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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
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Ask the Experts Member |
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Robert Culpepper
Sr. Manufacturing Engineer
TransCore Amtech Technology Center
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Mr. Culpepper has over 20 years in electronic manufacturing, primarily focusing on PWA assembly.
Robert Culpepper has submitted responses to the following questions.
Unusual Solder Appearance
It'shard to say based on the photo. I see what appears to be two possible things occurring, Stress lines in ...
Component Shift During Reflow
Several factors can cause component shifting during the reflow process. When dealing solely with the SMT process, contributing factors to ...
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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated
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