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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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Ask the Experts Member |
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Robert Culpepper
Sr. Manufacturing Engineer
TransCore Amtech Technology Center
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Mr. Culpepper has over 20 years in electronic manufacturing, primarily focusing on PWA assembly.
Robert Culpepper has submitted responses to the following questions.
Unusual Solder Appearance
It'shard to say based on the photo. I see what appears to be two possible things occurring, Stress lines in ...
Component Shift During Reflow
Several factors can cause component shifting during the reflow process. When dealing solely with the SMT process, contributing factors to ...
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
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