing, primarily focusing on PWA assembly.
Robert Culpepper has submitted responses to the following questions.
Unusual Solder Appearance
It'shard to say based on the photo. I see what appears to be two possible things occurring, Stress lines in ...
Component Shift During Reflow
Several factors can cause component shifting during the reflow process. When dealing solely with the SMT process, contributing factors to ...
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The Smart Alternative to SAC305
Get the cost benefits of a low-silver solution without sacrificing quality. REL61 surpasses SAC305 in key tests like AOI performance—making it the smart choice for your operations.
AIM Solder
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