| Sponsor |
|
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
|
|
| Ask the Experts |
|
|
February 10, 2010 - Updated
February 8, 2010 - Originally Posted
Reflow Rules for Mixed FR4 and Flex
We have a new PCB assembly that includes a section of flex cable as part of the FR4 circuit board.
What are the reflow rules I need to consider while processing a mixed FR4 and flex cable assembly through reflow process?
S. J.
|
| Expert Panel Responses |
You can not process the reflow soldering both FR4 pcb and flexible cable together since the flexible cable melt in reflow oven.
The reflow cable can not withstand at reflow temp i.e 240 degree centigrade for leaded solering and 250 degree centigrade for leadfree soldering process.
Sandip Thakor
Quality Engineer
Matrix Telecom Solution P Ltd
Sandip Thakor has 9 years of experience in electronics industry specializing in soldering technology. Thakor has experience in lead free installation, process optimization and developing quality standards.
|
|
Submit A Comment
|
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
|
|
|
