| Sponsor |
|
AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
|
|
| Sponsor |
|
Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond
|
|
| Ask the Experts |
|
|
May 5, 2008 - Updated
May 5, 2008 - Originally Posted
Stencil Apertures and Board Finish Requirements
Is there any reason to alter apertures on stencils if board finishes change from ENIG to OSP?
R.W.
|
| Expert Panel Responses |
As long as no other process variables are changed, i.e. solderpaste type, reflow oven profile, etc,the wettability of ENIG and OSP finishes are very similar. There is no compelling reason to alter the stencil apertures.
However, if one is switching from lead-based solderpaste to lead-free paste, stencil apertures should be altered. Lead-free solderpaste does not wet as well to ENIG or OSP finishes and require additional flux for proper wetting. In this case, apertures are increased to provide additional solderpaste volume.
If you need any additional information, please feel free to contact me.
Robert Dervaes
V.P. Technology & Engineering
Fine Line Stencil, Inc.
Robert Dervaes has worked in the electronics industry since 1992 in both design and manufacturing. Over the past 11 years he has established the technical foundation of Fine Line Stencil, Inc. - a premier stencil supplier to the electronics industry.
|
|
Submit A Comment
|
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
|
|
|
